Microphone package

• US 10,070,230 B2
• Filed: 12/08/2016
• Issued: 09/04/2018
• Est. Priority Date: 11/20/2012
• Status: Active Grant

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Higashi, Yoshihiro, Fuji, Yoshihiko, Hara, Michiko, Yuzawa, Akiko, Kaji, Shiori, Nagata, Tomohiko, Hori, Akio, Fukuzawa, Hideaki
• Primary Examiner(s): Goins, Davetta W
• Assistant Examiner(s): DABNEY, PHYLESHA LARVINIA
• Application Number:
  US15/373,011
• Publication Number:
  US 20170094419A1
• Time in Patent Office: 635 Days
• Field of Search: 381191, 257684, 73725, 73779, 73772, 29595
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 7/10 comprising superposed layers in contact

Abstract

According to one embodiment, a microphone package includes: a pressure sensing element including a film and a device; and a cover. The film generates strain in response to pressure. The device includes: a first electrode; a second electrode; and a first magnetic layer. The first magnetic layer is provided between the first electrode and the second electrode and has a first magnetization. The cover includes: an upper portion; and a side portion. The side portion is magnetic and provided depending on the first magnetization and the second magnetization.

Claims

1. A microphone sensor comprising:

a substrate;

a cover, a part of the cover comprising a magnetic body;

a film provided between the substrate and the cover; and

an element provided on the film between the substrate and the cover, the element comprising a first magnetic layer, a second magnetic layer, and a non-magnetic layer provided between the first magnetic layer and the second magnetic layer.

2. The microphone sensor according to claim 1, wherein

the part of the cover overlaps the second magnetic layer in a direction of the magnetization of the second magnetic layer.

3. The microphone sensor according to claim 1, wherein

an electrical resistance between the first magnetic layer and the second magnetic layer changes depending on a strain of the film body.

4. The microphone sensor according to claim 1, wherein the element is provided between the film and the cover.

5. The microphone sensor according to claim 1, wherein the part of the cover comprises a part of a side portion of the cover.

6. The microphone sensor according to claim 1, wherein the part of the cover comprises a magnetic material.

7. The microphone sensor according to claim 1, wherein the part of the cover comprises a magnetic particle.

8. The microphone sensor according to claim 7, wherein the part of the cover is formed of a non-magnetic material comprising the particle.

9. The microphone sensor according to claim 8, wherein the non-magnetic material is formed of a resin material.

10. The microphone sensor according to claim 7, wherein the particle comprises at least one selected from the group consisting of nickel, iron, cobalt, nickel oxide, iron oxide, cobalt oxide, nickel nitride, iron nitride, and cobalt nitride.

11. The microphone sensor according to claim 1, wherein the part of the cover comprises a non-magnetic material and a magnetic material provided on the non-magnetic material.

12. The microphone sensor according to claim 11, wherein the magnetic material comprises at least one selected from the group consisting of NiFe alloy, Ni—

Fe—

X alloy, CoZrNb alloy, and FeAlSi alloy, wherein X is Cu, Cr, Ta, Rh, Pt, or Nb.

13. The microphone sensor according to claim 11, wherein the magnetic material comprises a ferrite material.

14. The microphone sensor according to claim 11, wherein the non-magnetic material comprises a resin material.

15. The microphone sensor according to claim 11, wherein the non-magnetic material has a larger surface area than the magnetic material.

16. An electric circuit comprising:

the microphone sensor according to claim 11; and

a power supply connected with the package.