Apparatus and method for manufacturing a semiconductor device

• US 10,103,040 B1
• Filed: 03/31/2017
• Issued: 10/16/2018
• Est. Priority Date: 03/31/2017
• Status: Active Grant

• Current Assignee: ASM IP Holding B.V. (ASM International NV)
• Original Assignee: ASM IP Holding B.V. (ASM International NV)
• Inventors: Oosterlaken, Theodorus, de Ridder, Chris, Jdira, Lucian
• Primary Examiner(s): Abdelaziez, Yasser A
• Application Number:
  US15/476,035
• Publication Number:
  US 20180286711A1
• Time in Patent Office: 564 Days
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: B23K 2103/56 semiconducting semiconducting devices B23K2101/40
• CPC Class Codes: B23K 26/0006 taking account of the properties of the material involved B23K26/32, B23K26/40 take precedence
• CPC Class Codes: B23K 26/0604 by a combination of beams
• CPC Class Codes: B23K 26/083 Devices involving movement of the workpiece in at least one axial direction
• CPC Class Codes: B23K 26/123 in an atmosphere of particular gases
• CPC Class Codes: B23K 26/126 in an atmosphere of gases chemically reacting with the workpiece
• CPC Class Codes: B23K 26/127 in an enclosure
• CPC Class Codes: B23K 26/34 Laser welding for purposes other than joining
• CPC Class Codes: B23K 26/352 for surface treatment
• CPC Class Codes: B23K 37/0408 for planar work
• CPC Class Codes: B23K 37/047 moving work to adjust its position between soldering, welding or cutting steps B23K37/053 takes precedence
• CPC Class Codes: H01L 21/268 using electromagnetic radiation, e.g. laser radiation
• CPC Class Codes: H01L 21/324 Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering H01L21/20 - H01L21/288 and H01L21/302 - H01L21/322 take precedence
• CPC Class Codes: H01L 21/67115 mainly by radiation
• CPC Class Codes: H01L 21/67303 Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
• CPC Class Codes: H01S 5/042 Electrical excitation ; Circuits therefor monolithically integrated laser drive components H01S5/0261
• CPC Class Codes: H01S 5/423 having a vertical cavity

Abstract

The invention relates to an apparatus for manufacturing a semiconductor device comprising a reaction chamber comprising a substrate holder for holding a substrate; and, a heater for heating the substrate. The heater may comprise a vertical cavity surface emitting laser constructed and arranged to emit a radiation beam to a substrate held by the substrate holder to heat the substrate.

Claims

1. An apparatus for manufacturing a semiconductor device comprising:

a reaction chamber provided with a substrate holder for holding a substrate; and

,

a heater for heating the substrate;

wherein the heater comprises a vertical cavity surface emitting laser constructed and arranged to emit a radiation beam to a substrate in the apparatus,

wherein the substrate holder is a substrate rack for holding a plurality of semiconductor substrates in a spaced apart relationship, the substrate rack comprising at least one support member defining a plurality of spaced apart substrate holding provisions, each of which substrate holding provisions is configured to independently hold a substrate in a substantially horizontal orientation and the vertical cavity surface emitting laser is constructed and arranged to emit radiation to the substrates in the substrate rack at least from a side of the substrate rack.

2. The apparatus according to claim 1, wherein the heater comprises multiple vertical cavity surface emitting lasers provided in an array to emit multiple radiation beams in the direction of the substrate.

3. The apparatus according to claim 2, wherein the apparatus comprises a power controller to individually control the power of the individual vertical cavity surface emitting lasers in the array to individually control the power of each radiation beam.

4. The apparatus according to claim 2, wherein the array of vertical cavity surface emitting lasers are constructed and arranged to heat the substrates to a temperature between 50 and 1200°

C.

5. The apparatus according to claim 2, wherein the array of vertical cavity surface emitting lasers for emitting radiation in the direction of the substrate has a power output density between 10 W/cm²-40 kW/cm².

6. The apparatus according to claim 1, wherein the vertical cavity surface emitting laser emits infrared radiation with a wavelength between 800 nm and 1100 nm.

7. The apparatus according to claim 1, wherein the apparatus is provided with a substrate rack rotating device constructed and arranged to rotate the substrate rack.

8. The apparatus according to claim 1, wherein the vertical cavity surface emitting laser is constructed and arranged to emit the radiation beam from the side of the substrate rack upwards towards a bottom of the substrates held in the substrate rack under an angle between 60 to 90°

with respect to a line perpendicular to the surface of the substrate.

9. The apparatus according to claim 1, wherein the apparatus is provided with reflectors constructed and arranged within the apparatus on the other side of the substrate rack with respect to the vertical cavity surface emitting laser to reflect radiation reflected of the substrates back to the substrate rack.

10. The apparatus according to claim 9, wherein the reflectors comprise retroreflectors to reflect the radiation beam back in the same direction as from which the radiation beam came.

11. The apparatus according to claim 1, wherein the apparatus comprises multiple vertical cavity surface emitting lasers and a power controller to individually control the power of the individual vertical cavity surface emitting lasers to adjust a radiation output of the vertical cavity surface emitting lasers along the substrate rack.

12. The apparatus according to claim 11, wherein the power controller is programmed to provide a higher radiation output with the vertical cavity surface emitting lasers at the top and the bottom of the substrate rack.

13. The apparatus according to claim 1, wherein the heater comprises a pre-heater for pre-heating the substrates and a final heater to heat the substrates at a final temperature and a rack handler for moving the rack from the pre-heater to the final heater and the vertical cavity surface emitting lasers to emit radiation to the substrates in the substrate rack are provided to the pre-heater.

14. The apparatus according to claim 13, wherein the pre-heater and the final heater are provided in the reaction area.

15. The apparatus according to claim 14, wherein the pre-heater is constructed and arranged below the final heater and the rack handler can move the rack upwards to the final heater.

16. The apparatus according to claim 13, wherein the rack handler and the pre-heater are constructed and arranged to move the rack along the pre-heater while the pre-heater is heating a portion of the substrates in the rack.

17. The apparatus according to claim 14, wherein the pre-heater has length in the vertical direction which is less than the length of the rack in the vertical direction.

20. The apparatus according to claim 1, wherein the vertical cavity surface emitting laser may be constructed and arranged to heat a substrate in the reaction chamber.

21. The apparatus according to claim 20, wherein the reaction chamber is provided with a chamber wall transmissive for the radiation of the vertical cavity surface emitting laser.

22. The apparatus according to claim 21, wherein the chamber wall is made from a material transmissive to the radiation of the vertical cavity surface emitting laser.

18. An apparatus for manufacturing a semiconductor device comprising:

a reaction chamber provided with a substrate holder for holding a substrate; and

,

a heater for heating the substrate;

wherein the heater comprises a vertical cavity surface emitting laser constructed and arranged to emit a radiation beam to a substrate in the apparatus,

wherein the heater comprises a pre-heater to pre-heat the substrate and a final heater to heat the substrate at a final temperature and a substrate handler for moving the substrate from the pre-heater to the final heater and the vertical cavity surface emitting lasers to emit radiation to the substrate is provided in the pre-heater.

19. The apparatus according to claim 18, wherein the vertical cavity surface emitting laser is provided in a substrate handling chamber.

23. A method for producing a semiconductor device, comprising:

providing an apparatus for manufacturing a semiconductor device comprising;

a reaction chamber provided with a substrate holder for holding a substrate; and

,

a heater for heating the substrate;

wherein the heater comprises a vertical cavity surface emitting laser constructed and arranged to emit a radiation beam to a substrate in the apparatus,

wherein the substrate holder is a substrate rack for holding a plurality of semiconductor substrates in a spaced apart relationship, the substrate rack comprising at least one support member defining a plurality of spaced apart substrate holding provisions, each of which substrate holding provisions is configured to independently hold a substrate in a substantially horizontal orientation and the vertical cavity surface emitting laser is constructed and arranged to emit radiation to the substrates in the substrate rack at least from a side of the substrate rack;

providing a substrate; and

heating the substrate with the vertical cavity surface emitting laser.