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Dual-cure nanostructure transfer film

  • US 10,106,643 B2
  • Filed: 03/31/2015
  • Issued: 10/23/2018
  • Est. Priority Date: 03/31/2015
  • Status: Active Grant
First Claim
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1. A transfer film comprising:

  • a template layer having a first major surface and an opposing second major surface, the second major surface comprising a structured non-planar release surface; and

    a backfill layer disposed upon and conforming to the non-planar structured surface, the backfill layer comprising a thermal cationically cured layer prepared as follows;

    preparing a mixture comprising;

    about 0.1 to about 20 wt-% of an epoxy curable by a first curing mechanism comprising thermal cationic curing;

    about 60 to about 90 wt-% of multifunctional acrylate monomers curable with a second curing mechanism different from the first curing mechanism, the multifunctional acrylate monomers selected from the group consisting of ethylene glycol diacrylate, ethylene glycol dimethacrylate, hexanediol diacrylate, triethylene glycol diacrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, glycerol triacrylate, pentaerthyitol triacrylate, pentaerythritol trimethacrylate, pentaerythritol tetraacrylate, pentaerythritol tetramethacrylate, neopentylglycol diacrylate, cycloaliphatic multifunctional (meth)acrylates, and combinations thereof; and

    about 5 to about 40 wt-% of a compatibilizer comprising molecules with acrylate functional groups and epoxy functional groups;

    curing the mixture by thermal cationic curing,wherein at least some of the epoxy functional groups of the epoxy and at least some of the epoxy functional groups of the compatibilizer are cured by thermal cationic curing to form a network of cross-linked epoxy having dispersed therein the multifunctional acrylate monomers, thereby forming the thermal cationically cured layer; and

    wherein the backfill layer forms a pressure sensitive adhesive at room temperature.

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