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Method for fabricating glass substrate package

  • US 10,096,565 B2
  • Filed: 04/01/2017
  • Issued: 10/09/2018
  • Est. Priority Date: 09/26/2012
  • Status: Active Grant
First Claim
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1. A structure comprising:

  • a first glass substrate having a first surface and a second surface opposed to said first surface, wherein said first surface is parallel to said second surface, multiple metal conductors extending through said first glass substrate beginning at said first surface and ending at said second surface, wherein a first metal layer is under said second surface connected to one of said metal conductors and a bottom most dielectric layer is under said first metal layer, wherein a first metal bump is under said bottom most dielectric layer, wherein said first metal bump is connected to one of said metal conductors through an opening in said bottom most dielectric layer and said first metal layer, wherein said first metal bump comprises a second metal layer and a third metal layer in said opening and under said bottom most dielectric layer;

    a first chip over said first surface and connected to said metal bump through one of said metal conductors and said first metal layer; and

    a second glass substrate of an organic light-emitting diodes (OLED) display substrate is directly under said first glass substrate and said first chip, wherein said metal bump is between said first and second glass substrates and contacted to an electrode of said OLED display substrate through a conductive layer, wherein said conductive layer is directly between said first and second glass substrates, and wherein said conductive layer directly contacts with said electrode of said OLED display substrate and said first metal bump.

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