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Package device

  • US 10,068,826 B2
  • Filed: 10/26/2016
  • Issued: 09/04/2018
  • Est. Priority Date: 06/29/2016
  • Status: Active Grant
First Claim
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1. A package device, comprising an SMD holder;

  • wherein the SMD holder is a hollow housing with one end opened; and

    the material of sidewalls of the SMD holder is transparent plastic;

    the package device further comprising a chip;

    wherein a first function area, an insulation area, and a second function area are provided sequentially on an end surface of a closed end of the SMD holder;

    the chip is provided in the SMD holder and located on the first function area or the insulation chip;

    the chip is electrically connected to the first function area and the second function area, respectively; and

    an area ratio of the first function area, the insulation area, and the second function area is 1˜

    5;

    1;

    1.

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