Raised floor plenum tool

• US 10,102,313 B2
• Filed: 12/30/2014
• Issued: 10/16/2018
• Est. Priority Date: 12/30/2014
• Status: Active Grant

• Current Assignee: Schneider Electric IT Corporation (Schneider Electric SE)
• Original Assignee: Schneider Electric IT Corporation (Schneider Electric SE)
• Inventors: VanGilder, James William, Zhang, Xuanhang
• Primary Examiner(s): Shah, Kamini S
• Assistant Examiner(s): Khan, Iftekhar A
• Application Number:
  US14/586,803
• Publication Number:
  US 20160188764A1
• Time in Patent Office: 1,386 Days
• Field of Search: 703 2
• CPC Class Codes: G06F 2111/10 Numerical modelling
• CPC Class Codes: G06F 2113/02 Data centres
• CPC Class Codes: G06F 30/20 Design optimisation, verification or simulation optimisation, verification or simulation of circuit designs G06F30/30
• CPC Class Codes: G06F 30/23 using finite element methods [FEM] or finite difference methods [FDM]
• CPC Class Codes: G06F 30/28 using fluid dynamics, e.g. using Navier-Stokes equations or computational fluid dynamics [CFD]

Abstract

According to various aspects and embodiments, a system and method for use with a raised floor data center is provided. The method according to one aspect includes receiving input data, including data related to at least one data center design parameter, determining tile airflow uniformity using the input data and at least one empirical correlation, implementing an analytical model to determine airflow distribution, the analytical model including at least one empirical formula, and using the tile airflow uniformity and the airflow distribution to evaluate airflow in a data center design.

Claims

1. A method for use with a raised floor data center, comprising:

receiving input data, including at least one data center design parameter related to the raised floor and a plenum located below the raised floor, the at least one data center design parameter including perforated tile type, raised floor construction, and raised floor cutouts;

determining tile airflow uniformity using the input data and at least one empirical correlation;

implementing an analytical model to determine airflow distribution through each of the perforated tiles, the raised floor, and the raised floor cutouts, wherein implementing the analytical model includes solving, based on the input data, a plurality of equations that include a first equation associated with airflow values through the perforated tiles, a second equation associated with airflow leakage values through the raised floor, and a third equation associated with airflow leakage values through the raised floor cutouts;

using the tile airflow uniformity and the airflow distribution to evaluate airflow in a data center design; and

altering one or more operating parameters of at least one of a cooling device and one or more equipment racks positioned in the data center based on the airflow evaluation.

2. The method of claim 1, wherein the at least one empirical correlation is derived from a plurality of Computational Fluid Dynamics (CFD) simulations.

3. The method of claim 2, wherein the at least one empirical correlation is based on a determination of operational relationships between a plurality of data center design parameters, including combinations of data center design parameters.

4. The method of claim 1, further including displaying the evaluation of the tile airflow uniformity and the airflow distribution.

5. The method of claim 4, wherein the evaluation of the airflow distribution uses at least one value representative of at least one of the base floor leakage airflow, the cutout leakage airflow, and the perforated tile airflow.

6. The method of claim 4, wherein the evaluation of the tile airflow uniformity includes at least one value representative of a deviation from a mean tile airflow value.

7. The method of claim 1, wherein the input data includes data center design parameters related to an area above the raised floor, including at least one of floor layout, total number of racks, total floor area, and typical row length.

8. The method of claim 1, wherein the input data that includes the at least one data center design parameter further includes plenum depth and plenum obstructions.

9. The method of claim 1, wherein at least one data center design parameter includes an interpolated value between an upper threshold value representative of optimal data center design and a lower threshold value representative of worst case data center design.

10. The method of claim 1, wherein the tile airflow uniformity and the airflow distribution are determined in real-time.

11. The method of claim 1, wherein the method is performed with a computer and wherein at least one act is performed in a software program housed in a computer.

12. The method of claim 1, further comprising adjusting at least one data center design based on the evaluation of the airflow.

13. A system for use with a raised floor data center, comprising:

at least one input configured to receive input data, including at least one data center design parameter related to the raised floor and a plenum located below the raised floor, the at least one data center design parameter including perforated tile type, raised floor construction, and raised floor cutouts;

a programmable device in communication with the at least one input, the programmable device comprising;

a memory for storing the received input data;

at least one processor coupled to the memory and configured to;

determine tile airflow uniformity using the input data and at least one empirical correlation;

implement an analytical model to determine airflow distribution through each of the perforated tiles, the raised floor, and the raised floor cutouts, wherein implementing the analytical model includes solving, based on the input data, a plurality of equations that include a first equation associated with airflow values through the perforated tiles, a second equation associated with airflow leakage values through the raised floor, and a third equation associated with airflow leakage values through the raised floor cutouts;

evaluate airflow in a data center design using the tile airflow uniformity and the airflow distribution;

alter one or more operating parameters of at least one of a cooling device and one or more equipment racks positioned in the data center based on the airflow evaluation; and

at least one output in communication with the programmable device and configured to display the evaluation corresponding to the tile airflow uniformity and the airflow distribution.

14. The system of claim 13, wherein the at least one empirical correlation is derived from a plurality of Computational Fluid Dynamics (CFD) simulations.

15. The system of claim 13, wherein the output is configured to display at least one of the base floor leakage airflow, the cutout leakage airflow, and the perforated tile airflow.

16. The system of claim 13, wherein the output is configured to display at least one value representative of a deviation from a mean tile airflow value.

17. The system of claim 13, wherein the at least one data center design parameter further includes plenum depth and plenum obstructions, and the input data further includes design parameters related to an area above the raised floor, including at least one of floor layout, total number of racks, total floor area, and typical row length.

18. A method for managing airflow in a raised floor data center, comprising:

receiving at least one data center design parameter related to the raised floor and a plenum located below the raised floor, the at least one data center design parameter including perforated tile type, raised floor construction, and raised floor cutouts;

determining tile airflow uniformity using the at least one data center design parameter and at least one empirical correlation;

implementing an analytical model to determine airflow distribution through each of the perforated tiles, the raised floor, and the raised floor cutouts, wherein implementing the analytical model includes solving, based on the input data, a plurality of equations that include a first equation associated with airflow leakage values through the perforated tiles, a second equation associated with airflow leakage values through the raised floor, and a third equation associated with airflow leakage values through the raised floor cutouts; and

altering a data center operating parameter based on at least one of the determined tile airflow uniformity and the airflow distribution.