Semiconductor device

• US 10,103,274 B2
• Filed: 03/17/2017
• Issued: 10/16/2018
• Est. Priority Date: 12/02/2013
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Yamazaki, Shunpei, Katayama, Masahiro, Misawa, Chieko, Yokoyama, Yuka, Takahashi, Hironobu, Okazaki, Kenichi
• Primary Examiner(s): Gheyas, Syed
• Application Number:
  US15/462,229
• Publication Number:
  US 20170194503A1
• Time in Patent Office: 578 Days
• CPC Class Codes: G02F 1/1368 in which the switching element is a three-electrode device G02F1/136277 takes precedence
• CPC Class Codes: H01L 27/1225 with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
• CPC Class Codes: H01L 29/66969 of devices having semiconductor bodies not comprising group 14 or group 13/15 materials comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials, comprising cuprous oxide or cuprous iodide H01L21/02365
• CPC Class Codes: H01L 29/78606 with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device H01L29/78642, H01L29/78645 take precedence
• CPC Class Codes: H01L 29/7869 having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate

Abstract

A highly reliable semiconductor device which uses an oxide semiconductor film for a backplane is provided. A semiconductor device includes a first conductive film, a first insulating film over the first conductive film, an oxide semiconductor film which is over the first insulating film and overlaps with the first conductive film, a second insulating film over the oxide semiconductor film, and a pair of second conductive films electrically connected to the oxide semiconductor film through an opening portion included in the second insulating film. The second insulating film overlaps with a region of the oxide insulating film in which a carrier flows between the pair of second conductive films and overlaps with end portions of the oxide semiconductor film.

Claims

1. A method for manufacturing a semiconductor device, comprising:

forming a first electrode over a substrate;

forming a first insulating film over the first electrode;

forming an oxide semiconductor film over the first insulating film;

forming a second insulating film over the oxide semiconductor film so that the second insulating film covers an edge of the oxide semiconductor film;

forming a third insulating film on the second insulating film;

forming a pair of opening portions in the second insulating film and the third insulating film; and

forming a pair of electrodes over the third insulating film so that the pair of electrodes is respectively in contact with the oxide semiconductor film through the pair of opening portions,

wherein the second insulating film is in contact with a top surface of a region between the pair of electrodes of the oxide semiconductor film, a side edge of an end portion of the oxide semiconductor film and the first insulating film.

2. The method for manufacturing a semiconductor device according to claim 1, wherein each of the second insulating film and the third insulating film comprises silicon and nitrogen.

3. The method for manufacturing a semiconductor device according to claim 1, wherein the oxide semiconductor film comprises indium, zinc and a metal other than indium and zinc.

4. The method for manufacturing a semiconductor device according to claim 1, wherein the third insulating film is formed without exposure to an atmosphere.

5. The method for manufacturing a semiconductor device according to claim 1, wherein, in forming the third insulating film, at least one of a flow rate of a source gas, pressure, a high-frequency power, and a substrate temperature is different from a condition of forming the second insulating film.

6. The method for manufacturing a semiconductor device according to claim 1, wherein, in forming the third insulating film, a high-frequency power of 0.17 to 0.5 W/cm² is supplied to an electrode provided in a treatment chamber.

7. The method for manufacturing a semiconductor device according to claim 1, wherein the third insulating film is formed using a high-frequency power larger than a high-frequency power for foil ling the second insulating film.

8. A method for manufacturing a semiconductor device, comprising:

forming a first electrode over a substrate;

forming a first insulating film over the first electrode;

forming an oxide semiconductor film over the first insulating film;

forming a second insulating film on the oxide semiconductor film so that the second insulating film covers an edge of the oxide semiconductor film;

forming a third insulating film on the second insulating film;

forming a pair of opening portions in the second insulating film and the third insulating film; and

forming a pair of electrodes over the third insulating film so that the pair of electrodes is respectively in contact with the oxide semiconductor film through the pair of opening portions,

wherein the second insulating film is in contact with a top surface of a region between the pair of electrodes of the oxide semiconductor film, a side edge of an end portion of the oxide semiconductor film and the first insulating film.

9. The method for manufacturing a semiconductor device according to claim 8, wherein each of the second insulating film and the third insulating film comprises silicon and nitrogen.

10. The method for manufacturing a semiconductor device according to claim 8, wherein the oxide semiconductor film comprises indium, zinc and a metal other than indium and zinc.

11. The method for manufacturing a semiconductor device according to claim 8, wherein the third insulating film is formed without exposure to an atmosphere.

12. The method for manufacturing a semiconductor device according to claim 8, wherein, in forming the third insulating film, at least one of a flow rate of a source gas, pressure, a high-frequency power, and a substrate temperature is different from a condition of forming the second insulating film.

13. The method for manufacturing a semiconductor device according to claim 8, wherein, in forming the third insulating film, a high-frequency power of 0.17 to 0.5 W/cm² is supplied to an electrode provided in a treatment chamber.

14. A method for manufacturing a semiconductor device, comprising:

forming a first electrode over a substrate;

forming a first insulating film over the first electrode;

forming an oxide semiconductor film over the first insulating film;

forming a second insulating film over the oxide semiconductor film so that the second insulating film is in contact with an edge of the oxide semiconductor film;

forming a third insulating film on the second insulating film;

forming a pair of opening portions in the second insulating film and the third insulating film; and

forming a pair of electrodes over the third insulating film so that the pair of electrodes is respectively in contact with the oxide semiconductor film through the pair of opening portions,

wherein the second insulating film covers a top surface of a region between the pair of electrodes of the oxide semiconductor film, a side edge of an end portion of the oxide semiconductor film and a part of the first insulating film.

15. The method for manufacturing a semiconductor device according to claim 14, wherein each of the second insulating film and the third insulating film comprises silicon and nitrogen.

16. The method for manufacturing a semiconductor device according to claim 14, wherein the oxide semiconductor film comprises indium, zinc and a metal other than indium and zinc.

17. The method for manufacturing a semiconductor device according to claim 14, wherein the third insulating film is formed without exposure to an atmosphere.

18. The method for manufacturing a semiconductor device according to claim 14, wherein, in forming the third insulating film, at least one of a flow rate of a source gas, pressure, a high-frequency power, and a substrate temperature is different from a condition of forming the second insulating film.

19. The method for manufacturing a semiconductor device according to claim 14, wherein, in forming the third insulating film, a high-frequency power of 0.17 to 0.5 W/cm² is supplied to an electrode provided in a treatment chamber.