System and method for utilizing digital micromirror devices to split and recombine a signal image to enable heat dissipation

• US 10,069,996 B2
• Filed: 09/15/2016
• Issued: 09/04/2018
• Est. Priority Date: 09/15/2016
• Status: Active Grant

• Current Assignee: Xerox Corporation (Xerox Holdings Corp.)
• Original Assignee: Xerox Corporation (Xerox Holdings Corp.)
• Inventors: Adiletta, Mark A., Atwood, Christopher D., Dergham, Ali R., Leighton, Roger G., Zirilli, Francisco
• Primary Examiner(s): Persaud, Deoram
• Application Number:
  US15/266,041
• Publication Number:
  US 20180077311A1
• Time in Patent Office: 719 Days
• CPC Class Codes: B41M 1/06 Lithographic printing
• CPC Class Codes: G02B 26/0833 the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD G02B26/0825 takes precedence; micromechanical devices in general B81B
• CPC Class Codes: G02B 27/106 for splitting or combining a plurality of identical beams or images, e.g. image replication
• CPC Class Codes: G02B 27/126 The splitting element being a prism or prismatic array, including systems based on total internal reflection
• CPC Class Codes: G02B 27/143 using macroscopically faceted or segmented reflective surfaces
• CPC Class Codes: H04N 1/00891 Switching on or off, e.g. for saving power when not in use H04N1/00896 takes precedence
• CPC Class Codes: H04N 1/00978 Temperature control
• CPC Class Codes: H04N 1/02825 in combination with at least one reflector which is fixed in relation to the light source H04N1/02835 and H04N1/0284 take precedence
• CPC Class Codes: H04N 1/02895 Additional elements in the illumination means or cooperating with the illumination means, e.g. filters H04N1/02885 takes precedence; optical elements other than lenses per se G02B5/00
• CPC Class Codes: H04N 1/06 using cylindrical picture-bearing surfaces , i.e. scanning a main-scanning line substantially perpendicular to the axis and lying in a curved cylindrical surface

Abstract

In an example embodiment, an image processing system can be implemented, which includes a printing surface and a prism that splits light from an input light source into two parallel light beams indicative of a signal image. Two or more DMDs (Digital Micromirror Devices) can be utilized, wherein the two parallel light beams are directed to the DMDs for image processing, such that as the two parallel light beams are reflected out onto the printing surface, the two parallel light beams are recombined into a single image, thereby enabling heat dissipation while “stitching” said output of said at least two digital micromirror devices to a usable video path.

Claims

1. An image processing system, comprising:

a printing surface;

a prism that splits light from an input light source into two parallel light beams indicative of a signal image; and

at least two digital micromirror devices, wherein each of said at least two digital micromirror devices comprises at least one signal processor and an optical semiconductor component that includes on a surface thereof a plurality of microscopic mirrors arranged in an array corresponding to pixels in an image to be displayed and a bezel, said array comprising at least two laser diode arrays wherein at least one of said at least two laser diode arrays comprises at least one imaging diode array and at least one other of said at least two laser diode arrays comprises at least one preheat laser diode array, wherein said two parallel light beams are directed to said at least two digital micromirror devices for image processing, such that as said two parallel light beams are reflected out onto said printing surface, said two parallel light beams are recombined into a single image, thereby enabling heat dissipation while stitching said two parallel beams of said at least two digital micromirror devices to a usable video path.

2. The system of claim 1 further comprising a processor that provides instructions for said stitching of said two parallel beams back to said single image.

3. The system of claim 2 wherein said processor comprises a CPU (Central Processing Unit) of a data-processing apparatus.

4. The system of claim 3 wherein said at least one signal processor communicates electronically with said at least two digital micromirror devices and with said CPU.

5. The system of claim 2 wherein said each of said at least two digital micromirror devices includes a DMD (Digital Micromirror Device) housing and a DMD epoxy maintained by a DMD assembly and wherein said system further comprises a DMD mirror surface interface upon which said DMD assembly is located.

6. The system of claim 5 wherein said each of said at least two digital micromirror devices is rotatable to an on state or an off state and wherein said system further includes a plurality of DMD cooling lines, a thermistor wire and a cooling block.

7. The system of claim 1 further comprising a plurality of laser diode cooling and electrical lines and wherein said at least two laser diode array is coupled to at least one cooling and electrical line among said plurality of laser diode cooling and electrical lines.

8. The system of claim 7 further comprising a microcontroller that communicates electrically with said at least two digital micromirror devices and said at least one signal processor, wherein each of said at least two digital micromirror devices includes a respective signal among said at least one signal processor and wherein said microcontroller provides control signals to said at least two digital micromirror devices.

9. The system of claim 7 wherein data communications with said at least two micromirror devices and said signal processor is implemented via wireless communications.

10. The system of claim 7 wherein data communications with said at least two micromirror devices and said signal processor is implemented via wired communications.

11. An image processing system, comprising:

a printing surface;

a prism that splits light from an input light source into two parallel light beams indicative of a signal image; and

a processor and at least two digital micromirror devices, wherein each of said at least two digital micromirror devices comprises at least one signal processor among a plurality of signal processors and an optical semiconductor component that includes on a surface thereof a plurality of microscopic mirrors arranged in an array corresponding to pixels in an image to be displayed, said array comprising at least two laser diode arrays wherein at least one of said at least two laser diode arrays comprises at least one imaging diode array and at least one other of said at least two laser diode arrays comprises at least one preheat laser diode array, wherein said two parallel light beams are directed to said at least two digital micromirror devices for image processing, such that as said two parallel light beams are reflected out onto said printing surface, said two parallel light beams are recombined into a single image, thereby enabling heat dissipation while stitching said two parallel beams of said at least two digital micromirror devices to a usable video path, and wherein said processor provides instructions for said stitching of said two parallel beams back to said single image.

12. The system of claim 11 wherein said processor comprises a CPU (Central Processing Unit) of a data-processing apparatus and wherein said processor processes instructions for said stitching of said two parallel beams back to said single image.

13. The system of claim 11 wherein said at least one signal processor communicates electronically with said at least two digital micromirror devices.

14. The system of claim 13 wherein said at least one laser diode array is coupled to at least one cooling and electrical line among a plurality of laser diode cooling and electrical lines and wherein said at least one laser diode array and said at least one preheat laser diode are maintained by a DMD assembly and wherein said system further comprises a DMD mirror surface interface upon which said DMD assembly is located.

15. The system of claim 13 further comprising a microcontroller that communicates electrically with said at least two digital micromirror devices and said at least one signal processor, wherein each of said at least two digital micromirror devices includes a respective signal among said at least one signal processor and wherein said microcontroller provides control signals to said at least two digital micromirror devices and wherein data communications with said at least two micromirror devices and said signal processor is implemented via wireless communications.

16. An image processing method, comprising:

providing a printing surface;

splitting light from an input light source into two parallel light beams indicative of a signal image utilizing a prism; and

directing said two parallel light beams to at least two digital micromirror devices for image processing, wherein each of said at least two digital micromirror devices comprises at least one signal processor and an optical semiconductor component that includes on a surface thereof a plurality of microscopic mirrors arranged in an array corresponding to pixels in an image to be displayed, said array comprising at least two laser diode arrays wherein at least one of said at least two laser diode arrays comprises at least one imaging diode array and at least one other of said at least two laser diode arrays comprises at least one preheat laser diode array, such that said two parallel light beams are reflected out onto said printing surface, said two parallel light beams are recombined into a single image, thereby enabling heat dissipation while stitching said two parallel beams of said at least two digital micromirror devices to a usable video path.

17. The method of claim 16 further comprising processing with said processor, instructions for said stitching of said two parallel beams back to said single image.

18. The method of claim 16 further comprising providing a plurality of DMD cooling lines, a thermistor wire and a cooling block.

19. The method of claim 16 further comprising providing a microcontroller that communicates electrically with said at least two digital micromirror devices and said at least one signal processor, wherein each of said at least two digital micromirror devices includes a respective signal among said at least one signal processor and wherein said microcontroller provides control signals to said at least two digital micromirror devices and wherein said at least one laser diode array is coupled to at least one cooling and electrical line among a plurality of laser diode cooling and electrical lines.

20. The method of claim 19 further comprising:

providing a DMD assembly for maintaining said at least two digital micromirror devices;

configuring a DMD mirror surface interface upon which said DMD assembly is located.