Silicon-based MEMS devices including wells embedded with high density metal
First Claim
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1. A MEMS device comprising:
- a silicon-based movable MEMS sensor element having a surface with a plurality of wells formed therein;
wherein the plurality of wells are filled with at least one metal and cover between 20% and 82% of the surface of the movable MEMS sensor element.
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Abstract
In one aspect, the disclosure is directed to a MEMS device. The MEMS device includes a silicon-based movable MEMS sensor element. The MEMS device also includes a plurality of wells formed into at least one surface of the movable MEMS sensor element. Each well is filled with at least one metal so as to increase the effective mass of the movable MEMS sensor element. The metal may be tungsten or tantalum, or an alloy with tungsten or tantalum.
73 Citations
28 Claims
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1. A MEMS device comprising:
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a silicon-based movable MEMS sensor element having a surface with a plurality of wells formed therein; wherein the plurality of wells are filled with at least one metal and cover between 20% and 82% of the surface of the movable MEMS sensor element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A method of fabricating a MEMS device, the method comprising:
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forming a silicon-based MEMS sensor element having a surface; forming a plurality of wells in the surface of the MEMS sensor element, wherein the plurality of wells covers between 20% and 82% of the surface; and filling the plurality of wells with at least one metal. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28)
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Specification