Patterned substrates with darkened multilayered conductor traces

• US 10,098,222 B2
• Filed: 04/19/2017
• Issued: 10/09/2018
• Est. Priority Date: 02/02/2011
• Status: Active Grant

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: Frey, Matthew H., Maki, Stephen P.
• Primary Examiner(s): Ng, Sherman
• Application Number:
  US15/491,430
• Publication Number:
  US 20170219741A1
• Time in Patent Office: 538 Days
• Field of Search: 345173, 345174, 174257, 174258, 174261
• CPC Class Codes: B82Y 20/00 Nanooptics, e.g. quantum optics or photonic crystals
• CPC Class Codes: B82Y 30/00 Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: B82Y 99/00 Subject matter not provided for in other groups of this subclass
• CPC Class Codes: G02B 1/116 including electrically conducting layers
• CPC Class Codes: G02B 27/142 Coating structures, e.g. thin films multilayers
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: H03K 17/962 Capacitive touch switches
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 2201/0108 Transparent
• CPC Class Codes: H05K 2201/09681 Mesh conductors, e.g. as a ground plane
• CPC Class Codes: H05K 3/061 Etching masks
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602
• CPC Class Codes: H05K 9/0086 comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
• CPC Class Codes: H05K 9/0096 for television displays, e.g. plasma display panel
• CPC Class Codes: Y10S 977/755 Nanosheet or quantum barrier/well, i.e. layer structure having one dimension or thickness of 100 nm or less

Abstract

The present disclosure provides an article having a substrate having opposing first and second surfaces. A conductor micropattern is disposed on the first surface of the substrate. The conductor micropattern has a plurality of traces defining a plurality of cells. The conductor micropattern may have an open area fraction greater than 80% and a uniform distribution of trace orientation. Each of the traces has a trace width from 0.5 to 10 micrometer. The conductor micropattern is a tri-layer material comprising in sequence a semi-reflective metal, a transparent layer, and a reflective layer disposed on the transparent layer. The articles are useful in devices such as displays, in particular, touch screen displays useful for mobile hand held devices, tablets and computers. They also find use in antennas and for EMI shields.

Claims

1. An article comprising:

a substrate having opposing first and second surfaces; and

a conductor micropattern disposed on the first surface of the substrate, the conductor micropattern comprising a plurality of traces having a uniform distribution of trace orientation for the micropattern, the traces comprising a semi-reflective metal layer such that a light reflected from the semi-reflective metal layer and a light transmitted through the semi-reflective metal layer interfere destructively.

2. The article of claim 1, wherein the traces further comprise a reflective metal layer such that the light transmitted through the semi-reflective metal layer reflects from the reflective metal layer and then interferes with the light reflected from the semi-reflective metal layer.

3. The article of claim 2, wherein the traces further comprise a transparent layer disposed between the semi-reflective metal layer and the reflective metal layer.

4. The article of claim 2, wherein the semi-reflective metal layer has a thickness less than a thickness of the reflective metal layer.

5. The article of claim 4, wherein the thickness of the semi-reflective metal layer is less than 50 nm.

6. The article of claim 4, wherein the thickness of the semi-reflective metal layer is between 1 and 50 nm and the thickness of the reflective metal layer is between 75 nm and 1 micrometer.

7. The article of claim 2, wherein the semi-reflective metal layer is selected from the group consisting of titanium, chromium, aluminum, nickel, copper, gold, molybdenum, platinum, rhodium, silver, tungsten, cobalt, iron, germanium, hafnium, palladium, rhenium, vanadium, silicon, selenium, tantalum, yttrium, zirconium, and combinations and alloys thereof;

and the reflective metal layer is selected from the group consisting of silver, palladium, platinum, aluminum, copper, molybdenum, nickel, tin, tungsten, and combinations and alloys thereof.

8. The article of claim 7, wherein the semi-reflective metal layer and the reflective metal layer comprise different metals.

9. The article of claim 1, wherein the traces have a specular reflectance of less than 50% at normal incidence and in a direction oriented toward the first surface of the substrate.

10. The article of claim 1, wherein the traces have a specular reflectance of less than 50% at normal incidence and in a direction oriented away the first surface of the substrate.

11. An article comprising:

a substrate having opposing first and second surfaces; and

a conductor micropattern disposed on the first surface of the substrate, the conductor micropattern comprising a plurality of traces having a uniform distribution of trace orientation for the conductor micropattern, the traces comprising first and second metal layers and a transparent layer disposed between the first and second metal layers, wherein the first metal layer is semi-reflective and semi-transparent, and the second metal layer is reflective and opaque.

12. The article of claim 11, wherein a light reflected from the first metal layer interferes destructively with a light that is transmitted through the first metal layer and reflected from the second metal layer.

13. The article of claim 11, wherein the traces have a specular reflectance of less than 50% at normal incidence and in a direction oriented toward the first surface of the substrate.

14. The article of claim 11, wherein the traces have a specular reflectance of less than 50% at normal incidence and in a direction oriented away the first surface of the substrate.

15. The article of claim 11, wherein the traces have a trace width from 0.5 to 10 micrometers and the uniform distribution of trace orientation for the micropattern has a standard deviation of measured frequency per two degree bin of less than four.

16. An article comprising:

a substrate having opposing first and second surfaces; and

a conductor micropattern disposed on the first surface of the substrate, the conductor micropattern comprising a plurality of traces having a uniform distribution of trace orientation for the micropattern, the traces comprising first and second metal layers and a transparent layer between the first and second metal layers, wherein the first metal layer comprises a first material and a first thickness such that the first metal layer is semi-reflective and semi-transparent, and the second metal layer comprises a second material and a second thickness such that the second metal layer is reflective and opaque.

17. The article of claim 16, wherein the first and second materials are the same.

18. The article of claim 16, wherein the first and second materials are different.

19. The article of claim 16, wherein the first thickness is less than the second thickness.

20. The article of claim 16, wherein a light reflected from the first metal layer interferes destructively with a light that is transmitted through the first metal layer and reflected from the second metal layer.