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MLCC filter on an AIMD circuit board with direct connect to the gold braze hermetically sealing a feed through insulator to a ferrule

  • US 10,099,051 B2
  • Filed: 12/12/2016
  • Issued: 10/16/2018
  • Est. Priority Date: 03/20/2008
  • Status: Active Grant
First Claim
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1. A filtered feedthrough assembly for an active implantable medical device, the filtered feedthrough assembly comprising:

  • a) an electrically conductive ferrule comprising a ferrule opening, wherein the ferrule is configured to be attachable to an opening in a housing of an active implantable medical device;

    b) an insulator at least partially residing in the ferrule opening where a first gold braze hermetically seals the insulator to the ferrule, wherein at least an insulator first passageway extends through the insulator to an insulator first end surface and an insulator second end surface;

    c) an electrically conductive lead wire residing in the insulator first passageway where a second gold braze hermetically seals the lead wire to the insulator, the lead wire extending from a lead wire first portion having a lead wire first end to a lead wire second portion having a lead wire second end, wherein the lead wire second portion extends outwardly beyond the insulator second end surface;

    d) a circuit board comprising spaced apart circuit board first and second sides, wherein the circuit board first side is adjacent to the insulator second end surface;

    e) a circuit board ground plate at least partially residing on the circuit board first side;

    f) a circuit board ground via hole extending through the circuit board to the circuit board ground plate;

    g) a circuit board active via hole being electrically isolated from the circuit board ground plate, wherein at least a portion of the lead wire second portion extends into the circuit board active via hole to adjacent to the circuit board second side;

    h) a two-terminal MLCC chip capacitor comprising a chip capacitor dielectric supporting at least one active electrode plate interleaved in a capacitive relationship with at least one ground electrode plate, wherein an active metallization is conductively connected to the at least one active electrode plate, and a ground metallization is conductively connected to the at least one ground electrode plate of the two-terminal MLCC chip capacitor; and

    i) wherein an active electrical path extends from the lead wire to the two-terminal MLCC chip capacitor, the active electrical path comprising a first electrically conductive material conductively connecting at least a portion of the lead wire second portion adjacent to the circuit board second side to the active metallization electrically connected to the active electrode plate of the two-terminal MLCC chip capacitor, andj) wherein a ground electrical path extends from the two-terminal MLCC chip capacitor to the circuit board ground plate and then to the ferrule, the ground electrical path comprising a second electrically conductive material;

    i) being conductively connected to the ground metallization electrically connected to the ground electrode plate of the two-terminal MLCC chip capacitor;

    ii) at least partially residing in the circuit board ground via hole where the second electrically conductive material is conductively connected to the circuit board ground plate; and

    iii) being conductively connected to the first gold braze hermetically sealing the insulator to the ferrule.

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