Magneto-resistive chip package including shielding structure
First Claim
1. A magneto-resistive chip package comprising:
- a circuit board;
a shielding body comprising a shielding base part positioned on a surface of the circuit board and a shielding intermediate part extending from one side of the shielding base part;
a magneto-resistive chip positioned on the shielding base part along a first direction that is perpendicular to the surface of the circuit board;
an internal connection part electrically connecting the magneto-resistive chip to the circuit board;
an encapsulation part including a first portion positioned on the magneto-resistive chip along the first direction and a second portion positioned on the circuit board along the first direction, wherein the encapsulation part encapsulates the magneto-resistive chip on the circuit board; and
a shielding cover positioned on the shielding intermediate part and on the encapsulation part such that the first portion of the encapsulation part is interposed between the magneto-resistive chip and the shielding cover along the first direction and such that the second portion of the encapsulation part is interposed between the circuit board and the shielding cover along the first direction,wherein the shielding cover extends past a sidewall of the shielding intermediate part, andwherein a width of the shielding cover is substantially the same as a width of the circuit board in cross section.
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Accused Products
Abstract
In one embodiment, a magneto-resistive chip package includes a circuit board; a shielding body including a shielding base part positioned on the circuit board and a shielding intermediate part extending from one side of the shielding base part; a magneto-resistive chip positioned on the shielding base part and including a magneto-resistive cell array; an internal connection part electrically connecting the magneto-resistive chip to the circuit board; an encapsulation part encapsulating the magneto-resistive chip on the circuit board, and having an upper surface that is higher than an upper surface of the magneto-resistive chip; and a shielding cover positioned on the shielding intermediate part, and on the encapsulation part.
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Citations
19 Claims
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1. A magneto-resistive chip package comprising:
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a circuit board; a shielding body comprising a shielding base part positioned on a surface of the circuit board and a shielding intermediate part extending from one side of the shielding base part; a magneto-resistive chip positioned on the shielding base part along a first direction that is perpendicular to the surface of the circuit board; an internal connection part electrically connecting the magneto-resistive chip to the circuit board; an encapsulation part including a first portion positioned on the magneto-resistive chip along the first direction and a second portion positioned on the circuit board along the first direction, wherein the encapsulation part encapsulates the magneto-resistive chip on the circuit board; and a shielding cover positioned on the shielding intermediate part and on the encapsulation part such that the first portion of the encapsulation part is interposed between the magneto-resistive chip and the shielding cover along the first direction and such that the second portion of the encapsulation part is interposed between the circuit board and the shielding cover along the first direction, wherein the shielding cover extends past a sidewall of the shielding intermediate part, and wherein a width of the shielding cover is substantially the same as a width of the circuit board in cross section. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A magneto-resistive chip package comprising:
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a circuit board; a shielding body arranged on the circuit board, the shielding body comprising a shielding base part and a shielding intermediate part extending from one side of the shielding base part, the shielding body having an opening formed through the shielding base part or through the shielding intermediate part; a magneto-resistive chip arranged on the shielding base part, wherein magneto-resistive chip includes a first surface and a second surface opposite the first surface and wherein the first surface faces toward the shielding base part; an internal connection part extending from the second surface of the magneto-resistive chip and electrically connecting the magneto-resistive chip to the circuit board through the opening; an encapsulation part encapsulating the magneto-resistive chip on the circuit board; and a shielding cover positioned on the shielding intermediate part, wherein the shielding cover extends past a sidewall of the shielding intermediate part, and wherein a width of the shielding cover is substantially the same as a width of the circuit board in cross section. - View Dependent Claims (12, 13, 14, 15)
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16. A magneto-resistive chip package comprising:
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a circuit board; a shielding base part positioned on the circuit board and having a penetration hole through which the circuit board is exposed; a magneto-resistive chip positioned on the shielding base part; a shielding intermediate part provided on one side of the shielding base part and protruding higher than an upper surface of the magneto-resistive chip; an internal connection part electrically connecting the magneto-resistive chip to the circuit board through the penetration hole; an encapsulation part encapsulating the magneto-resistive chip on the circuit board; and a shielding cover positioned on the shielding intermediate part and on the encapsulation part, wherein the encapsulation part is interposed between the circuit board and the shielding cover, wherein the shielding cover extends past a sidewall of the shielding immediate part, and wherein a width of the shielding cover is substantially the same as a width of the circuit board in cross section. - View Dependent Claims (17, 18, 19)
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Specification