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Integrated magnetic field sensor and method of powering on and off a load

  • US 10,088,533 B2
  • Filed: 01/12/2016
  • Issued: 10/02/2018
  • Est. Priority Date: 01/14/2015
  • Status: Active Grant
First Claim
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1. An integrated magnetic field sensor comprising:

  • a semiconductor substrate disposed within an integrated circuit package, wherein the integrated circuit package comprises a thermal pad configured to thermally couple the substrate to a circuit board;

    a magnetic field sensing circuit disposed upon or within the substrate and operable to generate a two-state signal responsive to a magnetic field; and

    a power driving circuit disposed upon or within the substrate and operable to generate, in response to the two-state signal, a power driving signal having a higher power state and a lower power state.

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