Conductive connections, structures with such connections, and methods of manufacture

• US 10,090,231 B2
• Filed: 09/26/2017
• Issued: 10/02/2018
• Est. Priority Date: 05/12/2014
• Status: Active Grant

• Current Assignee: Invensas Corporation
• Original Assignee: Invensas Corporation
• Inventors: Uzoh, Cyprian Emeka, Katkar, Rajesh
• Primary Examiner(s): Kraig, William F
• Assistant Examiner(s): Rahman, Khatib
• Application Number:
  US15/715,515
• Publication Number:
  US 20180019191A1
• Time in Patent Office: 371 Days
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B23K 35/0244 Powders, particles or spheres; Preforms made therefrom
• CPC Class Codes: B23K 35/0266 flux-cored
• CPC Class Codes: B23K 35/22 characterised by the composition or nature of the material
• CPC Class Codes: B32B 15/01 all layers being exclusively metallic making layered metal workpieces by pressure cladding B23K20/22; making coatings with a metallic material characterised by its composition C23C30/00
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/03 Manufacturing methods
• CPC Class Codes: H01L 2224/03001 Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
• CPC Class Codes: H01L 2224/03009 for protecting parts during manufacture
• CPC Class Codes: H01L 2224/03318 by dispensing droplets
• CPC Class Codes: H01L 2224/0332 Screen printing, i.e. using a stencil
• CPC Class Codes: H01L 2224/0333 in solid form
• CPC Class Codes: H01L 2224/03334 using a preform
• CPC Class Codes: H01L 2224/0348 Permanent masks, i.e. masks left in the finished device, e.g. passivation layers
• CPC Class Codes: H01L 2224/03848 Thermal treatments, e.g. annealing, controlled cooling
• CPC Class Codes: H01L 2224/03849 Reflowing
• CPC Class Codes: H01L 2224/039 : Methods of manufacturing bonding areas involving a specific sequence of method steps
• CPC Class Codes: H01L 2224/03901 : with repetition of the same manufacturing step
• CPC Class Codes: H01L 2224/0391 : Forming a passivation layer after forming the bonding area
• CPC Class Codes: H01L 2224/04105 : Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/05022 : the internal layer being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/051 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/05294 : with a principal constituent of the material being a liquid not provided for in groups H01L2224/052 - H01L2224/05291
• CPC Class Codes: H01L 2224/05547 : comprising a core and a coating
• CPC Class Codes: H01L 2224/05567 : the external layer being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/05573 : Single external layer
• CPC Class Codes: H01L 2224/05582 : Two-layer coating
• CPC Class Codes: H01L 2224/056 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/05794 : with a principal constituent of the material being a liquid not provided for in groups H01L2224/057 - H01L2224/05791
• CPC Class Codes: H01L 2224/05839 : Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/05844 : Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05847 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05855 : Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/0603 : Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/06102 : the bonding areas being at different heights
• CPC Class Codes: H01L 2224/10145 : Flow barriers
• CPC Class Codes: H01L 2224/11001 : Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
• CPC Class Codes: H01L 2224/11005 : for aligning the bump connector, e.g. marks, spacers
• CPC Class Codes: H01L 2224/11009 : for protecting parts during manufacture
• CPC Class Codes: H01L 2224/111 : Manufacture and pre-treatment of the bump connector preform
• CPC Class Codes: H01L 2224/11318 : by dispensing droplets
• CPC Class Codes: H01L 2224/1132 : Screen printing, i.e. using a stencil
• CPC Class Codes: H01L 2224/11334 : using preformed bumps
• CPC Class Codes: H01L 2224/1134 : Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/11848 : Thermal treatments, e.g. annealing, controlled cooling
• CPC Class Codes: H01L 2224/11849 : Reflowing
• CPC Class Codes: H01L 2224/119 : Methods of manufacturing bump connectors involving a specific sequence of method steps
• CPC Class Codes: H01L 2224/11901 : with repetition of the same manufacturing step
• CPC Class Codes: H01L 2224/1191 : Forming a passivation layer after forming the bump connector
• CPC Class Codes: H01L 2224/13005 : Structure
• CPC Class Codes: H01L 2224/13017 : being non uniform along the bump connector
• CPC Class Codes: H01L 2224/13018 : comprising protrusions or indentations
• CPC Class Codes: H01L 2224/13021 : the bump connector being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/13022 : the bump connector being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/13082 : Two-layer arrangements
• CPC Class Codes: H01L 2224/131 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/13116 : Lead [Pb] as principal constituent
• CPC Class Codes: H01L 2224/13139 : Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/13144 : Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13147 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13155 : Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/13169 : Platinum [Pt] as principal constituent
• CPC Class Codes: H01L 2224/1319 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/13294 : with a principal constituent of the material being a liquid not provided for in groups H01L2224/132 - H01L2224/13291
• CPC Class Codes: H01L 2224/133 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/13339 : Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/13344 : Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13347 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13355 : Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/13561 : On the entire surface of the core, i.e. integral coating
• CPC Class Codes: H01L 2224/13562 : On the entire exposed surface of the core
• CPC Class Codes: H01L 2224/13565 : Only outside the bonding interface of the bump connector
• CPC Class Codes: H01L 2224/136 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/13609 : Indium [In] as principal constituent
• CPC Class Codes: H01L 2224/13611 : Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/1403 : Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/16058 : being non uniform along the bump connector
• CPC Class Codes: H01L 2224/16059 : comprising protrusions or indentations
• CPC Class Codes: H01L 2224/16145 : the bodies being stacked
• CPC Class Codes: H01L 2224/16147 : the bump connector connecting to a bonding area disposed in a recess of the surface
• CPC Class Codes: H01L 2224/16148 : the bump connector connecting to a bonding area protruding from the surface
• CPC Class Codes: H01L 2224/16227 : the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/16238 : the bump connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/1701 : Structure
• CPC Class Codes: H01L 2224/1703 : Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/17181 : On opposite sides of the body
• CPC Class Codes: H01L 2224/17505 : Bump connectors having different materials
• CPC Class Codes: H01L 2224/2101 : Structure
• CPC Class Codes: H01L 2224/211 : Disposition
• CPC Class Codes: H01L 2224/2401 : Structure
• CPC Class Codes: H01L 2224/2402 : Laminated, e.g. MCM-L type
• CPC Class Codes: H01L 2224/24137 : the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/24146 : the HDI interconnect connecting to the same level of the lower semiconductor or solid-state body at which the upper semiconductor or solid-state body is mounted
• CPC Class Codes: H01L 2224/2919 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32145 : the bodies being stacked
• CPC Class Codes: H01L 2224/73104 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73204 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73267 : Layer and HDI connectors
• CPC Class Codes: H01L 2224/75253 : adapted for localised heating
• CPC Class Codes: H01L 2224/81 : using a bump connector
• CPC Class Codes: H01L 2224/81138 : the guiding structures being at least partially left in the finished device
• CPC Class Codes: H01L 2224/81141 : Guiding structures both on and outside the body
• CPC Class Codes: H01L 2224/81193 : wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81203 : Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
• CPC Class Codes: H01L 2224/8121 : using a reflow oven
• CPC Class Codes: H01L 2224/8122 : with energy being in the form of electromagnetic radiation
• CPC Class Codes: H01L 2224/81224 : using a laser
• CPC Class Codes: H01L 2224/81815 : Reflow soldering
• CPC Class Codes: H01L 2224/82005 : being a temporary or sacrificial substrate
• CPC Class Codes: H01L 2224/82101 : by additive methods, e.g. direct writing
• CPC Class Codes: H01L 2224/82102 : using jetting, e.g. ink jet
• CPC Class Codes: H01L 2224/82105 : by using a preform
• CPC Class Codes: H01L 2224/83 : using a layer connector
• CPC Class Codes: H01L 2224/8385 : using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 2224/9211 : Parallel connecting processes
• CPC Class Codes: H01L 2225/06513 : Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/1023 : the support being an insulating substrate
• CPC Class Codes: H01L 2225/1058 : Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 23/3114 : the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 23/3135 : Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 23/49811 : Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 24/03 : Manufacturing methods
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/06 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/14 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/17 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/19 : Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/20 : Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 24/24 : of an individual high density interconnect connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/742 : Apparatus for manufacturing bump connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/82 : by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/98 : Methods for disconnecting semiconductor or solid-state bodies
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/105 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/07025 : Polyimide
• CPC Class Codes: H01L 2924/15192 : Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15321 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/3512 : Cracking
• CPC Class Codes: H01L 2924/381 : Pitch distance
• CPC Class Codes: H01L 2924/3841 : Solder bridging

Abstract

A solder connection may be surrounded by a solder locking layer (1210, 2210) and may be recessed in a hole (1230) in that layer. The recess may be obtained by evaporating a vaporizable portion (1250) of the solder connection. Other features are also provided.

Claims

1. A manufacturing method comprising:

obtaining a first structure comprising;

one or more first components each of which comprises solder and a material sublimatable or vaporizable when the solder is melted; and

a first layer comprising a top surface and one or more holes in the top surface, each hole containing at least a segment of a corresponding first component;

heating each first component to sublimate or vaporize at least part of each sublimatable or vaporizable material and provide an electrically conductive connection at a location of each first component;

wherein in the heating operation at least part of each first component recedes down from the top surface to provide or increase a recess in each hole at the top surface.

2. The method of claim 1 wherein each hole is a through-hole.

3. The method of claim 1 wherein each hole'"'"'s sidewall is a dielectric sidewall.

4. The method of claim 1 wherein the first layer is dielectric.

5. The method of claim 1 wherein the first layer is formed by molding.

6. The method of claim 1 further comprising:

obtaining a second structure with one or more protruding conductive posts; and

inserting each conductive post into a corresponding recess provided or increased in the heating operation, and forming a solder bond in each recess between the corresponding conductive post and the corresponding electrically conductive connection.

7. The method of claim 1 wherein before the heating operation, at least a segment of each first component either:

comprises a solder core coated with the sublimatable or vaporizable material;

or

consists of the sublimatable or vaporizable material.

8. The method of claim 7 wherein in obtaining the first structure, the one or more first components are formed before the first layer.

9. The method of claim 1 wherein in obtaining the first structure, the one or more first components are formed after the first layer, and forming the one or more first components comprises depositing the solder and the sublimatable or vaporizable material into each hole.

10. The method of claim 9 wherein depositing the solder and the sublimatable or vaporizable material into each hole comprises:

(a) depositing a portion of the solder and a portion of the sublimatable or vaporizable material into each hole;

then

(b) heating the solder and the sublimatable or vaporizable material in each hole to sublimate or vaporize at least some of the sublimatable or vaporizable material in each hole and to cause the remaining solder to recede down and provide or increase a recess in each hole; and

then

(c) depositing additional solder and additional sublimatable or vaporizable material into at least one hole.

11. The method of claim 10 wherein the operation (c) comprises repeating the operations (a) and (b) one or more times.

12. The method of claim 10 wherein in the operation (c), the additional solder and the additional sublimatable or vaporizable material are deposited into less than all holes.

13. The method of claim 12 wherein the method results in recesses of different depths in at least two different holes.

14. The method of claim 10 wherein:

operation (a) comprises depositing, into each hole, a first material comprising said portion of the solder;

operation (c) comprises depositing, into at least one hole, a second material comprising said additional solder; and

the first material has a different composition than the second material.

15. The method of claim 14 wherein at at least one temperature at which both the first and second materials are not solid, the first material is less viscous than the second material.

16. The method of claim 14 wherein at at least one temperature, the second material is less oxidizable than the first material.

17. The method of claim 14 wherein the second material provides a better barrier to contamination or corrosion than the first material.

18. The method of claim 14 wherein the second material has at least one element of a group consisting of copper, silver, gold, and nickel, and the first material does not have said element or has a lower concentration of said element than the first material.

19. The method of claim 14 wherein the first material has a smaller percentage of the sublimatable or vaporizable material than does the second material.

20. The method of claim 1 wherein the first structure comprises an integrated circuit.

21. The method of claim 1 wherein in a top view, at least a segment of each electrically conductive connection is completely laterally surrounded by the first layer.

22. The method of claim 1 wherein at the solder'"'"'s melting temperature, the sublimatable or vaporizable material has a lower density than the solder.