Imaging needle apparatus

• US 10,105,040 B2
• Filed: 05/06/2016
• Issued: 10/23/2018
• Est. Priority Date: 05/08/2015
• Status: Active Grant

• Current Assignee: NanoSurgery Technology Corporation
• Original Assignee: NanoSurgery Technology Corporation
• Inventors: Ochi, Sam Seiichiro, Walter, Mark
• Primary Examiner(s): Leubecker, John P
• Application Number:
  US15/036,609
• Publication Number:
  US 20170100020A1
• Time in Patent Office: 900 Days
• CPC Class Codes: A61B 1/00016 using wireless means
• CPC Class Codes: A61B 1/00018 using electrical cables
• CPC Class Codes: A61B 1/00045 Display arrangement
• CPC Class Codes: A61B 1/0008 characterised by distal tip features
• CPC Class Codes: A61B 1/00114 Electrical cables in or with an endoscope
• CPC Class Codes: A61B 1/00124 electrical, e.g. electrical plug-and-socket connection
• CPC Class Codes: A61B 1/015 Control of fluid supply or evacuation
• CPC Class Codes: A61B 1/042 characterised by a proximal camera, e.g. a CCD camera
• CPC Class Codes: A61B 1/05 characterised by the image sensor, e.g. camera, being in the distal end portion
• CPC Class Codes: A61B 1/051 Details of CCD assembly
• CPC Class Codes: A61B 1/0615 for radial illumination
• CPC Class Codes: A61B 1/0676 at distal tip of an endoscope
• CPC Class Codes: A61B 1/0684 using light emitting diodes [LED]
• CPC Class Codes: A61B 1/317 for bones or joints, e.g. osteoscopes, arthroscopes
• CPC Class Codes: A61B 17/3478 Endoscopic needles, e.g. for infusion biopsy needles A61B10/0233; catheters with injection needles A61M25/0067
• CPC Class Codes: A61M 5/329 characterised by features of the needle shaft

Abstract

An imaging device includes a needle, an imager, and a syringe. The needle includes a tip. The imager includes a plurality of stacked integrated circuits (ICs). The syringe is coupled to the needle.

Claims

1. An imaging device, comprising:

a needle including a tip;

an imager disposed on the needle, the imager including a plurality of stacked integrated circuits (ICs); and

a syringe coupled to the needle,

wherein the plurality of stacked ICs includes a first plurality of complementary metal-oxide semiconductor (CMOS) chips having a first size, and a second plurality of CMOS chips having a second size that is larger than the first size, the first plurality of CMOS chips being disposed between the imaging chip and the plurality of second CMOS chips.

2. The imaging device of claim 1, wherein the imager includes an imaging chip stacked on the plurality of stacked ICs, the device further comprising:

a light-emitting diode (LED) provided proximate to the imager; and

a bypass capacitor disposed inside of the needle and proximate the imager.

3. The imaging device of claim 2, wherein the imaging chip includes an array of pixels.

4. The imaging device of claim 1, wherein the imager is provided on a side of the needle.

5. The imaging device of claim 1, wherein the imager is provided proximate on a front of the needle.

6. The imaging device of claim 1, further comprising a single coaxial wire including:

an inner conductor that transmits data from the imager;

an outer conductor connected to ground;

a dielectric layer disposed between the inner conductor and the outer conductor; and

an outer insulating jacket covering the outer conductor.

7. The imaging device of claim 1, further comprising a single coaxial wire including:

an inner conductor that transmits data from the imager;

a middle conductor connected to a first power terminal;

a first dielectric layer disposed between the inner conductor and the middle conductor;

an outer conductor connected to a second power terminal; and

a dielectric layer disposed between the middle conductor and the outer conductor.

8. An imaging system, comprising:

an imaging device including a needle having a tip, an imager disposed on the needle, and a syringe coupled to the needle; and

a display electrically coupled to the imaging device,

wherein the imager includes a plurality of stacked integrated circuits (ICs) and an imaging chip stacked on the plurality of stacked ICs,

wherein the plurality of stacked ICs includes a first plurality of complementary metal-oxide semiconductor (CMOS) chips having a first size, and a second plurality of CMOS chips having a second size that is larger than the first size, the first plurality of CMOS chips being disposed between the imaging chip and the plurality of second CMOS chips.

9. The imaging system of claim 8, wherein the imaging device is electrically coupled to the display via a universal serial bus (USB) wire.

10. The imaging system of claim 8, wherein the imaging device is wirelessly coupled to the display.

11. The imaging system of claim 8, wherein the imaging chip includes an array of pixels.

12. The imaging system of claim 8, further comprising:

a wire output disposed on the syringe, and

one or more wires coupled between the imager and the wire output, the one or more wires being disposed inside of the needle.

13. The imaging system of claim 8, further comprising a single coaxial wire including:

an inner conductor that transmits data from the imager;

an outer conductor connected to ground;

a dielectric layer disposed between the inner conductor and the outer conductor; and

an outer insulating jacket covering the outer conductor.

14. The imaging system of claim 8, further comprising a single coaxial wire including:

an inner conductor that transmits data from the imager;

a middle conductor connected to a first power terminal;

a first dielectric layer disposed between the inner conductor and the middle conductor;

an outer conductor connected to a second power terminal; and

a dielectric layer disposed between the middle conductor and the outer conductor.