Thin film coil and electronic device having the same
First Claim
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1. A thin film coil, comprising:
- a substrate comprising a first surface and a second surface, and formed of an insulating layer;
a first coil strand disposed on the first surface of the substrate, and including a spiral pattern and a lead-out pattern, the lead-out pattern having an end disposed inside the spiral pattern to be led out from the end, outwardly of the spiral pattern;
a second coil strand disposed on the second surface of the substrate, wherein the second coil strand overlaps and is insulated from the spiral pattern in a portion away from the lead-out pattern; and
a plurality of detour vias electrically connecting the first coil strand and the second coil strand to each other, while penetrating through the substrate in a position adjacent to the lead out pattern,wherein windings of the spiral pattern are spaced apart from each other on the first surface and electrically maintained across the lead-out pattern by the second coil strand through at least one of the plurality of detour vias.
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Abstract
There are provided a thin film coil and an electronic device having the same, the thin film coil including a substrate; and a coil pattern including a first coil strand and a second coil strand formed on both surfaces of the substrate, respectively, wherein the first coil strand formed on one surface of the substrate includes at least one gyration path that passes through the other surface of the substrate and gyrates.
58 Citations
7 Claims
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1. A thin film coil, comprising:
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a substrate comprising a first surface and a second surface, and formed of an insulating layer; a first coil strand disposed on the first surface of the substrate, and including a spiral pattern and a lead-out pattern, the lead-out pattern having an end disposed inside the spiral pattern to be led out from the end, outwardly of the spiral pattern; a second coil strand disposed on the second surface of the substrate, wherein the second coil strand overlaps and is insulated from the spiral pattern in a portion away from the lead-out pattern; and a plurality of detour vias electrically connecting the first coil strand and the second coil strand to each other, while penetrating through the substrate in a position adjacent to the lead out pattern, wherein windings of the spiral pattern are spaced apart from each other on the first surface and electrically maintained across the lead-out pattern by the second coil strand through at least one of the plurality of detour vias. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification