Package device

• US 10,068,826 B2
• Filed: 10/26/2016
• Issued: 09/04/2018
• Est. Priority Date: 06/29/2016
• Status: Active Grant

• Current Assignee: Shangyou Jiayi Lighting Products Co., Ltd.
• Original Assignee: Guangzhou Kongyi Metal Product Company Limited
• Inventors: He, Yaowen
• Primary Examiner(s): Picardat, Kevin M
• Application Number:
  US15/334,393
• Publication Number:
  US 20180005913A1
• Time in Patent Office: 678 Days
• Field of Search: 257702
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/053 the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/145 Organic substrates, e.g. plastic
• CPC Class Codes: H01L 23/32 Holders for supporting the complete device in operation, i.e. detachable fixtures H01L23/40 takes precedence
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15151 the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 33/0033 having Schottky barriers
• CPC Class Codes: H01L 33/486 adapted for surface mounting

Abstract

Provided is a package device, relating to the technical field of lamp beads. The package device comprises an SMD holder, wherein the SMD holder is a hollow housing with one end opened; and the material of sidewalls of the SMD holder is transparent plastic. In the package device provided by the present invention, a transparent material is provided as the material of the sidewalls of the SMD holder, and light generated after a chip is powered on can be partially transmitted out through the sidewalls of the SMD holder, avoiding blocking of the light generated after the chip is powered on by the sidewalls of the SMD holder, thereby increasing transmittance of light from the chip.

Claims

1. A package device, comprising an SMD holder;

wherein the SMD holder is a hollow housing with one end opened; and

the material of sidewalls of the SMD holder is transparent plastic;

the package device further comprising a chip;

wherein a first function area, an insulation area, and a second function area are provided sequentially on an end surface of a closed end of the SMD holder;

the chip is provided in the SMD holder and located on the first function area or the insulation chip;

the chip is electrically connected to the first function area and the second function area, respectively; and

an area ratio of the first function area, the insulation area, and the second function area is 1˜

5;

1;

1.

2. The package device according to claim 1, wherein the first function area is provided with a through hole, and the chip is fixed in the through hole.

3. The package device according to claim 1, wherein the material of the insulation area is transparent plastic.

4. The package device according to claim 1, wherein the material of the insulation area is transparent plastic, and the chip is fixed on the insulation area.

5. The package device according to claim 1, wherein inner walls of the SMD holder are provided with base coating.

6. The package device according to claim 1, wherein the chip is provided thereon with fluorescent powder.

7. The package device according to claim 1, wherein the first function area, the insulation area, and the second function area are connected integrally.

8. The package device according to claim 1, wherein the sidewalls of the SMD holder are connected integrally to the closed end of the SMD holder.

9. The package device according to claim 2, wherein the sidewalls of the SMD holder are connected integrally to the closed end of the SMD holder.

10. The package device according to claim 3, wherein the sidewalls of the SMD holder are connected integrally to the closed end of the SMD holder.

11. The package device according to claim 4, wherein the sidewalls of the SMD holder are connected integrally to the closed end of the SMD holder.

12. The package device according to claim 5, wherein the sidewalls of the SMD holder are connected integrally to a closed end of the SMD holder.

13. The package device according to claim 6, wherein the sidewalls of the SMD holder are connected integrally to a closed end of the SMD holder.

14. The package device according to claim 2, wherein the first function area, the insulation area, and the second function area are connected integrally.