Method for fabricating glass substrate package
First Claim
1. A structure comprising:
- a first glass substrate having a first surface and a second surface opposed to said first surface, wherein said first surface is parallel to said second surface, multiple metal conductors extending through said first glass substrate beginning at said first surface and ending at said second surface, wherein a first metal layer is under said second surface connected to one of said metal conductors and a bottom most dielectric layer is under said first metal layer, wherein a first metal bump is under said bottom most dielectric layer, wherein said first metal bump is connected to one of said metal conductors through an opening in said bottom most dielectric layer and said first metal layer, wherein said first metal bump comprises a second metal layer and a third metal layer in said opening and under said bottom most dielectric layer;
a first chip over said first surface and connected to said metal bump through one of said metal conductors and said first metal layer; and
a second glass substrate of an organic light-emitting diodes (OLED) display substrate is directly under said first glass substrate and said first chip, wherein said metal bump is between said first and second glass substrates and contacted to an electrode of said OLED display substrate through a conductive layer, wherein said conductive layer is directly between said first and second glass substrates, and wherein said conductive layer directly contacts with said electrode of said OLED display substrate and said first metal bump.
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Abstract
A substrate comprising a solid glass core having a first surface and a second surface opposed to the first surface; multiple conductors extending through the solid glass core beginning at the first surface and ending at the second surface, wherein one of the conductors has a third surface and a fourth surface, wherein the third surface and the first surface are substantially coplanar, wherein the second surface and the fourth surface are substantially coplanar, wherein one of the conductors comprise a copper-tungsten alloy material, wherein the solid glass core is directly contact with the conductor; and a first dielectric layer and a first metal layer formed at the first surface, wherein the first metal layer at the first surface is electrically coupled with one of the conductors.
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Citations
20 Claims
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1. A structure comprising:
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a first glass substrate having a first surface and a second surface opposed to said first surface, wherein said first surface is parallel to said second surface, multiple metal conductors extending through said first glass substrate beginning at said first surface and ending at said second surface, wherein a first metal layer is under said second surface connected to one of said metal conductors and a bottom most dielectric layer is under said first metal layer, wherein a first metal bump is under said bottom most dielectric layer, wherein said first metal bump is connected to one of said metal conductors through an opening in said bottom most dielectric layer and said first metal layer, wherein said first metal bump comprises a second metal layer and a third metal layer in said opening and under said bottom most dielectric layer; a first chip over said first surface and connected to said metal bump through one of said metal conductors and said first metal layer; and a second glass substrate of an organic light-emitting diodes (OLED) display substrate is directly under said first glass substrate and said first chip, wherein said metal bump is between said first and second glass substrates and contacted to an electrode of said OLED display substrate through a conductive layer, wherein said conductive layer is directly between said first and second glass substrates, and wherein said conductive layer directly contacts with said electrode of said OLED display substrate and said first metal bump. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification