LED assembly

• US 10,094,523 B2
• Filed: 04/19/2013
• Issued: 10/09/2018
• Est. Priority Date: 04/19/2013
• Status: Active Grant

• Current Assignee: CREE Led Incorporated (Smart Global Holdings Incorporated)
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Andrews, Peter
• Primary Examiner(s): Sawhney, Hargobind S
• Application Number:
  US13/866,587
• Publication Number:
  US 20140313713A1
• Time in Patent Office: 1,999 Days
• Field of Search: 362184, 36221701, 36221713, 362222, 362223, 362231, 362235, 362240, 36224901, 36224902, 36224904, 36224906, 36224914, 36231101, 36231102, 362363
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21K 9/233 specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21S 4/10 with light sources attached to loose electric cables, e.g. Christmas tree lights
• CPC Class Codes: H01L 2224/4554 Coating
• CPC Class Codes: H01L 2224/48139 with an intermediate bond, e.g. continuous wire daisy chain
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

An LED assembly comprises a string of LEDs. An electrical connector electrically connects the plurality of LEDs and provides the physical support between the LEDs. Lamps incorporating the LED assembly are provided. Methods of making the LED assembly are also provided.

Claims

1. A method of making an LED assembly comprising:

securing a plurality of LEDs to a substrate using a bonding material;

connecting at least one electrical connector between selected ones of the plurality of LEDs;

releasing the bonding material to detach the LEDs from the substrate such that the physical connection between the selected ones of the plurality of LEDs is solely through the at least one electrical connector.

2. The method of claim 1 wherein the bonding material comprises at least one of a silicone epoxy, wax, adhesive and solder.

3. The method of claim 1 further comprising encapsulating the at least one electrical connector and the plurality of LEDs in a pliable phosphor layer.

4. The method of claim 3 wherein the pliable phosphor layer contains a pliable silicone.

5. The method of claim 1 wherein the at least one electrical connector comprises a wirebond.

6. The method of claim 1 wherein each of the plurality of LEDs comprises an anode and a cathode disposed on a first side of the LED.

7. The method of claim 1 wherein each of the plurality of LEDs comprises an anode disposed on a first side of the LED and a cathode disposed on a second side of the LED.

8. The method of claim 1 further comprising connecting the plurality of LEDs to the at least one electrical connector using at least one of solder and conductive epoxy.

9. The method of claim 1 further comprising forming the LED assembly into a three-dimensional shape.

10. The method of claim 1 further comprising bending the at least one electrical connector to form a three-dimensional shape.

11. The method of claim 1 wherein the at least one electrical connector comprises electrically conductive wires having at least one planar surface and further comprising attaching the plurality of LEDs to the at least one planar surface.

12. The method of claim 1 further comprising applying a pliable phosphor layer to each of the plurality of LEDs.

13. The method of claim 1 further comprising covering the at least one electrical connector in insulation.

14. A method of making an LED assembly comprising:

removably mounting an electrically conductive trace in a fixture;

electrically coupling a plurality of LEDs to the electrically conductive trace;

removing the electrically conductive trace having the plurality of LEDs mounted thereon from the fixture such that the electrically conductive trace electrically connects the plurality of LEDs and the physical connection between the plurality of LEDs is solely through the electrically conductive trace.

15. The method of claim 14 wherein the plurality of LEDs are electrically coupled to the electrically conductive trace using one of die solder and conductive epoxy.

16. The method of claim 14 further comprising encapsulating the at least one electrically conductive trace and the plurality of LEDs in a pliable phosphor layer.

17. The method of claim 16 further comprising bending the at least one electrically conductive trace to form a three-dimensional shape.

18. The method of claim 14 wherein each of the plurality of LEDs comprises an anode and a cathode disposed on a first side of the LED.

19. The method of claim 14 further comprising bending the at least one electrically conductive trace to form a three-dimensional shape.

20. The method of claim 14 further comprising applying a pliable phosphor layer to each of the plurality of LEDs.