Open diaphragm harsh environment pressure sensor
First Claim
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1. A pressure sensor comprising:
- a housing;
a diaphragm wafer comprising;
a fluid contact surface;
a diaphragm located along the surface and configured to deflect in response to pressure;
a sensing element that is responsive to deflection of the diaphragm; and
a support portion, wherein the support portion and the diaphragm define a cavity; and
an isolator configured to absorb lateral stresses comprising;
an opening configured to allow communication between an external fluid and the diaphragm;
an inner portion defining the opening, the inner portion attached to the diaphragm wafer; and
an outer portion extending laterally to and connecting to the housing, wherein the outer portion extends laterally beyond the diaphragm wafer.
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Abstract
A pressure sensor comprising a housing, a diaphragm wafer, and an isolator configured to absorb lateral stress. The diaphragm wafer includes a fully exposed diaphragm, a fluid contact surface, a sensing element, and a support portion, where the support portion and the contact surface define a cavity. The isolator extends laterally from the support portion to the housing. The pressure sensor is easily drainable, eliminating the buildup of particulates, and the diaphragm can be directly wire-bonded to printed circuit boards, eliminating the need for extensive electrical feedthrough.
18 Citations
20 Claims
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1. A pressure sensor comprising:
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a housing; a diaphragm wafer comprising; a fluid contact surface; a diaphragm located along the surface and configured to deflect in response to pressure; a sensing element that is responsive to deflection of the diaphragm; and a support portion, wherein the support portion and the diaphragm define a cavity; and an isolator configured to absorb lateral stresses comprising; an opening configured to allow communication between an external fluid and the diaphragm; an inner portion defining the opening, the inner portion attached to the diaphragm wafer; and an outer portion extending laterally to and connecting to the housing, wherein the outer portion extends laterally beyond the diaphragm wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method for creating a pressure sensor, the method comprising:
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fabricating a diaphragm wafer comprising a fluid contact surface, a diaphragm located along the surface and configured to deflect in response to pressure, a sensing element that is responsive to deflection of the diaphragm, and a support portion, wherein the support portion and the diaphragm define a cavity; fabricating a housing; fabricating an isolator configured to absorb lateral stresses, the isolator comprising; an opening configured to allow communication between an external fluid and the diaphragm; an inner portion defining the opening, the inner portion for attaching to the diaphragm wafer; and an outer portion extending laterally for connecting to the housing, wherein the outer portion extends laterally beyond a width of the diaphragm wafer; connecting the isolator to the housing; and attaching the diaphragm wafer to the isolator, such that the support portion of the diaphragm wafer is attached to an inner portion of the isolator, an outer portion of the isolator is attached to the housing, and the fluid contact surface of the diaphragm wafer is parallel to the isolator. - View Dependent Claims (18, 19, 20)
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Specification