Multi-layer potting for electronic modules
First Claim
1. A lighting fixture comprising:
- a plurality of light emitting diodes (LEDs) responsive to a drive signal; and
a driver module configured to provide the drive signal and comprising;
a printed circuit board comprising a plurality of vias, which extend through the printed circuit board;
a plurality of electronic components that each comprise a body and a plurality of leads that extend from the body and through corresponding ones of the plurality of vias, wherein solder joints electrically and mechanically affix the plurality of leads within the corresponding ones of the plurality of vias;
a stress mitigation layer comprising a silicone gel and applied over a top surface of the printed circuit board; and
a potting layer applied over the stress mitigation layer and the plurality of electronic components, wherein an ASTM Shore hardness rating of the stress mitigation layer is less than an ASTM Shore hardness rating of the potting layer;
wherein the stress mitigation layer is between the potting layer and the solder joints.
3 Assignments
0 Petitions
Accused Products
Abstract
An electronics module, such as driver modules for LED-based lighting fixtures and the like, includes a printed circuit board (PCB), a stress mitigation layer, and a potting layer. The PCB has a plurality of vias, which extend through the printed circuit board. A plurality of electronic components may each have a body and a plurality of leads extending from the body and through corresponding ones of the plurality of vias, wherein solder joints electrically and mechanically affix the plurality of leads within the corresponding ones of the plurality of vias. The stress mitigation layer is applied over a top surface of the printed circuit board. The potting layer is applied over the stress mitigation layer and the plurality of electronic components.
16 Citations
35 Claims
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1. A lighting fixture comprising:
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a plurality of light emitting diodes (LEDs) responsive to a drive signal; and a driver module configured to provide the drive signal and comprising; a printed circuit board comprising a plurality of vias, which extend through the printed circuit board; a plurality of electronic components that each comprise a body and a plurality of leads that extend from the body and through corresponding ones of the plurality of vias, wherein solder joints electrically and mechanically affix the plurality of leads within the corresponding ones of the plurality of vias; a stress mitigation layer comprising a silicone gel and applied over a top surface of the printed circuit board; and a potting layer applied over the stress mitigation layer and the plurality of electronic components, wherein an ASTM Shore hardness rating of the stress mitigation layer is less than an ASTM Shore hardness rating of the potting layer; wherein the stress mitigation layer is between the potting layer and the solder joints. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. An electronics module comprising:
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a printed circuit board comprising a plurality of vias, which extend through the printed circuit board; a plurality of electronic components that each comprise a body and a plurality of leads that extend from the body and through corresponding ones of the plurality of vias, wherein solder joints electrically and mechanically affix the plurality of leads within the corresponding ones of the plurality of vias; a stress mitigation layer comprising a silicone gel and applied over a top surface of the printed circuit board; and a potting layer applied over the stress mitigation layer and the plurality of electronic components, wherein an ASTM Shore hardness rating of the stress mitigation layer is less than an ASTM Shore hardness rating of the potting layer; wherein the stress mitigation layer is between the potting layer and the solder joints. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35)
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Specification