Package for processing sensed-data, sensed-data processor, and system for processing sensed-data
First Claim
Patent Images
1. A sensed-data processor comprising:
- a flex circuit with a strained layer affixed to a surface thereof, wherein the strained layer causes the flex circuit to produce a laminar flex circuit structure, the flex circuit comprising a bio-sensor part, a data processor part coupled with the bio-sensor part, and a wireless communication part coupled with the data processor part,wherein the laminar flex circuit structure is rolled in one or more turns, andwherein the flex circuit has a thickness of about 3 to about 10 μ
m.
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Accused Products
Abstract
Provided is a body-implantable package for processing biosensed-data for wireless communication to an external device. The package includes a tube closed by a cover, therein, a chip with a strained layer affixed thereto to form a flexible laminar circuit. The cover is fitted over an open end of the tube after the laminated chip and strained layer are inserted therein. The chip is constructed of and rolled in one or more turns into a generally cylindrical shape. The strained layer is affixed to a surface of the chip automatically to cause the flexible laminar circuit to curl into a generally cylindrical shape to fit within the tube.
13 Citations
10 Claims
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1. A sensed-data processor comprising:
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a flex circuit with a strained layer affixed to a surface thereof, wherein the strained layer causes the flex circuit to produce a laminar flex circuit structure, the flex circuit comprising a bio-sensor part, a data processor part coupled with the bio-sensor part, and a wireless communication part coupled with the data processor part, wherein the laminar flex circuit structure is rolled in one or more turns, and wherein the flex circuit has a thickness of about 3 to about 10 μ
m. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A system for processing sensed-data within a body, the system comprising:
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a body-implantable package for processing sensed-data, the body-implantable package comprising; a flexible circuit layer, a strained layer affixed to the flexible circuit layer, the strained layer causing the flexible circuit layer to be rolled into a curl-biased circuit layer having one or more turns, the curl-biased circuit layer including a circuit comprising a sensor means, a power generation means, a control means, and a wireless communication means, and a close-able tube sealingly containing the curl-biased circuit layer; and a device configured to be external to a package-implanted body, the device configured to receive processed-sensed data transmitted by the wireless communication means, wherein the flexible circuit layer and the strained layer are rolled automatically as a result of manufacturing process steps comprising; dicing a wafer bearing the curl-biased circuit layer and the strained layer into individuated chips; and melting an adhesive layer between the wafer and a substrate to separate the wafer from the substrate, wherein the dicing and melting steps release the curl-biased circuit layer and the strained layer as a unit to roll in one or more turns into a generally cylindrical shape. - View Dependent Claims (9, 10)
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Specification