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Silicon-based MEMS devices including wells embedded with high density metal

  • US 10,073,113 B2
  • Filed: 04/24/2015
  • Issued: 09/11/2018
  • Est. Priority Date: 12/22/2014
  • Status: Active Grant
First Claim
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1. A MEMS device comprising:

  • a silicon-based movable MEMS sensor element having a surface with a plurality of wells formed therein;

    wherein the plurality of wells are filled with at least one metal and cover between 20% and 82% of the surface of the movable MEMS sensor element.

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