Optical isolator mounted in printed circuit board recess

• US 10,075,246 B2
• Filed: 09/26/2013
• Issued: 09/11/2018
• Est. Priority Date: 09/26/2013
• Status: Active Grant

• Current Assignee: Micro Motion Incorporated (Emerson Electric Company)
• Original Assignee: Micro Motion Incorporated (Emerson Electric Company)
• Inventors: Hunter, Kirk Allan, Dreier, Jared James, Lucht, Jordan Dennis, Messenger, Samuel Ethan
• Primary Examiner(s): Pyo, Kevin
• Application Number:
  US14/037,852
• Publication Number:
  US 20150083942A1
• Time in Patent Office: 1,811 Days
• Field of Search: 250221, 250551, 385 15- 52, 257666, 257676
• CPC Class Codes: H04B 10/802 for isolation, e.g. using optocouplers
• CPC Class Codes: H05K 1/0256 Electrical insulation details, e.g. around high voltage areas
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 2201/09036 Recesses or grooves in insulating substrate
• CPC Class Codes: H05K 2201/10121 Optical component, e.g. opto-electronic component
• CPC Class Codes: H05K 2201/10545 Related components mounted on both sides of the PCB
• CPC Class Codes: H05K 3/0047 Drilling of holes
• CPC Class Codes: H05K 3/32 electrically connecting electric components or wires to printed circuits
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

An optical isolator is provided. The optical isolator includes a printed circuit board having a first surface and a second surface opposite the first surface. The printed circuit board has a recess extending only partially through the board. The first photoelement has an active surface and is mounted relative to the first surface of the printed circuit board. A second photoelement has an active surface and is mounted relative to the second surface. The second photoelement is configured to interact with the first photoelement. At least one of the first and second photoelements has its active surface disposed at least partially in the recess. A portion of the printed circuit board is interposed between the first and second photoelements.

Claims

1. An optical isolator comprising:

a printed circuit board having an intrinsically safe first surface that meets an intrinsically safe specification of field devices such that even under fault conditions, circuitry on the intrinsically safe first surface cannot itself ignite a volatile environment, and a second surface on an opposite side from the intrinsically safe first surface, the printed circuit board having a recess extending only partially therethough, the recess defined by sidewalls that terminate at an end surface such that the end surface is separated from the intrinsically safe first surface by the sidewalls;

a first photoelement having an active surface, the first photoelement being mounted to the printed circuit board;

a second photoelement having an active surface, the second photoelement being mounted at least partially in the recess; and

wherein the end surface is interposed between the active surface of the first photoelement and the active surface of the second photoelement such that light emitted from the active surface of one of the first and second photoelements that passes into the end surface is detected at the active surface of the other of the first and second photoelements.

2. The optical isolator of claim 1, wherein the recess is round.

3. The optical isolator of claim 2, wherein the end surface meets a sidewall of the recess at a substantially right angle.

4. The optical isolator of claim 2, wherein the end surface is flat.

5. The optical isolator of claim 1, wherein one of the first photoelement and the second photoelement is a photoemitter.

6. The optical isolator of claim 5, wherein the photoemitter is a light emitting diode.

7. The optical isolator of claim 6, wherein the light emitting diode is an IR light emitting diode.

8. The optical isolator of claim 5, wherein the photoemitter is at least partially disposed in the recess.

9. The optical isolator of claim 8, wherein the photoemitter has a dome that is disposed in the recess.

10. The optical isolator of claim 1, wherein one of the first photoelement and the second photoelement is a photodetector.

11. The optical isolator of claim 10, wherein the photodetector is a PIN diode.

12. The optical isolator of claim 10, wherein the photodetector is covered by an opaque cover.

13. The optical isolator of claim 1, wherein a portion of the printed circuit board interposed between the first and second photoelements is a minimum spacing for an intrinsic safety specification of an optocoupler.

14. The optical isolator of claim 13, wherein the minimum spacing is at least 0.2 mm.

15. The optical isolator of claim 13, wherein the printed circuit board has a plurality of copper containing layers, and wherein copper in all such copper-containing layers is disposed at least the minimum spacing distance from the recess.

16. A circuit arrangement comprising:

a printed circuit board having an intrinsically safe first surface meeting an intrinsically safe specification of field devices such that even under fault conditions, circuitry on the intrinsically safe first surface cannot itself ignite a volatile environment and a second surface on an opposite side from the intrinsically safe first surface, the printed circuit board having a first recess extending only partially therethough, the first recess defined by first sidewalls that terminate at a first end surface such that the first end surface is separated from the intrinsically safe first surface by the first sidewalls and a second recess spaced from the first recess and also extending only partially therethrough, the second recess defined by second sidewalls that terminate at a second end surface such that the second end surface is separated from the second surface by the second sidewalls;

a first photoemitter mounted on the printed circuit board and having an active surface at least partially disposed in the first recess;

a first photodetector mounted on the second surface, the first photodetector being spaced from the first photoemitter by a portion of the printed circuit board interposed therebetween such that the first end surface is between the first photoemitter and the first photodetector and such that light emitted by the first photoemitter that passes into the first end surface is detected by the first photodetector;

a second photodetector mounted on the intrinsically safe first surface; and

a second photoemitter mounted on the printed circuit board and having an active surface at least partially disposed in the second recess, the second photodetector being spaced from the second photoemitter by a portion of the printed circuit board interposed therebetween such that the second end surface is between the second photoemitter and the second photodetector and such that light emitted by the second photoemitter that passes into the second end surface is detected by the second photodetector.

17. The circuit arrangement of claim 16, including a translucent filler medium between the first photo emitter and printed circuit board to reduce attenuation.

18. The circuit arrangement of claim 16, including layers in the printed circuit board proximate the first recess and the second recess which provide attenuation for signal escaping an intended transmission path for a specific electromagnetic spectrum of the signal.

19. The circuit arrangement of claim 16, including a hollow cylindrical structure opaque to a specific electromagnetic spectrum in the first recess.

20. The circuit arrangement of claim 16, wherein the printed circuit board includes a plurality of circuit layers wherein the plurality of circuit layers are individually isolated from one another.

21. A method of isolating electrical components, comprising:

placing first electrical components on an intrinsically safe first side of a printed circuit board wherein the intrinsically safe first side satisfies an intrinsically safe specification of field devices such that even under fault conditions, circuitry on the intrinsically safe first surface cannot itself ignite a volatile environment;

placing second electrical components on a second side of the printed circuit board which is opposite the intrinsically safe first side;

forming a recess in the intrinsically safe first side of the printed circuit board which extends partially through the printed circuit board toward the second side, the recess having side walls extending from the intrinsically safe first side of the printed circuit board to a closed end formed by a closed end surface of the recess;

mounting a first photo element having an active surface in the recess and coupled to the first electrical components; and

mounting a second photo element having an active surface on the second side of the printed circuit board directed toward the active surface of the first photo element through the closed end surface of the recess, the second photo element configured to interact with the first photo element through the closed end surface of the recess, the second photo element electrically connected to the second electrical components.

22. The method of claim 21, wherein the first photo element comprises a diode.

23. The method of claim 21, wherein forming the recess comprises partially drilling the printed circuit board.