Device with decreased pitch contact to active regions
First Claim
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1. A method of forming a semiconductor device, comprising:
- fabricating a plurality of parallel fins on a semiconductor substrate;
forming a plurality of sacrificial gate structures overlying a channel portion of each of the fins;
forming sidewall spacers on sidewalls of the sacrificial gate structures, the sidewall spacers abutting top and sidewall surfaces of the fins;
forming a first dielectric layer over the fins and over the sidewall spacers, the first dielectric layer disposed between adjacent sacrificial gate structures;
removing a first sacrificial gate structure from over the channel portion of at least one fin to form an opening exposing the channel portion;
removing the channel portion of the at least one fin exposed through the opening to form a cut fin; and
forming an isolation dielectric layer within the opening and between opposing end surfaces of the cut fin.
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Abstract
A fin cut process cuts semiconductor fins after forming sacrificial gate structures that overlie portions of the fins. Selected gate structures are removed to form openings and exposed portions of the fins within the openings are etched. An isolation dielectric layer is deposited into the openings and between end portions of the cut fins. The process enables a single sacrificial gate structure to define the spacing between two active regions on dissimilar electrical nets.
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Citations
19 Claims
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1. A method of forming a semiconductor device, comprising:
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fabricating a plurality of parallel fins on a semiconductor substrate; forming a plurality of sacrificial gate structures overlying a channel portion of each of the fins; forming sidewall spacers on sidewalls of the sacrificial gate structures, the sidewall spacers abutting top and sidewall surfaces of the fins; forming a first dielectric layer over the fins and over the sidewall spacers, the first dielectric layer disposed between adjacent sacrificial gate structures; removing a first sacrificial gate structure from over the channel portion of at least one fin to form an opening exposing the channel portion; removing the channel portion of the at least one fin exposed through the opening to form a cut fin; and forming an isolation dielectric layer within the opening and between opposing end surfaces of the cut fin. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of forming a semiconductor device, comprising:
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forming a plurality of sacrificial gate structures overlying channel portions of a semiconductor fin; forming sidewall spacers on sidewalls of the sacrificial gate structures, the sidewall spacers abutting top and sidewall surfaces of the fin; removing a first sacrificial gate structure from over the channel portion to form an opening exposing the channel portion; and removing the channel portion of the fin exposed through the opening to form a cut fin. - View Dependent Claims (16, 17, 18, 19)
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Specification