Laser film debonding method

• US 10,086,597 B2
• Filed: 01/15/2015
• Issued: 10/02/2018
• Est. Priority Date: 01/21/2014
• Status: Active Grant

• Current Assignee: General Lasertronics Corporation
• Original Assignee: General Lasertronics Corporation
• Inventors: Simko, Richard T.
• Primary Examiner(s): Valentine, Jami M
• Application Number:
  US14/598,031
• Publication Number:
  US 20150202858A1
• Time in Patent Office: 1,356 Days
• Field of Search: 156712, 156753, 438157, 438458, 438459, 438463
• CPC Class Codes: B23K 26/38 by boring or cutting
• CPC Class Codes: B23K 26/50 Working by transmitting the laser beam through or within the workpiece
• CPC Class Codes: B29C 63/0013 Removing old coatings
• CPC Class Codes: B29L 2031/087 Propellers
• CPC Class Codes: B32B 43/006 Delaminating
• CPC Class Codes: Y10T 156/1158 Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]
• CPC Class Codes: Y10T 156/1917 Electromagnetic radiation delaminating means [e.g., microwave, uv, ir, etc.]

Abstract

A laser-based coating removal method debonds a film from a substrate rather than ablating the film. A laser light is transmitted through a transparent film to an underlying bonding layer for bonding the film to one or more additional films and/or a substrate. The laser light is absorbed at the bonding layer and the transparent film is released. In some embodiments, after the transparent film is released it is able to be physically removed.

Claims

1. A method of removing a transparent protective surface film from a substrate comprising a first material, the method comprising:

a. transmitting a laser light at a wavelength to transmit through the transparent protective surface film and to be absorbed at an underlying and separately applied bonding layer, wherein the underlying bonding layer adheres the protective surface film to the substrate, and wherein the protective surface film comprises a second material different from the first material;

b. absorbing the laser light at the bonding at the layer, wherein the bonding layer comprises a third material different from the first material and the second material,

wherein as the laser light is absorbed at the bonding layer, the transparent protective surface film is released; and

c. discarding the transparent protective surface film.

2. The method of claim 1, wherein the film comprises polyurethane.

3. The method of claim 1, wherein the substrate comprises one of a fiberglass composite, a carbon fiber and epoxy composite, and a composite foam material.

4. The method of claim 1, wherein the transparent film ranges from 0.001 inches to 0.300 inches thickness.

5. The method of claim 1, wherein the laser wavelength is in the near infrared.

6. The method of claim 1, wherein the laser wavelength is 1064 nanometers.

7. The method of claim 1, wherein the method is machine controlled.

8. The method of claim 1, wherein the method is manual such that a laser work head is moved by hand by over a work piece.

9. The method of claim 1, wherein the laser comprises a pulsed Nd:

YAG laser.

10. The method of claim 1, wherein the laser average power is at least 10 watts.

11. The method of claim 1, wherein the laser repetition rate is at least 100 per second.

12. The method of claim 1, wherein a laser spot size ranges from 0.1 mm to 10 mm diameter.

13. A method of removing a protective film from a substrate comprising:

a. transmitting a laser light at a wavelength to transmit through a first film layer to a second film layer above the substrate and to be absorbed at an adhering interface between the first film layer and the second film layer wherein the first film layer and the second film layer comprise a first same material and the adhering interface comprises a second material different from the first material; and

b. absorbing the laser light at the adhering interface between the first film layer and the second film layer,

wherein as the laser light is absorbed at the interface, the first film and the second film are debonded.

14. The method of claim 13, wherein the first film layer and the second film layer comprise polyurethane.

15. The method of claim 13, wherein the first film layer remains intact as the first film and the second film are debonded.

16. The method of claim 13, wherein the protective film layers range ranges from 0.001 inches to 0.300 inches thickness.

17. The method of claim 13, wherein the laser wavelength is in the near infrared.

18. The method of claim 13, wherein the laser wavelength is 1064 nanometers.

19. A method of removing one or more protective films from a substrate comprising:

a. transmitting a laser light at a wavelength to transmit through one or more than one transparent films and to be absorbed at an adhering interface between a last film above the substrate and a second to last film wherein the last film and the second to last film comprise a first same material and the adhering interface comprises a second material different from the first material; and

b. absorbing the laser light at the adhering interface between the last film above the substrate and the second to last film,

wherein as the laser light is absorbed at the interface, the last film and the second to the last film are debonded.

20. The method of claim 19, wherein the last film above the substrate and the second to last film comprise polyurethane.

21. The method of claim 19, wherein the second to last film remains intact as the last film and the second to the last film are debonded.

22. The method of claim 19, wherein the protective film ranges from 0.001 inches to 0.300 inches thickness.

23. The method of claim 19, wherein the laser wavelength is in the near infrared.

24. The method of claim 19, wherein the laser wavelength is 1064 nanometers.

25. A laser-based coating removal system to remove a protective surface coating from a surface, wherein the surface comprises a first material, the system comprising:

a. a laser source configured to provide a laser pulse;

b. a laser scanning head coupled to the laser source and configured to direct the laser pulse onto a position on the surface, wherein the laser pulse is configured with a wavelength such that the laser pulse passes through one or more transparent protective surface films and is absorbed at an underlying and separately applied bonding layer, wherein the underlying bonding layer adheres the protective surface film to the surface, and wherein the one or more transparent protective surface films comprise a second material different from the first material and the bonding layer comprises a third material different from the first material and the second material, and wherein as the laser light is absorbed at the bonding layer, the one or more transparent protective surface films are released.

26. The system of claim 25, wherein the laser scanning head is machine controlled.

27. The system of claim 25, wherein the laser scanning head is manually controlled such that a work head is moved by hand by over the surface.

28. The system of claim 25, wherein the protective film ranges from 0.001 inches to 0.300 inches thickness.

29. The system of claim 25, wherein the laser wavelength is in the near infrared.

30. The system of claim 25, wherein the laser wavelength is 1064 nanometers.

31. The system of claim 25, wherein the laser comprises a pulsed Nd:

YAG laser.

32. The system of claim 25, wherein the laser average power is at least 10 watts.

33. The system of claim 25, wherein the laser repetition rate is at least 100 per second.

34. The system of claim 25, wherein a laser spot size ranges from 0.1 mm to 10 mm diameter.