Sensor device with a flexible electrical conductor structure

• US 10,098,223 B2
• Filed: 07/06/2015
• Issued: 10/09/2018
• Est. Priority Date: 07/09/2014
• Status: Active Grant

• Current Assignee: SCHREINER GROUP GMBH & CO. KG
• Original Assignee: SCHREINER GROUP GMBH & CO. KG
• Inventors: Seidl, Peter, Gepp, Sebastian, Weik, Thomas, Hartmann, Manfred
• Primary Examiner(s): Chen, Xiaoliang
• Application Number:
  US14/792,284
• Publication Number:
  US 20160014884A1
• Time in Patent Office: 1,191 Days
• Field of Search: 174254, 174250, 174256, 174257, 174261, 174262, 174382, 438 23, 438127, 28846, 28852, 28600, 428607, 428609, 428612, 428626, 156233, 156750, 156937, 29846, 29852, 29600
• CPC Class Codes: H05K 1/028 Bending or folding regions of flexible printed circuits H05K1/0283 takes precedence
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/0346 containing N
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 1/097 Inks comprising nanoparticles and specially adapted for being sintered at low temperature H05K1/095 takes precedence
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 3/007 Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier H05K1/187, H05K3/20 and H05K3/4682 take precedence
• CPC Class Codes: H05K 3/048 using a lift-off resist pattern or a release layer pattern
• CPC Class Codes: H05K 3/12 using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
• CPC Class Codes: H05K 3/1216 by screen printing or stencil printing
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: H05K 3/4632 laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602

Abstract

A sensor device for integration in an electrical circuit, including a support layer (12′), which is formed with a release layer; at least one flexible insulating layer (14′, 32), which is made using a printing method; and at least one flexible electrical conductor structure (20′, 34), which is applied with a printing method onto the insulating layer (14). The insulating layer (14′, 32) and the conductor structure (20′, 34) form a flexible unit, which is removable without damage from the support layer (12′).

Claims

1. A self-destructive sensor device for integration into an electrical circuit, comprising:

at least one flexible insulating layer (14, 14′

, 32);

at least one flexible electrical conductor structure (20, 20′

, 34), which is applied with a printing method onto the insulating layer (14, 14′

, 32);

an adhesive layer (22) arranged above the electrical conductor structure (20, 20′

, 34); and

a cover layer (24, 40) arranged on the adhesive layer (2), wherein the cover layer (24) is formed as a substrate (40) or as a release film (24) to protect the adhesive layer (22),

wherein the at least one flexible insulating layer (14, 14′

, 32) and the at least one flexible conductor structure (20, 20′

, 34) form a fragile, flexible unit which is self-destructive by manipulation.

2. The sensor device according to claim 1, wherein the insulating layer (14, 14′

, 32) is made from a lacquer.

3. The sensor device according to claim 2, wherein the lacquer is a modified lacquer.

4. The sensor device according to claim 1, wherein the insulating layer is formed at least in regions as multi-layered.

5. The sensor device according to claim 1, wherein the conductor structure (20, 20′

, 32) is formed from a conductive printing material, wherein said conductive printing material is selected from the group consisting of copper, silver, a carbon bond, a conductive polymer structure, graphene, and/or a conductive dye of nano-particles.

6. The sensor device according to claim 1, wherein the at least one flexible insulating layer (32) is arranged between two electrical conductor structures (20′

, 34).

7. The sensor device according to claim 6, wherein the at least one insulating layer (32) arranged between the two conductor structures (20′

, 34) has at least one recess (36), wherein the two conductor structures (20′

, 34) are electrically connected to one another via said at least one recess (36), wherein the at least one recess (36) is filled by at least one conductor structure (34).

8. The use of the sensor device of claim 1 as a device that is self-destructive by manipulation.