Pressure-activated electrical interconnection by micro-transfer printing
First Claim
1. A printed electrical connection structure, comprising:
- a substrate comprising one or more electrical connection pads;
a printed component comprising one or more connection posts, each connection post in electrical contact with an electrical connection pad of the one or more electrical connection pads, and wherein each connection post comprises a sharp point embedded in or piercing the electrical connection pad; and
a resin disposed between and in contact with the substrate and the printed component, the resin having a reflow temperature less than a cure temperature, wherein the resin can repeatedly flow at the reflow temperature when temperature is cycled between an operating temperature and the reflow temperature but cannot flow at the reflow temperature after the resin is exposed to the cure temperature.
3 Assignments
0 Petitions
Accused Products
Abstract
A printed electrical connection structure includes a substrate having one or more electrical connection pads and a micro-transfer printed component having one or more connection posts. Each connection post is in electrical contact with a connection pad. A resin is disposed between and in contact with the substrate and the component. The resin has a reflow temperature less than a cure temperature. The resin repeatedly flows at the reflow temperature when temperature-cycled between an operating temperature and the reflow temperature but does not flow after the resin is exposed to a cure temperature. A solder can be disposed on the connection post or the connection pad. After printing and reflow, the component can be tested and, if the component fails, another component is micro-transfer printed to the substrate, the resin is reflowed again, the other component is tested and, if it passes the test, the resin is finally cured.
247 Citations
20 Claims
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1. A printed electrical connection structure, comprising:
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a substrate comprising one or more electrical connection pads; a printed component comprising one or more connection posts, each connection post in electrical contact with an electrical connection pad of the one or more electrical connection pads, and wherein each connection post comprises a sharp point embedded in or piercing the electrical connection pad; and a resin disposed between and in contact with the substrate and the printed component, the resin having a reflow temperature less than a cure temperature, wherein the resin can repeatedly flow at the reflow temperature when temperature is cycled between an operating temperature and the reflow temperature but cannot flow at the reflow temperature after the resin is exposed to the cure temperature. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A micro-transfer printable component, comprising:
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a dielectric substrate having a post side and a circuit side; one or more electrically conductive connection posts protruding from the post side of the dielectric substrate; a circuit disposed on the circuit side of the dielectric substrate; an electrode electrically connecting each of the one or more connection posts to the circuit; and one or more vias, each via corresponding to a connection post of the one or more connection posts, wherein each via extends from the circuit side of the dielectric substrate to a portion of the corresponding connection post and the electrode extends into at least one via of the one or more vias to electrically connect the circuit to each connection post corresponding to the at least one via. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification