QFN pre-molded leadframe having a solder wettable sidewall on each lead

• US 10,079,198 B1
• Filed: 05/31/2017
• Issued: 09/18/2018
• Est. Priority Date: 05/31/2017
• Status: Active Grant

• Current Assignee: STMicroelectronics International N.V. (STMicroelectronics NV)
• Original Assignee: STMicroelectronics Incorporated (STMicroelectronics NV)
• Inventors: Cadag, Aaron, Antilano, Jr., Ernesto, Cadag, Ela Mia
• Primary Examiner(s): Clark, Jasmine
• Application Number:
  US15/610,088
• Time in Patent Office: 475 Days
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/3192 Multilayer coating
• CPC Class Codes: H01L 23/49503 characterised by the die pad
• CPC Class Codes: H01L 23/4952 the additional leads being a bump or a wire
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 23/49548 Cross section geometry H01L23/49562 takes precedence
• CPC Class Codes: H01L 23/49582 Metallic layers on lead frames
• CPC Class Codes: H01L 23/49861 Lead-frames fixed on or encapsulated in insulating substrates H01L23/4985, H01L23/49805 take precedence
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

The present disclosure is directed to a leadframe package having solder wettable sidewalls that is formed using a pre-molded leadframe and methods of manufacturing the same. A metal plated leadframe with a plurality of recesses and a plurality of apertures is placed into a top and bottom mold tool. A molding compound is then formed in the plurality of recesses and apertures in the leadframe to form a pre-molded leadframe. A plurality of die and wires are coupled to the pre-molded leadframe and the resulting combination is covered in an encapsulant. Alternatively, a bare leadframe can be processed and the metal layer can be applied after encapsulation. A saw or other cutting means is used for singulation to form leadframe packages. Each resulting leadframe package has a solder wettable sidewall for improving the strength of solder joints between the package and a circuit board.

Claims

1. A device comprising:

a leadframe having a first side, a second side, a first die pad, a second die pad, a first lead and a second lead, the first lead being associated with the first die pad and the second lead being associated with the second die pad;

a plurality of recesses positioned on the second side of the leadframe between the first lead and the second lead;

a first aperture positioned between the first die pad and the first lead;

a second aperture positioned between the second die pad and the second lead;

a first plurality of molding compound portions, one of the first plurality of molding compound portions occupying the first aperture and another of the first plurality of molding compound portions occupying the second aperture, the plurality of recesses having a depth that is greater than half of a thickness of the leadframe; and

a second plurality of molding compound portions, each of the second plurality of molding compound portions positioned on the first side of the leadframe in a location adjacent to each of the plurality of recesses.

2. The device of claim 1 further comprising the plurality of recesses extending through a body of the leadframe to form a second plurality of apertures.

3. A device comprising:

a leadframe having a first side, a second side, a first die pad, a second die pad, a first lead and a second lead, the first lead being associated with the first die pad and the second lead being associated with the second die pad;

a plurality of recesses positioned on the second side of the leadframe between the first lead and the second lead;

a first aperture positioned between the first die pad and the first lead;

a second aperture positioned between the second die pad and the second lead;

a first plurality of molding compound portions, one of the first plurality of molding compound portions occupying the first aperture and another of the first plurality of molding compound portions occupying the second aperture; and

a second plurality of molding compound portions, each of the second plurality of molding compound portions positioned on the first side of the leadframe in a location adjacent to each of the first plurality of recesses, wherein the plurality of recesses define sidewalls of the first lead and the second lead, and the sidewalls are exposed to an exterior environment.

4. A device comprising:

a die pad having a first side and a second side;

a die coupled to the first side of the die pad;

a plurality of leads spaced apart from the die pad, each of the plurality of leads having a first side, a second side and an outside facing sidewall;

a plurality of wires, each of the plurality of wires coupled between the die and one of the plurality of leads;

first molding compound portions positioned between the die pad and the plurality of leads;

second molding compound portions positioned on the first side of each of the plurality of leads;

a metal layer positioned on the second side of the die pad, the second side of each of the plurality of leads and a portion of the sidewall of each of the plurality of leads, the metal layer substantially covering the sidewall of each of the plurality of leads; and

an encapsulant encasing the die, the plurality of wires and the second plurality of encapsulant portions.

5. The device of claim 4 further comprising the metal layer including at least one of tin, nickel, palladium and gold.

6. The device of claim 4 wherein the encapsulant contacts the first plurality of molding compound members.

7. A device, comprising:

a leadframe having a first side and a second side, the leadframe including;

a die pad;

a lead having a sidewall;

a first molding compound positioned in a space between the lead and the die pad to physical and electrically separate the lead from the die pad; and

a metal layer on the second side of the die pad, the second side of the lead, and the sidewall of the lead, wherein the metal layer only partially covers the sidewall of the lead and is not present on some portions of the sidewall of the lead;

an adhesive coupling a die to the first side of the die pad;

an electrical connection coupling the die to the lead; and

an encapsulant that is a different material from the first molding compound, the encapsulant positioned on the first side of the die pad and encasing the die and the electrical connection.

8. The device of claim 7 further comprising:

a second molding compound portion coupled to the first side of the lead.

9. The device of claim 8 wherein a first surface of the first molding compound portion and a second surface of the second molding compound portion are exposed to an exterior environment.

10. The device of claim 7 wherein the metal layer is exposed to an exterior environment.

11. The device of claim 7 wherein the metal layer on the second side of the die pad, on the second side of the lead, and on the sidewall of the lead is on the first side of the die pad and the first side of the lead.

12. The device of claim 7 wherein the metal layer encases the lead and the die pad.

13. The device of claim 7 wherein the electrical connection coupling the die to the lead is a wire, the wire having a first end coupled to the die and a second end coupled to the first side of the lead.

14. The device of claim 7 further comprising the metal layer including at least one of tin, nickel, palladium and gold.

15. A device comprising:

a leadframe having a first side and a second side, the leadframe including;

a die pad;

a lead having a sidewall;

a first molding compound positioned in a space between the lead and the die pad to physical and electrically separate the lead from the die pad; and

a metal layer on the second side of the die pad, the second side of the lead, and the sidewall of the lead;

a second molding compound portion coupled to the first side of the lead

an adhesive coupling a die to the first side of the die pad;

an electrical connection coupling the die to the lead; and

an encapsulant that is a different material from the first molding compound, the encapsulant positioned on the first side of the die pad and encasing the die and the electrical connection, wherein the second molding compound portion is embedded in the encapsulant.

16. A device comprising:

a leadframe having a first side and a second side, the leadframe including;

a die pad;

a lead having a sidewall;

a first molding compound positioned in a space between the lead and the die pad to physical and electrically separate the lead from the die pad; and

a metal layer on the second side of the die pad, the second side of the lead, and the sidewall of the lead, wherein the metal layer completely covers the sidewall of the lead;

an adhesive coupling a die to the first side of the die pad;

an electrical connection coupling the die to the lead; and

an encapsulant that is a different material from the first molding compound, the encapsulant positioned on the first side of the die pad and encasing the die and the electrical connection.