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Power module and method for manufacturing the same

  • US 10,080,313 B2
  • Filed: 01/27/2014
  • Issued: 09/18/2018
  • Est. Priority Date: 01/27/2014
  • Status: Active Grant
First Claim
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1. A power module comprising:

  • one or more main body units, each of the body units respectively having a semiconductor element, a control terminal connected to the semiconductor element, a power terminal through which a current corresponding to an electrical signal to the control terminal flows, and a heat dissipation layer;

    one or more cooling units disposed to exchange heat with the heat dissipation layer and cool the main body units;

    a busbar connected to the power terminal of each of the main body units;

    a casing in which at least a contact part with the busbar is insulating; and

    a metal member which supports the casing;

    wherein the metal member contacts the casing, thereby forming a box with one side opened,at least the main body units and the busbar are disposed inside the box,in each of the main body units, the control terminal and the power terminal are disposed to extend to the one side from the semiconductor element, andan insulating sealant fills the inside of the box, thereby sealing the main body units and the busbar,the metal member has one or more pockets which are recessed towards another side opposite the one side and which accommodate the main body units,the cooling units and the main body units, accommodated in the pockets, are arranged alternately and separated by the metal member, andthe cooling units exchange heat with the main body units via the pockets.

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