CMOS-MEMS-CMOS platform
First Claim
1. A sensor chip comprising:
- a first substrate with a first surface and a second surface comprising at least one CMOS circuit;
a first MEMS substrate with a first surface and a second surface, wherein the first surface and the second surface of the first MEMS substrate are on opposing sides of the first MEMS substrate;
a second substrate;
a second MEMS substrate; and
a third substrate comprising at least one CMOS circuit;
wherein the first surface of the first substrate is attached to a packaging substrate and the second surface of the first substrate is attached to the first surface of the first MEMS substrate; and
wherein the second surface of the first MEMS substrate is attached to the second substrate; and
wherein the first substrate, the first MEMS substrate, the second substrate and the packaging substrate are provided with electrical inter-connects.
1 Assignment
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Accused Products
Abstract
A sensor chip includes a first substrate with a first surface and a second surface including at least one CMOS circuit, a first MEMS substrate with a first surface and a second surface on opposing sides of the first MEMS substrate, a second substrate, a second MEMS substrate, and a third substrate including at least one CMOS circuit. The first surface of the first substrate is attached to a packaging substrate and the second surface of the first substrate is attached to the first surface of the first MEMS substrate. The second surface of the first MEMS substrate is attached to the second substrate. The first substrate, the first MEMS substrate, the second substrate and the packaging substrate are provided with electrical inter-connects.
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Citations
20 Claims
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1. A sensor chip comprising:
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a first substrate with a first surface and a second surface comprising at least one CMOS circuit; a first MEMS substrate with a first surface and a second surface, wherein the first surface and the second surface of the first MEMS substrate are on opposing sides of the first MEMS substrate; a second substrate; a second MEMS substrate; and a third substrate comprising at least one CMOS circuit; wherein the first surface of the first substrate is attached to a packaging substrate and the second surface of the first substrate is attached to the first surface of the first MEMS substrate; and wherein the second surface of the first MEMS substrate is attached to the second substrate; and wherein the first substrate, the first MEMS substrate, the second substrate and the packaging substrate are provided with electrical inter-connects. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A sensor chip comprising:
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a first substrate with a first surface and a second surface comprising at least one CMOS circuit; a MEMS substrate with a first surface and a second surface, wherein the MEMS substrate comprises at least one MEMS structure, and wherein the first surface and the second surface of the first MEMS substrate are on opposing sides of the first MEMS substrate; and a second substrate comprising a cap layer; wherein the first surface of the first substrate is attached to a packaging substrate and the second surface of the first substrate is attached to the first surface of the MEMS substrate; and wherein the second surface of the MEMS substrate is attached to the second substrate; wherein the first substrate, the MEMS substrate, the second substrate and the packaging substrate are mechanically attached and provided with electrical interconnects; and wherein the MEMS structure is enclosed within the first and the second substrates, wherein the second substrate forms an enclosure for the at least one MEMS structure. - View Dependent Claims (14, 15, 16, 17)
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18. A sensor chip comprising:
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a first substrate with a first surface and a second surface comprising at least one CMOS circuit, the first substrate comprising a first recess in the second surface of the first substrate; a MEMS substrate with a first surface and a second surface, wherein the first surface and the second surface of the first MEMS substrate are on opposing sides of the first MEMS substrate; and a second substrate comprising at least one CMOS circuit; wherein the first surface of the first substrate is attached to a packaging substrate and the second surface of the first substrate is attached to the first surface of the MEMS substrate; wherein the second surface of the MEMS substrate is attached to the second substrate; and wherein the first substrate, the MEMS substrate, the second substrate and the packaging substrate are mechanically attached and provided with electrical interconnects. - View Dependent Claims (19, 20)
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Specification