Electronic-component testing device

• US 10,094,871 B2
• Filed: 04/13/2017
• Issued: 10/09/2018
• Est. Priority Date: 10/23/2014
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Itakura, Masakazu, Kawasaki, Tetsuo
• Primary Examiner(s): MILLER, DANIEL R
• Application Number:
  US15/486,425
• Publication Number:
  US 20170219646A1
• Time in Patent Office: 544 Days
• CPC Class Codes: G01R 31/2642 Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
• CPC Class Codes: G01R 31/2849 Environmental or reliability testing, e.g. burn-in or validation tests of individual semiconductors G01R31/2642; of printed circuits boards G01R31/2817; of IC's G01R31/2855
• CPC Class Codes: G01R 31/64 Testing of capacitors

Abstract

An electronic-component testing device capable of achieving efficient heat-releasing from a self-heating electronic component and efficiently performing a desired test while maintaining the temperature of the electronic component in a predetermined range higher than ordinary temperature.

Claims

1. An electronic-component testing device configured to perform a test by applying voltage while keeping, at a predetermined test temperature higher than ordinary temperature, a self-heating electronic component including a first external electrode and a second external electrode, the electronic-component testing device comprising:

a first conduction terminal having a principal surface on which the electronic component is held,

the first conduction terminal including an insulation region at least a surface of which is an insulating material and a region other than the insulation region, and the first external electrode of the electronic component contacting the insulation region to prevent electrical conduction and the second external electrode contacting the region other than the insulation region to allow electrical conduction,

the first conduction terminal including a heater configured to heat the electronic component to the test temperature, and being capable of releasing a larger amount of heat than the amount of heat generated by self-heating of the electronic component;

a second conduction terminal configured to be pressed against the first external electrode of the electronic component held on the first conduction terminal, which contacts the insulation region of the first conduction terminal, in order to apply a predetermined pressing force toward the first conduction terminal;

an insulating terminal configured to be pressed against the second external electrode of the electronic component held on the first conduction terminal, which contacts the region other than the insulation region of the first conduction terminal to achieve electrical conduction, in order to apply a predetermined pressing force toward the first conduction terminal, or the insulating terminal configured to be pressed against a region of the electronic component, in which the first external electrode and the second external electrode are not located, in order to apply a predetermined pressing force toward the first conduction terminal;

a temperature sensor provided to one of the second conduction terminal and the insulating terminal to measure the temperature of the electronic component; and

a control unit configured to control the heater to maintain the temperature of the electronic component at the test temperature by feeding back the temperature of the electronic component detected by the temperature sensor to the heater.

2. The electronic-component testing device according to claim 1, wherein an auxiliary heater is arranged near the second conduction terminal and the insulating terminal to prevent heat from escaping from the electronic component through the second conduction terminal and the insulating terminal.

3. The electronic-component testing device according to claim 1, wherein

the second conduction terminal individually contacts each of the first external electrodes of a plurality of the electronic components arranged side by side,

the insulating terminal individually contacts each of the second external electrodes of the plurality of the electronic components, or each of the regions of the electronic components in which the first external electrode and the second external electrode are not located,

the temperature sensor is provided to at least one of the second conduction terminal and the insulating terminal contacting each of the plurality of the electronic components, and

the single first conduction terminal contacts each of the second external electrodes of the plurality of the electronic components.

4. The electronic-component testing device according to claim 3, wherein

the plurality of the electronic components are heated to the test temperature while the second conduction terminal contacts the first external electrode of each of the plurality of the electronic components and the single first conduction terminal contacts each second external electrode,

the temperatures of the plurality of the electronic components or temperatures of predetermined electronic-component groups into which the plurality of the electronic components are divided are detected by a plurality of the temperature sensors, and

an average value or an extracted representative value is calculated from the temperatures detected by the plurality of the temperature sensors, the average value or the extracted representative value is fed back to the heater to control the heater so that the temperature of the electronic component or each electronic-component group is maintained at the test temperature, and when any of the temperature sensors has detected an abnormal temperature, the electronic component or the electronic-component group for which the abnormal temperature is detected is excluded as an electronic component or an electronic-component group employed for the calculation.

5. The electronic-component testing device according to claim 1, further comprising a cooling unit configured to cool the first conduction terminal by airflow.

6. An electronic-component testing device configured to perform a test by applying voltage while keeping, at a predetermined test temperature higher than ordinary temperature, a self-heating electronic component including a first external electrode and a second external electrode, the electronic-component testing device comprising:

a heat-transfer insulating terminal having a principal surface on which the electronic component is held,

the heat-transfer insulating terminal including regions that contact the first external electrode and the second external electrode of the electronic component, at least surfaces of the regions being an insulating material,

the heat-transfer insulating terminal including a heater configured to heat the electronic component to the test temperature, and being capable of releasing a larger amount of heat than the amount of heat generated by self-heating of the electronic component;

a first-side conduction terminal configured to be pressed against the first external electrode of the electronic component held on the heat-transfer insulating terminal to apply a predetermined pressing force toward the heat-transfer insulating terminal;

a second-side conduction terminal configured to be pressed against the second external electrode of the electronic component held on the heat-transfer insulating terminal to apply a predetermined pressing force toward the heat-transfer insulating terminal;

a temperature sensor provided to one of the first-side conduction terminal and the second-side conduction terminal to measure the temperature of the electronic component; and

a control unit configured to control the heater to maintain the temperature of the electronic component at the test temperature by feeding back the temperature of the electronic component detected by the temperature sensor to the heater.