Methods for integrating a compliant material with a substrate
First Claim
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1. A method for forming a sensor module, comprising:
- providing a compliant structure that includes a compliant layer between a first protective layer and a second protective layer;
forming a first conductive layer on the first protective layer and forming a second conductive layer on the second protective layer;
patterning the first conductive layer to form a first conductive electrode and patterning the second conductive layer to form a second conductive electrode aligned with the first conductive electrode, the first conductive electrode and the second conductive electrode forming a capacitor;
forming a first adhesive layer that covers the first conductive electrode and a portion of the first protective layer;
patterning the first adhesive layer to form a first opening and a second opening in the first adhesive layer;
forming a first substrate layer on the first adhesive layer, wherein the first substrate layer includes a first third conductive layer, and the third conductive layer electrically connects to the first conductive layer through the first opening; and
producing a first flexible substrate tail from a portion of the first substrate layer, the first flexible substrate tail produced by removing a multi-layer portion of the compliant structure and a portion of the first conductive layer that are aligned with and to one side of the second opening.
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Abstract
A sensor module can include a sensor that is configured to detect any given input or environmental conditions, such as, for example, touch or force inputs. The sensor module can be included in an electronic device. Methods for producing the sensor module are disclosed.
47 Citations
11 Claims
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1. A method for forming a sensor module, comprising:
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providing a compliant structure that includes a compliant layer between a first protective layer and a second protective layer; forming a first conductive layer on the first protective layer and forming a second conductive layer on the second protective layer; patterning the first conductive layer to form a first conductive electrode and patterning the second conductive layer to form a second conductive electrode aligned with the first conductive electrode, the first conductive electrode and the second conductive electrode forming a capacitor; forming a first adhesive layer that covers the first conductive electrode and a portion of the first protective layer; patterning the first adhesive layer to form a first opening and a second opening in the first adhesive layer; forming a first substrate layer on the first adhesive layer, wherein the first substrate layer includes a first third conductive layer, and the third conductive layer electrically connects to the first conductive layer through the first opening; and producing a first flexible substrate tail from a portion of the first substrate layer, the first flexible substrate tail produced by removing a multi-layer portion of the compliant structure and a portion of the first conductive layer that are aligned with and to one side of the second opening. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification