Semiconductor manufacturing systems
First Claim
Patent Images
1. A apparatus comprising:
- an equipment front end module that forms an ambient atmospheric portion of the apparatus;
a substantially hexahedron shaped sealed transport chamber that forms, at least in part, a vacuum portion of the apparatus and has four facets of the substantially hexahedron shaped sealed transport chamber connecting a top plane and a bottom plane of the substantially hexahedron shaped sealed transport chamber, each facet having a substrate transport opening configured for sealed communication with substrate holding modules, each transport opening having a sealable valve;
a robotic transport arm disposed within the substantially hexahedron shaped sealed transport chamber, the robotic transport arm having a common substrate holder effecting each substrate transfer of the robotic transfer arm on a common substrate transfer plane through the substrate transport opening on each facet of the four facets of the substantially hexahedron shaped sealed transport chamber;
a load lock connected to a facet of the four facets of the substantially hexahedron shaped sealed transport chamber for connecting the equipment front end module to the substantially hexahedron shaped sealed transport chamber; and
a second sealed transport chamber that forms, at least in part, the vacuum portion of the apparatus and has more than four facets and being communicably connected to one other facet of three remaining facets of the four facets of the substantially hexahedron shaped sealed transport chamber through the sealable valve of the other facet of the substantially hexahedron shaped sealed transport chamber, wherein the robotic transport arm is configured to extend through the sealable valve on each facet of the four facets of the substantially hexahedron shaped sealed transport chamber, each facet of the second sealed transport chamber having a substrate transport opening configured for sealed communication with other substrate holding modules.
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Abstract
Linear semiconductor handling systems provide more balanced processing capacity using various techniques to provide increased processing capacity to relatively slow processes. This may include use of hexagonal vacuum chambers to provide additional facets for slow process modules, use of circulating process modules to provide more processing capacity at a single facet of a vacuum chamber, or the use of wide process modules having multiple processing sites. This approach may be used, for example, to balance processing capacity in a typical process that includes plasma enhanced chemical vapor deposition steps and bevel etch steps.
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Citations
21 Claims
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1. A apparatus comprising:
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an equipment front end module that forms an ambient atmospheric portion of the apparatus; a substantially hexahedron shaped sealed transport chamber that forms, at least in part, a vacuum portion of the apparatus and has four facets of the substantially hexahedron shaped sealed transport chamber connecting a top plane and a bottom plane of the substantially hexahedron shaped sealed transport chamber, each facet having a substrate transport opening configured for sealed communication with substrate holding modules, each transport opening having a sealable valve; a robotic transport arm disposed within the substantially hexahedron shaped sealed transport chamber, the robotic transport arm having a common substrate holder effecting each substrate transfer of the robotic transfer arm on a common substrate transfer plane through the substrate transport opening on each facet of the four facets of the substantially hexahedron shaped sealed transport chamber; a load lock connected to a facet of the four facets of the substantially hexahedron shaped sealed transport chamber for connecting the equipment front end module to the substantially hexahedron shaped sealed transport chamber; and a second sealed transport chamber that forms, at least in part, the vacuum portion of the apparatus and has more than four facets and being communicably connected to one other facet of three remaining facets of the four facets of the substantially hexahedron shaped sealed transport chamber through the sealable valve of the other facet of the substantially hexahedron shaped sealed transport chamber, wherein the robotic transport arm is configured to extend through the sealable valve on each facet of the four facets of the substantially hexahedron shaped sealed transport chamber, each facet of the second sealed transport chamber having a substrate transport opening configured for sealed communication with other substrate holding modules. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An apparatus comprising:
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an equipment front end module that forms an ambient atmospheric portion of the apparatus; a substantially hexahedron shaped sealed transport chamber that forms, at least in part, a vacuum portion of the apparatus and has four facets of the substantially hexahedron shaped sealed transport chamber connecting a top plane and a bottom plane of the substantially hexahedron shaped sealed transport chamber, each facet having a substrate transport opening configured for sealed communication, through a sealable valve, with substrate holding modules; a load lock connected to a facet of the four facets of the substantially hexahedron shaped sealed transport chamber for connecting the equipment front end module to the substantially hexahedron shaped sealed transport chamber; a second sealed transport chamber that forms, at least in part, the vacuum portion of the apparatus and has more than four facets and being communicably connected to one of the other three facets of the four facets of the substantially hexahedron shaped sealed transport chamber through a respective sealable valve, each facet of the second sealed transport chamber having a substrate transport opening configured for sealed communication with other substrate holding modules; and an unequal length arm link compact SCARA robot transfer arm disposed in at least one of the substantially hexahedron shaped sealed transport chamber and the second sealed transport chamber, wherein the unequal length arm link compact SCARA robot transfer arm is configured to extend through the sealable valve between the substantially hexahedron shaped sealed transport chamber and the second sealed transport chamber, the unequal length arm link compact SCARA robot transfer arm has a common substrate holder effecting each substrate transfer of the unequal length arm link compact SCARA robot transfer arm on a common substrate transfer plane through the sealable valve on each facet of the at least one of the substantially hexahedron shaped sealed transport chamber and the second sealed transport chamber and maintains a balanced processing capacity between the substantially hexahedron shaped sealed transport chamber and the second sealed transport chamber with the common substrate holder. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21)
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Specification