IC chip card with integrated biometric sensor pads
First Claim
1. A chip card comprising:
- a card body and an integrated circuit (IC) chip module located in a recess provided by the card body on one side of the chip card-;
-, wherein said IC chip module includes;
a substrate having outward-facing and inward-facing surfaces;
a first plurality of contact pads supportably interconnected to said outward-facing surface of the substrate for contact engagement with at least one appendage of a user;
a first IC chip supportably interconnected to the inward-facing surface of the substrate and electrically interconnected to the first plurality of contact pads for processing a biometric signal received therefrom; and
,a second plurality of contact pads supportably interconnected to said outward-facing surface of the substrate for contact communication with a contact chip card reader; and
,a first antenna for contactless communication with a contactless chip card reader, wherein said first antenna is supportably interconnected to said inward-facing surface of said substrate of the IC chip module, wherein each of said first plurality of contact pads and second plurality of contact pads is electrically interconnected through said substrate to a different corresponding electrically conductive contact supportably interconnected to the inward-facing surface of the substrate, and wherein said first antenna is disposed in in non-overlapping relation to each of said contacts corresponding with said first plurality of contact pads and said second plurality of contact pads.
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Accused Products
Abstract
An integrated circuit (IC) chip card includes a card body and an integrated IC chip module located in a recess provided by the card body on one side thereof. The IC chip module includes a substrate having outward-facing and inward-facing surfaces, and a first plurality of contact pads supportably interconnected to the outward-facing surface of the substrate for contact engagement with at least one appendage of a user. The IC chip module further includes a first IC chip supportably interconnected to the inward-facing surface of the substrate and electrically interconnected to the first plurality of contact pads for processing a biometric signal received therefrom. The IC chip module may also include a second plurality of contact pads supportably interconnected to the outward-facing surface of the substrate for engaging a contact card reader for contact communication signal transmissions and/or a first antenna supportably interconnected to the inward-facing surface of the substrate for contactless communication signal transmissions with a contactless card reader. Communication signal processing may be completed by the first IC chip and/or a second IC chip supportably interconnected to the inward-facing surface of the substrate.
112 Citations
27 Claims
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1. A chip card comprising:
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a card body and an integrated circuit (IC) chip module located in a recess provided by the card body on one side of the chip card-;
-, wherein said IC chip module includes;a substrate having outward-facing and inward-facing surfaces; a first plurality of contact pads supportably interconnected to said outward-facing surface of the substrate for contact engagement with at least one appendage of a user; a first IC chip supportably interconnected to the inward-facing surface of the substrate and electrically interconnected to the first plurality of contact pads for processing a biometric signal received therefrom; and
,a second plurality of contact pads supportably interconnected to said outward-facing surface of the substrate for contact communication with a contact chip card reader; and
,a first antenna for contactless communication with a contactless chip card reader, wherein said first antenna is supportably interconnected to said inward-facing surface of said substrate of the IC chip module, wherein each of said first plurality of contact pads and second plurality of contact pads is electrically interconnected through said substrate to a different corresponding electrically conductive contact supportably interconnected to the inward-facing surface of the substrate, and wherein said first antenna is disposed in in non-overlapping relation to each of said contacts corresponding with said first plurality of contact pads and said second plurality of contact pads. - View Dependent Claims (2, 3, 4, 5, 6, 26, 27)
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7. A chip card comprising:
card body and an integrated circuit (IC) chip module located in a recess provided by the card body on one side of the chip card, wherein said IC chip module includes; a substrate having outward-facing and in-ward facing surfaces; a first plurality of contact pads supportably interconnected to said outward-facing surface of the substrate for contact engagement with at least one appendage of a user; a first IC chip supportably interconnected to the inward-facing surface of the substrate and electrically interconnected to the first plurality of contact pads for processing a biometric signal received therefrom; and a second plurality of contact pads supportably interconnected to said outward-facing surface of the substrate for contact communication with a contact chip card reader, wherein said second plurality of contact pads are located within a predetermined area within said recess on said one side of the chip card, and said first plurality of contact pads are located outside of and adjacent to said predetermined area and within said recess on said one side of the chip card, and wherein said first plurality of contact pads include first and second pads spaced by at least a predetermined distance that is greater than a distance between any two of said second plurality of contact pads. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15)
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16. A chip card comprising:
a card body and an integrated circuit (IC) chip module located in a recess provided by the card body on one side of the chip card, wherein said IC chip module includes; a substrate having outward-facing and inward-facing surfaces; a first plurality of contact pads supportably interconnected to said outward-facing surface of the substrate for contact engagement with at least one appendage of a user; a first IC chip supportably interconnected to the outward-facing surface of the substrate and electrically interconnect to the first plurality of contact pads for processing a biometric signal received therefrom; and a second plurality of contact pads supportably interconnected to said outward-facing surface of the substrate for contact communication with a contact chip reader, wherein said first and second plurality of contact pads are collectively located for electrical interconnection with said first IC chip in compliance with ISO/IEC Standard 7816-2. - View Dependent Claims (17, 18, 19, 20)
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21. A chip card comprising:
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a card body and an integrated circuit (IC) chip module located in a recess provided by the card body on one side of the chip card, wherein said IC chip module includes; a substrate having outward-facing and inward-facing surfaces; a first plurality of contact pads supportably interconnected to said outward-facing surface of the substrate for contact engagement with at least one appendage of a user; a first IC chip supportably interconnected to the inward-facing surface of the substrate and electrically interconnected to the first plurality of contact pads for processing a biometric signal received therefrom; and
,a second plurality of contact pads supportably interconnected to said outward-facing surface of the substrate for contact communication with a contact chip card reader; and
,a first antenna for contactless communication with a contactless chip card reader; and
,a metallic member for channeling electromagnetic waves received from a contactless chip card reader toward the first antenna, wherein the first antenna is operable to utilize said electromagnetic waves to power operation of said first IC chip. - View Dependent Claims (22, 23, 24, 25)
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Specification