Imaging needle apparatus
First Claim
Patent Images
1. An imaging device, comprising:
- a needle including a tip;
an imager disposed on the needle, the imager including a plurality of stacked integrated circuits (ICs); and
a syringe coupled to the needle,wherein the plurality of stacked ICs includes a first plurality of complementary metal-oxide semiconductor (CMOS) chips having a first size, and a second plurality of CMOS chips having a second size that is larger than the first size, the first plurality of CMOS chips being disposed between the imaging chip and the plurality of second CMOS chips.
3 Assignments
0 Petitions
Accused Products
Abstract
An imaging device includes a needle, an imager, and a syringe. The needle includes a tip. The imager includes a plurality of stacked integrated circuits (ICs). The syringe is coupled to the needle.
-
Citations
14 Claims
-
1. An imaging device, comprising:
-
a needle including a tip; an imager disposed on the needle, the imager including a plurality of stacked integrated circuits (ICs); and a syringe coupled to the needle, wherein the plurality of stacked ICs includes a first plurality of complementary metal-oxide semiconductor (CMOS) chips having a first size, and a second plurality of CMOS chips having a second size that is larger than the first size, the first plurality of CMOS chips being disposed between the imaging chip and the plurality of second CMOS chips. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. An imaging system, comprising:
-
an imaging device including a needle having a tip, an imager disposed on the needle, and a syringe coupled to the needle; and a display electrically coupled to the imaging device, wherein the imager includes a plurality of stacked integrated circuits (ICs) and an imaging chip stacked on the plurality of stacked ICs, wherein the plurality of stacked ICs includes a first plurality of complementary metal-oxide semiconductor (CMOS) chips having a first size, and a second plurality of CMOS chips having a second size that is larger than the first size, the first plurality of CMOS chips being disposed between the imaging chip and the plurality of second CMOS chips. - View Dependent Claims (9, 10, 11, 12, 13, 14)
-
Specification