Multilayer wiring board

• US 10,085,336 B2
• Filed: 05/09/2013
• Issued: 09/25/2018
• Est. Priority Date: 05/10/2012
• Status: Active Grant

• Current Assignee: Lincstech Company Limited
• Original Assignee: Hitachi Chemical Company Limited (Resonac Holdings Corp.)
• Inventors: Katou, Masahiro, Koshikawa, Yasuyuki, Wada, Hiroshi
• Primary Examiner(s): Chen, Xiaoliang
• Application Number:
  US14/399,535
• Publication Number:
  US 20150136447A1
• Time in Patent Office: 1,965 Days
• Field of Search: 174251, 174254-256, 174258, 174260, 174266, 333 1, 333133, 333204, 333247, 428209, 428220, 428414, 428462, 361763, 361771, 361818, 257173, 257679
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/024 Dielectric details, e.g. changing the dielectric material around a transmission line
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/0366 reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 2201/0154 Polyimide
• CPC Class Codes: H05K 2201/0723 provided by an inner layer of PCB
• CPC Class Codes: H05K 3/429 Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
• CPC Class Codes: H05K 3/4626 characterised by the insulating layers or materials H05K3/4688 takes precedence
• CPC Class Codes: H05K 3/4652 Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern H05K3/4647 takes precedence
• CPC Class Codes: H05K 3/4688 Composite multilayer circuits, i.e. comprising insulating layers having different properties having a special base or central core H05K3/4602

Abstract

A multilayer wiring board has a strip structure comprising a core material in which a ground pattern is disposed on one side of an insulating layer and a strip line is disposed on the other side, a prepreg disposed on the strip line of the core material, and a ground pattern disposed on the prepreg. In this multilayer wiring board, the core material is formed with a high frequency-adaptive base material, and the prepreg is formed with a general-purpose material.

Claims

1. A multilayer wiring board comprising:

a core material having an insulating layer, a first ground pattern disposed on one side of the insulating layer, and a strip line disposed on the other side of the insulating layer;

a prepreg disposed on the strip line of the core material, the prepreg comprising a reinforcement material and an insulating resin impregnated in the reinforcement material; and

a second ground pattern disposed on the prepreg,

wherein the insulating layer of the core material comprises a high frequency-adaptive base material, and the prepreg comprises a general-purpose base material, and

wherein a relative permittivity after curing and a dielectric loss tangent of the general-purpose base material of the prepreg are respectively higher than a relative permittivity after curing and a dielectric loss tangent of the high frequency-adaptive base material.

2. The multilayer wiring board according to claim 1,

wherein the high frequency-adaptive base material is a base material having relative permittivity of less than 4.00 and a dielectric loss tangent of less than 0.0100.

3. The multilayer wiring board according to claim 1,

wherein the general-purpose base material is a base material having relative permittivity after curing of 4.20 or greater and a dielectric loss tangent of 0.0130 or greater.

4. The multilayer wiring board according to claim 1, further comprising a through-hole that penetrates through the core material, the prepreg and the second ground pattern.

5. The multilayer wiring board according to claim 1,

wherein the prepreg includes a fiber-like reinforcement material.

6. The multilayer wiring board according to claim 1,

wherein the prepreg includes a reinforcement material comprising at least one of paper, glass fiber and aramid fiber.

7. The multilayer wiring board according to claim 1,

wherein the prepreg includes a reinforcement material comprising at least one of paper, a woven fabric and a non-woven fabric.

8. The multilayer wiring board according to claim 1,

wherein a bottom face of the strip line is disposed at a side of the insulating layer configured to include the high frequency-adaptive base material.

9. The multilayer wiring board according to claim 1,

wherein the strip line has a protruding shape toward a side of the prepreg.

10. The multilayer wiring board according to claim 1,

wherein surface roughness of a bottom face of the strip line is greater than surface roughness of a surface of the strip line.

11. The multilayer wiring board according to claim 1,

wherein an area where a bottom face of the strip line contacts the insulating layer is equal to or larger than an area where a surface of the strip line contacts the prepreg.

12. The multilayer wiring board according to claim 1,

wherein a ratio of a thickness between the core material and the prepreg is any ratio from 1:

4 to 5;

1.

13. The multilayer wiring board according to claim 1,

wherein a ratio between a line width and a thickness of the strip line is any ratio from 1:

1 to 15;

1.