Power module and method for manufacturing the same

• US 10,080,313 B2
• Filed: 01/27/2014
• Issued: 09/18/2018
• Est. Priority Date: 01/27/2014
• Status: Active Grant

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Shintani, Hiroshi, Ide, Eiichi, Sasaki, Koji, Tanie, Hisashi
• Primary Examiner(s): Pape, Zachary M
• Application Number:
  US15/104,587
• Publication Number:
  US 20160322281A1
• Time in Patent Office: 1,695 Days
• CPC Class Codes: H01L 21/4817 for containers, e.g. caps H01L21/4871 takes precedence
• CPC Class Codes: H01L 21/4857 Multilayer substrates multilayer metallisation on monolayer substrate H01L21/4846
• CPC Class Codes: H01L 21/54 Providing fillings in containers, e.g. gas fillings
• CPC Class Codes: H01L 2224/2612 Auxiliary members for layer connectors, e.g. spacers
• CPC Class Codes: H01L 23/043 the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
• CPC Class Codes: H01L 23/051 another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/3675 characterised by the shape of the housing
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/4012 for stacked arrangements of a plurality of semiconductor devices assemblies per se H01L25/00
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 24/33 of a plurality of layer connectors
• CPC Class Codes: H01L 25/07 the devices being of a type provided for in group H01L29/00
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H05K 7/20927 : Liquid coolant without phase change

Abstract

A power module or the like is provided in which lower inductance and miniaturization are achieved. The power module includes: main body units (11 to 13), cooling units (21 to 24) which cool the main body units (11 to 13), busbars (51, 52) connected to power terminals (1i, 1j) of the main body units (11 to 13), a casing (W) in which at least contact parts with the busbars (51, 52) are insulative, and a metal member (30) which supports the casing (W). The metal member (30) tightly contacts the casing (W), thereby forming a box with one side opened. At least the main body units (11 to 13) and the busbars (51, 52) are arranged inside the box. An insulating sealant is provided to fill the inside of the box.

Claims

1. A power module comprising:

one or more main body units, each of the body units respectively having a semiconductor element, a control terminal connected to the semiconductor element, a power terminal through which a current corresponding to an electrical signal to the control terminal flows, and a heat dissipation layer;

one or more cooling units disposed to exchange heat with the heat dissipation layer and cool the main body units;

a busbar connected to the power terminal of each of the main body units;

a casing in which at least a contact part with the busbar is insulating; and

a metal member which supports the casing;

wherein the metal member contacts the casing, thereby forming a box with one side opened,

at least the main body units and the busbar are disposed inside the box,

in each of the main body units, the control terminal and the power terminal are disposed to extend to the one side from the semiconductor element, and

an insulating sealant fills the inside of the box, thereby sealing the main body units and the busbar,

the metal member has one or more pockets which are recessed towards another side opposite the one side and which accommodate the main body units,

the cooling units and the main body units, accommodated in the pockets, are arranged alternately and separated by the metal member, and

the cooling units exchange heat with the main body units via the pockets.

2. The power module according to claim 1, wherein

the main body units and the cooling units are arranged alternately in the state of being in contact with the pockets as a multilayer body, and the multilayer body is accommodated in the box.

3. The power module according to claim 2, wherein the casing includes:

an insulating member in which the busbar is placed; and

a pressurizing member disposed to sandwich and press the cooling units into contact with the pockets.

4. The power module according to claim 3, wherein

the insulating members form a pair of sidewalls of the box and the insulating members are supported by the pressurizing member.

5. The power module according to claim 2, further comprising:

a cooling water circulation member having one or more flow paths configured to pass cooling water,

wherein the cooling units and the metal member are integrally formed as a heat dissipation member, and

wherein the cooling water circulation member is disposed in contact with the heat dissipation member.

6. The power module according to claim 2, further comprising:

a heat dissipation member made up of the cooling units, the metal member and one or more air cooling fins which are integrally formed,

wherein the air-cooling fins extend away from the one side.

7. The power module according to claim 1, wherein

the metal member has a standing part which surrounds the casing, as viewed in a plan view, and stands up toward the one side.

8. The power module according to claim 7, wherein

a top of the standing part is higher than a liquid surface of the insulating sealant filling the inside of the box.

9. The power module according to claim 1, further comprising:

a pressurizing member disposed to sandwich and press the cooling units into contact with the pockets from opposing sides.

10. The power module according to claim 1, wherein

the cooling units have one or more flow paths configured to pass cooling water.

11. The power module according to claim 1, further comprising:

a heat sink disposed on the cooling units which dissipates heat absorbed from the cooling units into the air.

12. The power module according to claim 1, wherein

the insulating sealant is a gel or a resin.

13. A power module comprising:

one or more body units, each including a semiconductor element, a control terminal connected to the semiconductor element, a power terminal through which a current corresponding to an electrical signal to the control terminal flows, and a heat dissipation layer;

one or more cooling units which are arranged alternately with the main body units and which cool the main body units; and

a metal member which is integrally formed and which includes one or more pockets separating each of the main body units and the cooling units from each other;

wherein the main body units are exposed to one side from the metal member, and

the cooling units are exposed to another side opposite to the one side from the metal member,

the pockets are each recessed towards the other side and accommodate the main body units therein,

the cooling units and the main body units, accommodated in the pockets, are arranged alternately and separated by the metal member, and

the cooling units exchange heat with the main body units via the pockets.

14. A method for manufacturing a power module, comprising:

positioning one or more main body units, each having a semiconductor element, a control terminal connected to the semiconductor element, a power terminal through which a current corresponding to an electrical signal to the control terminal flows, and a heat dissipation layer, from one side into one or more pockets of a metal member, and positioning one or more cooling units to be arranged alternately with the main body units accommodated in the pockets and separated from the main body units by the pockets;

connecting together a busbar and the power terminal of each of the main body units;

forming a box having a casing in contact with and supported by the metal member, where the box has one side thereof which is open, at least a contact part of the casing with the busbar is insulating, and at least the main body units and the busbar are disposed inside the box;

filling an inside of the box with an insulating sealant;

wherein the control terminal and the power terminal extend to the one side from the semiconductor element in each of the main body units, and

the pockets are recessed towards another side opposite to the one side,

the cooling units and the main body units, accommodated in the pockets, are arranged alternately and separated by the metal member, and

the cooling units exchange heat with the main body units via the pockets.