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Device for monitoring at least one body function of a user and method for manufacturing the same

  • US 10,080,497 B2
  • Filed: 06/26/2013
  • Issued: 09/25/2018
  • Est. Priority Date: 06/28/2012
  • Status: Active Grant
First Claim
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1. A method for manufacturing a device for monitoring at least one body function of a user, wherein the device comprises at least one evaluation unit and at least one sensor unit, wherein the method comprises the following steps:

  • a) a step of providing the evaluation unit, wherein the evaluation unit has at least one electric contact pad applied to at least one evaluation unit substrate, wherein the electric contact pad is electrically connected to at least one electronic device of the evaluation unit;

    b) a step of providing the sensor unit, wherein the sensor unit comprises at least one connector part, wherein the connector part comprises at least one connector substrate and at least one conductive path applied to the connector substrate, wherein the conductive path comprises at least one electrically conductive material, wherein the electrically conductive material comprises an electrically conductive polymer, and wherein the conductive path has at least one connector portion;

    c) a preparation step, wherein the connector portion is aligned next to the electric contact pad such that the connector portion faces the electric contact pad, wherein at least one anisotropic conductive adhesive is provided in between the electric contact pad and the connector portion, wherein the anisotropic conductive adhesive is applied in an amorphous form; and

    d) a bonding step, wherein the evaluation unit substrate and the connector substrate are pressed together, wherein the electric contact pad and the connector portion are pressed together, and wherein an electric connection of the electric contact pad and the connector portion is created via the anisotropic conductive adhesive, wherein in the preparation step, the anisotropic conductive adhesive is applied excessively such that, after performing the bonding step, a bead of excess anisotropic conductive adhesive is formed at at least one edge of at least one of the evaluation unit substrate and the connector substrate.

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