Semiconductor device, manufacturing method, and electronic apparatus
First Claim
Patent Images
1. A semiconductor device, comprising:
- an image pickup device;
a cover glass, wherein the image pickup device and the cover glass are bonded to one another;
a film provided between the image pickup device and the cover glass, wherein the film has a specific gravity value of two or more and is configured to shield an alpha ray that arises from the cover glass; and
a fixing member between the image pickup device and the cover glass, wherein a first side of the film is in contact with the cover glass, and wherein a second side of the film opposite the first side is in contact with the fixing member.
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Abstract
A method of manufacturing a semiconductor device includes: forming, on a cover glass, a film having a predetermined specific gravity and configured to shield an alpha ray that arises from the cover glass; and bonding the cover glass on which the film is formed and an image pickup device, by filling a transparent resin between the cover glass and the image pickup device.
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Citations
20 Claims
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1. A semiconductor device, comprising:
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an image pickup device; a cover glass, wherein the image pickup device and the cover glass are bonded to one another; a film provided between the image pickup device and the cover glass, wherein the film has a specific gravity value of two or more and is configured to shield an alpha ray that arises from the cover glass; and a fixing member between the image pickup device and the cover glass, wherein a first side of the film is in contact with the cover glass, and wherein a second side of the film opposite the first side is in contact with the fixing member. - View Dependent Claims (2, 3, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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4. A method of manufacturing a semiconductor device, the method comprising:
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forming, on a cover glass, a film that has a specific gravity value of two or more and is configured to shield an alpha ray that arises from the cover glass; and fixing the cover glass on which the film is formed to an image pickup device using a fixing member, wherein a side of the film opposite a side on the cover glass is in contact with the fixing member. - View Dependent Claims (5, 6, 18, 19, 20)
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7. An electronic apparatus provided with a semiconductor device and a signal processing section, wherein the signal processing section is configured to process a pixel signal outputted from the semiconductor device, the semiconductor device comprising:
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an image pickup device; a cover glass, wherein the image pickup device and the cover glass are bonded to one another; a film provided between the image pickup device and the cover glass, wherein the film has a specific gravity value of two or more and is configured to shield an alpha ray that arises from the cover glass; and a fixing member between the image pickup device and the cover glass, wherein a first side of the film is in contact with the cover glass, and wherein a second side of the film opposite the first side is in contact with the fixing member.
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Specification