Vector processing architectures for infrared camera electronics
First Claim
1. An infrared imaging system comprising:
- an infrared imaging sensor configured to provide infrared image data comprising a plurality of pixels; and
a main electronics block implemented as a system-on-a-chip (SOC) and comprising;
a sensor interface circuit configured to receive the infrared imaging data from the infrared imaging sensor;
a plurality of vector processors configured to operate in parallel on respective vector arrays, wherein each vector processor of the plurality of vector processors comprises vector functional units configured to selectably provide a number of lanes for processing the respective vector arrays associated with the vector processor; and
at least one local memory communicatively coupled to the plurality of vector processors, the at least one local memory being addressable and directly accessible by the plurality of vector processors to store and access at least a portion of the infrared image data comprising the plurality of pixels;
wherein a first vector processor of the plurality of vector processors is configured to execute a first set of vector instructions on the plurality of pixels and accessed from the at least one local memory to perform one or more operations of a video processing chain for the infrared image data; and
wherein a second vector processor of the plurality of vector processors is configured to execute a second set of vector instructions on the plurality of pixels accessed from the at least one local memory to perform one or more operations of video analytics for the infrared image data, the second set of vector instructions being different from the first set of vector instructions.
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Accused Products
Abstract
Systems and methods are disclosed herein to provide infrared imaging systems with improved electronics architectures. In one embodiment, an infrared imaging system is provided that includes an infrared imaging sensor for capturing infrared image data and a main electronics block for efficiently processing the captured infrared image data. The main electronics block may include a plurality of vector processors each configured to operate on multiple pixels of the infrared image data in parallel to efficiently exploit pixel-level parallelism. Each vector processor may be communicatively coupled to a local memory that provides high bandwidth, low latency access to a portion of the infrared image data for the vector processor to operate on. The main electronics block may also include a general-purpose processor configured to manage data flow to/from the local memories and other system functionalities. The main electronics block may be implemented as a system-on-a-chip.
6 Citations
17 Claims
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1. An infrared imaging system comprising:
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an infrared imaging sensor configured to provide infrared image data comprising a plurality of pixels; and a main electronics block implemented as a system-on-a-chip (SOC) and comprising; a sensor interface circuit configured to receive the infrared imaging data from the infrared imaging sensor; a plurality of vector processors configured to operate in parallel on respective vector arrays, wherein each vector processor of the plurality of vector processors comprises vector functional units configured to selectably provide a number of lanes for processing the respective vector arrays associated with the vector processor; and at least one local memory communicatively coupled to the plurality of vector processors, the at least one local memory being addressable and directly accessible by the plurality of vector processors to store and access at least a portion of the infrared image data comprising the plurality of pixels; wherein a first vector processor of the plurality of vector processors is configured to execute a first set of vector instructions on the plurality of pixels and accessed from the at least one local memory to perform one or more operations of a video processing chain for the infrared image data; and wherein a second vector processor of the plurality of vector processors is configured to execute a second set of vector instructions on the plurality of pixels accessed from the at least one local memory to perform one or more operations of video analytics for the infrared image data, the second set of vector instructions being different from the first set of vector instructions. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of providing infrared images, the method comprising:
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converting received infrared energy into infrared image data comprising a plurality of pixels; receiving the infrared image data at a system-on-a-chip (SOC) via a sensor interface circuit of the SOC, wherein the SOC comprises a plurality of vector processors configured to operate in parallel on respective vector arrays and at least one local memory communicatively coupled to the plurality of vector processors, wherein each vector processor of the plurality of vector processors comprises vector functional units configured to selectably provide a number of lanes for processing the respective vector arrays associated with the vector processor; providing, to at least one vector processor of the plurality of vector processors, the plurality of pixels of the infrared image data by directly addressing and accessing at least a portion of the infrared image data comprising the plurality of pixels from the at least one local memory; executing a first set of vector instructions by a first vector processor of the plurality of vector processors on the plurality of pixels and accessed from the at least one local memory to perform one or more operations of a video processing for the infrared image data; and executing a second set of vector instructions by a second vector processor of the plurality of vector processors on the plurality of pixels accessed from the at least one local memory to perform one or more operations of video analytics for the infrared image data, the second set of vector instructions being different from the first set of vector instructions. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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Specification