Micro-electro mechanical system (MEMS) structures with through substrate vias and methods of forming the same

• US 10,071,905 B2
• Filed: 10/10/2016
• Issued: 09/11/2018
• Est. Priority Date: 01/31/2012
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Chu, Chia-Hua, Chang, Kuei-Sung, Lee, Te-Hao
• Primary Examiner(s): Wright, Tucker J
• Application Number:
  US15/289,794
• Publication Number:
  US 20170022049A1
• Time in Patent Office: 701 Days
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81B 2207/095 through the lid
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: B81C 2203/036 Fusion bonding
• CPC Class Codes: B82Y 30/00 Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: H01L 21/76898 formed through a semiconductor substrate

Abstract

The present disclosure includes micro-electro mechanical system (MEMS) structures and methods of forming the same. Substrates of the MEMS structures are bonded together by fusion bonding at high processing temperatures, which enables more complete removal of chemical species from the dielectric materials in the substrates prior to sealing cavities of the MEMS structures. Fusion bonding of MEMS structures reduces outgassing of chemical species and is compatible with the cavity formation process. The MEMS structures bonded by fusion bonding are mechanically stronger compared to eutectic bonding due to a higher bonding ratio. In addition, fusion bonding enables the formation of through substrate vias (TSVs) in the MEMS structures.

Claims

1. A method of forming a micro-electro mechanical system (MEMS) structure, the method comprising:

providing a first substrate structure having a first layer with a first silicon surface, wherein the providing the first substrate structure includes forming the first layer having the first silicon surface consisting of silicon;

providing a second substrate having a second layer with a second silicon surface, wherein the providing the second substrate includes forming the second layer having the second silicon surface consisting of silicon;

bonding the second substrate to the first substrate structure using fusion bonding, wherein the bonding forms a fusion bonding interface between the first and second silicon surfaces, wherein the second substrate includes at least one micro-electro mechanical system (MEMS) device, and wherein there is at least one cavity surrounding at least a portion of the MEMS device; and

forming a through silicon via (TSV) in the first substrate structure and through the fusion bonding interface between the first substrate structure and the second substrate such that a conductive layer of the TSV extends through the fusion bonding interface.

2. The method of claim 1, wherein the bonding is performed at a temperature between about 500 Celsius and 1200 Celsius.

3. The method of claim 1, further comprising:

thinning the first substrate structure.

4. The method of claim 1, further comprising:

making at least one of the first silicon surface and the second silicon surface hydrophobic before the bonding.

5. The method of claim 1, making both of the first silicon surface and the second silicon surface hydrophobic before the bonding.

6. The method of claim 1, wherein the bonding includes pressing the first and second silicon surfaces together and annealing the first substrate structure and second substrate.

7. A method of forming a micro-electro mechanical system (MEMS) structure, the method comprising:

providing a first substrate structure having a first layer with a first silicon surface;

providing a second substrate having at least one micro-electro mechanical system (MEMS) device and having disposed thereon a second layer with a second silicon surface, wherein the second layer is formed over and interfaces a top surface of the second substrate, the top surface being a semiconductor material;

fusion bonding the second substrate to the first substrate structure, wherein the fusion bonding forms a bonding interface between the first and second silicon surfaces; and

forming an interconnect through the first substrate structure and the bonding interface to contact the top surface of the second substrate.

8. The method of claim 7, wherein providing the first substrate structure and second substrate prior to the fusion bonding does not include providing a metal component.

9. The method of claim 8, wherein the fusion bonding includes a temperature in a range from about 900°

C. to about 1200°

C.

10. The method of claim 7, further comprising:

performing an HF release process on the MEMS device.

11. The method of claim 7, wherein the first substrate structure is a capping substrate.

12. The method of claim 7, further comprising, prior to the fusion bonding making the first and second silicon surfaces hydrophobic.

13. The method of claim 7, wherein the second silicon surface consists of silicon and wherein the first silicon surface consists of silicon.

14. A method of forming a micro-electro mechanical system (MEMS) structure, the method comprising:

providing a first substrate structure, wherein a first layer with a first silicon surface is disposed on the first substrate structure;

providing a second substrate, wherein a second layer with a second silicon surface is disposed on the second substrate a bottommost surface of the second layer interfacing the second substrate;

fusion bonding the second substrate to the first substrate structure, wherein the fusion bonding includes;

annealing the first substrate structure and second substrate to form a bonding interface between the first and second silicon surfaces; and

forming an interconnect through the first substrate structure and the bonding interface and contacting the second substrate below the second layer, wherein a bottommost surface of the interconnect is coplanar with the bottommost surface of the second layer.

15. The method of claim 14, wherein the forming the interconnect includes:

forming an opening in the first substrate structure and the bonding interface to expose a top surface of the second substrate; and

depositing a conductive material in the opening to form a through-silicon-via (TSV).

16. The method of claim 15, wherein the second substrate has at least one micro-electro mechanical system (MEMS) device.

17. The method of claim 14, wherein the annealing is performed at between about 900 Celsius and 1200 Celsius.

18. The method of claim 14, further comprising:

providing the first silicon surface and the second silicon surface as hydrophobic prior to the fusion bonding.

19. The method of claim 18, wherein the providing the first and second silicon surfaces as hydrophobic includes providing the hydrophobicity prior to contacting the first silicon surface to the second silicon surface.

20. The method of claim 14, wherein the first silicon surface consists of silicon and wherein the second silicon surface consists of silicon.