Low equivalent series resistance RF filter for an AIMD

• US 10,092,749 B2
• Filed: 09/14/2017
• Issued: 10/09/2018
• Est. Priority Date: 03/01/2011
• Status: Active Grant

• Current Assignee: Greatbatch Limited (Greatbatch Incorporated)
• Original Assignee: Greatbatch Limited (Greatbatch Incorporated)
• Inventors: Stevenson, Robert A., Johnson, Robert Shawn, Dabney, Warren S., Marzano, Thomas, Brendel, Richard L., Williams, Christopher Michael, Moschiano, Holly Noelle, Seitz, Keith W., Roberts, John E.
• Primary Examiner(s): Layno, Carl H
• Assistant Examiner(s): Piateski, Erin M
• Application Number:
  US15/704,657
• Publication Number:
  US 20180008822A1
• Time in Patent Office: 390 Days
• Field of Search: 607 36
• CPC Class Codes: A61N 1/086 Magnetic resonance imaging [MRI] compatible leads
• CPC Class Codes: A61N 1/3718 Monitoring of or protection against external electromagnetic fields or currents
• CPC Class Codes: A61N 1/3754 Feedthroughs
• CPC Class Codes: A61N 1/3758 Packaging of the components within the casing
• CPC Class Codes: H01G 4/005 Electrodes
• CPC Class Codes: H01G 4/12 Ceramic dielectrics H01G4/085 takes precedence
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence
• CPC Class Codes: H01G 4/35 Feed-through capacitors or anti-noise capacitors
• CPC Class Codes: H03H 1/0007 of radio frequency interference filters

Abstract

An AIMD includes a conductive housing, an electrically conductive ferrule with an insulator hermetically sealing the ferrule opening. A conductive pathway is hermetically sealed and disposed through the insulator. A filter capacitor is disposed on a circuit board within the housing and has a dielectric body supporting at least two active and two ground electrode plates interleaved, wherein the at least two active electrode plates are electrically connected to the conductive pathway on the device side, and the at least two ground electrode plates are electrically coupled to either the ferrule and/or the conductive housing. The dielectric body has a dielectric constant less than 1000 and a capacitance of between 10 and 20,000 picofarads. The filter capacitor is configured for EMI filtering of MRI high RF pulsed power by a low ESR, wherein the ESR of the filter capacitor at an MRI RF pulsed frequency or range of frequencies is less than 2.0 ohms.

Claims

1. A low equivalent series resistance filter capacitor assembly for an active implantable medical device, the filter capacitor assembly comprising:

a) an electrically conductive ferrule defining a ferrule opening, wherein the ferrule is configured to be attachable to an opening in a housing of an active implantable medical device;

b) an insulator at least partially residing in the ferrule opening and being hermetically sealed to the ferrule, wherein the insulator extends from an insulator body fluid side to an insulator device side with an insulator via hole extending through the insulator to the insulator body fluid and device sides;

c) an active conductive pathway hermetically sealed to the insulator in the via hole, the active conductive pathway extending from an active conductive pathway body fluid side to an active conductive pathway device side, wherein the active conductive pathway is in a non-conductive relationship with the ferrule;

d) a filter capacitor, comprising;

i) a ceramic dielectric body having a dielectric constant that is greater than zero, but less than 1,000;

ii) at least two active electrode plates interleaved with at least two ground electrode plates supported in the ceramic dielectric body;

iii) a capacitance that ranges from 10 and 20,000 picofarads; and

iv) an equivalent series resistance (ESR), which is the sum of a dielectric loss plus an ohmic loss of the ceramic dielectric body, that is greater than zero, but less than 2.0 ohms at a range of MRI RF pulsed frequencies,

v) wherein an active metallization supported on the ceramic dielectric body is electrically connected to the at least two active electrode plates, and a ground metallization supported on the ceramic dielectric body is electrically connected to the at least two ground electrode plates of the filter capacitor; and

e) a first electrical connection electrically connecting the active metallization of the filter capacitor to the active conductive pathway device side;

f) a second electrical connection electrically connecting the ground metallization of the filter capacitor to the ferrule; and

wherein, starting from the insulator on the device side, the filter capacitor is the first capacitor that is electrically connected between the active conductive pathway and the ferrule.

2. The filter capacitor assembly of claim 1, wherein the insulator comprises a glass that is hermetically sealed to the ferrule and the conductive pathway comprises a conductive leadwire.

3. The filter capacitor assembly of claim 1, wherein insulator is a ceramic insulator and the conductive pathway comprises a conductive leadwire that is hermetically sealed to the ceramic insulator by a first gold braze, and wherein the ceramic insulator is hermetically sealed to the ferrule by a second gold braze.

4. The filter capacitor assembly of claim 1, wherein the filter capacitor comprises a monolithic ceramic feedthrough capacitor mounted adjacent to at least one of the ferrule and the insulator.

5. The filter capacitor assembly of claim 1, wherein the filter capacitor is selected from the group consisting of a monolithic ceramic feedthrough filter capacitor, multilayer ceramic capacitor (MLCC), a flat-through capacitor, a chip capacitor, and an X2Y attenuator.

6. The filter capacitor assembly of claim 1, wherein the filter capacitor is part of a multi-element broadband lowpass filter having at least one inductor.

7. The filter capacitor assembly of claim 6, wherein the multi-element broadband lowpass filter is selected from the group consisting of a C filter, an L filter, a reverse L filter, a Pi filter, a T filter, an LL filter, a reverse LL filter, and an n-element lowpass filter.

8. The filter capacitor assembly of claim 1, wherein the active conductive pathway is selected from the group consisting of a leadwire, a co-fired conductive fill, and a co-fired conductive paste.

9. The filter capacitor assembly of claim 1, wherein the first and second electrical connections comprise a material that is selected from the group consisting of a solder, a braze, a thermal-setting conductive epoxy, a thermal-setting conductive polyimide, and a conductive polyimide.

10. The filter capacitor assembly of claim 1, wherein the filter capacitor has a dielectric loss tangent measured in ohms that is greater than zero, but less than five percent of the ESR of the filter capacitor or at the range of MRI RF pulsed frequencies.

11. The filter capacitor assembly of claim 1, wherein the ESR of the filter capacitor at the range of MRI RF pulsed frequencies is greater than zero, but less than 0.5 ohms.

12. The filter capacitor assembly of claim 1, wherein the ESR of the filter capacitor at the range of MRI RF pulsed frequencies is greater than zero, but less than 0.1 ohms.

13. The filter capacitor assembly of claim 1, wherein the MRI RF pulsed frequency is a range of frequencies centered at 64 MHz or 128 MHz.

14. The filter capacitor assembly of claim 1, wherein the capacitance of the filter capacitor ranges from 350 to 10,000 picofarads.

15. The filter capacitor assembly of claim 1, wherein the ceramic dielectric body of the filter capacitor supports at least ten active electrode plates interleaved with at least ten ground electrode plates.

16. The filter capacitor assembly of claim 1, wherein an insulative washer is disposed between the filter capacitor and the insulator or the ferrule or, between the filter capacitor and both the insulator and the ferrule.

17. The filter capacitor assembly of claim 1, wherein at least one first diode is electrically connected to the leadwire device side and the active metallization of the filter capacitor, and wherein at least one second diode end is electrically connected to the ground metallization of the filter capacitor and the ferrule.

18. The filter capacitor assembly of claim 17, wherein at least one of the first and second diodes comprises back-to-back diodes.

19. The filter capacitor assembly of claim 17, wherein a diode or back-to-back diodes are electrically connected in parallel with the filter capacitor.

20. A low equivalent series resistance filter capacitor assembly for an active implantable medical device, the filter capacitor assembly comprising:

a) an electrically conductive ferrule defining a ferrule opening, wherein the ferrule is configured to be attachable to an opening in a housing of an active implantable medical device;

b) an alumina insulator at least partially residing in the ferrule opening and being hermetically sealed to the ferrule, wherein the alumina insulator extends from an insulator body fluid side to an insulator device side;

c) a conductive pathway hermetically sealed to the alumina insulator, the conductive pathway extending from a conductive pathway body fluid side to a conductive pathway device side, wherein the conductive pathway is in a non-conductive relationship with the ferrule, and wherein the conductive pathway is selected from the group consisting of a conductive leadwire, a platinum fill, and a conductive paste, and combinations thereof, the platinum fill and conductive paste characterized as having been co-fired with the alumina insulator;

d) a filter capacitor, comprising;

i) a ceramic dielectric body having a dielectric constant that is greater than zero, but less than 1,000;

ii) at least two active electrode plates interleaved with at least two ground electrode plates supported in the ceramic dielectric body;

iii) a capacitance that ranges from 10 and 20,000 picofarads; and

iv) an equivalent series resistance (ESR), which is the sum of a dielectric loss plus an ohmic loss of the ceramic dielectric body, that is greater than zero, but less than 2.0 ohms at a range of MRI RF pulsed frequencies,

v) wherein an active metallization supported on the ceramic dielectric body is electrically connected to the at least two active electrode plates, and a ground metallization supported on the ceramic dielectric body is electrically connected to the at least two ground electrode plates of the filter capacitor, and

vi) wherein, starting from the alumina insulator on the device side, the filter capacitor is the first capacitor that is electrically connected between the conductive pathway and the ferrule; and

e) a first electrical connection material electrically connecting the conductive pathway device side to the active metallization of the filter capacitor; and

f) a second electrical connection material electrically connecting the ground metallization of the filter capacitor to the ferrule.

21. The filter capacitor assembly of claim 20, wherein the ceramic dielectric body has a dielectric constant that is greater than 0, but less than 200.

22. The filter capacitor assembly of claim 20, wherein the ceramic dielectric body has a dielectric constant that is greater than 0, but less than 90.

23. The filter capacitor assembly of claim 21, wherein the ceramic dielectric body has a dielectric constant that is greater than 0, but less than 60.

24. The filter capacitor assembly of claim 20, wherein the first and second electrical connections comprise a material that is selected from the group consisting of a solder, a braze, a thermal-setting conductive epoxy, a thermal-setting conductive polyimide, and combinations thereof.

25. The filter capacitor assembly of claim 20, wherein the filter capacitor has a dielectric loss tangent measured in ohms that is greater than zero, but less than five percent of the ESR of the filter capacitor at the range of MRI RF pulsed frequencies.

26. The filter capacitor assembly of claim 20, wherein the ESR of the filter capacitor at the range of MRI RF pulsed frequencies is greater than zero, but less than 0.5 ohms.

27. The filter capacitor assembly of claim 20, wherein the MRI RF pulsed frequency is a range of frequencies centered at 64 MHz or 128 MHz.

28. The filter capacitor assembly of claim 20, wherein the capacitance of the filter capacitor ranges from 350 to 10,000 picofarads.

29. The filter capacitor assembly of claim 20, wherein the filter capacitor is selected from the group consisting of a monolithic ceramic feedthrough filter capacitor, a flat-through capacitor, an MLCC chip capacitor, and an X2Y attenuator.

30. The filter capacitor assembly of claim 20, wherein the filter capacitor is part of a multi-element broadband lowpass filter having at least one inductor.

31. The filter capacitor assembly of claim 30, wherein the multi-element broadband lowpass filter is selected from the group consisting of a C filter, an L filter, a reverse L filter, a Pi filter, a T filter, an LL filter, a reverse LL filter, and an n-element lowpass filter.

32. The filter capacitor assembly of claim 20, wherein an insulative washer is disposed between the filter capacitor and the alumina insulator or the ferrule or, between the filter capacitor and both the alumina insulator and the ferrule.

33. A filter assembly for an active implantable medical device, the filter assembly comprising:

a) an electrically conductive ferrule defining a ferrule opening, wherein the ferrule is configured to be attachable to an opening in a housing of an active implantable medical device;

b) an insulator hermetically sealed to the ferrule, wherein the insulator extends from an insulator body fluid side to an insulator device side;

c) a hermetically sealed conductive pathway extending through the insulator to the insulator body fluid side and to the insulator device side, the conductive pathway being in a non-conductive relationship with the ferrule;

d) a filter capacitor, comprising;

i) a ceramic dielectric body having a dielectric constant that is greater than zero, but less than 1,000;

ii) at least two active electrode plates interleaved with at least two ground electrode plates supported in the ceramic dielectric body,

iii) a capacitance that ranges from 10 and 20,000 picofarads; and

iv) an equivalent series resistance (ESR), which is the sum of a dielectric loss plus an ohmic loss of the ceramic dielectric body, that is greater than zero, but less than 2.0 ohms at a range of MRI RF pulsed frequencies,

v) wherein an active metallization supported on the ceramic dielectric body is electrically connected to the at least two active electrode plates, and a ground metallization supported on the ceramic dielectric body is electrically connected to the at least two ground electrode plates of the filter capacitor;

e) a first electrical connection from the active metallization of the filter capacitor to the device side of the conductive pathway; and

f) a second electrical connection from the ground metallization of the filter capacitor to the ferrule,

g) wherein the filter capacitor is a first capacitor element connected to the conductive pathway.

34. The filter assembly of claim 33, wherein the filter capacitor has a dielectric loss tangent measured in ohms that is greater than zero, but less than five percent of the ESR of the filter capacitor at the range of MRI RF pulsed frequencies.

35. The filter assembly of claim 33, wherein the ESR of the filter capacitor at the range of MRI RF pulsed frequencies is greater than zero, but less than 0.5 ohms.

36. The filter assembly of claim 33, wherein the MRI RF pulsed frequency is a range of frequencies centered at 64 MHz or 128 MHz.

37. The filter assembly of claim 33, wherein the insulator is an alumina insulator and the conductive pathway is selected from the group consisting of a leadwire, a co-fired conductive fill, and a co-fired conductive paste.

38. The filter assembly of claim 33, wherein the insulator is a glass and the conductive pathway is a leadwire.