Dual-cure nanostructure transfer film
First Claim
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1. A transfer film comprising:
- a template layer having a first major surface and an opposing second major surface, the second major surface comprising a structured non-planar release surface; and
a backfill layer disposed upon and conforming to the non-planar structured surface, the backfill layer comprising a thermal cationically cured layer prepared as follows;
preparing a mixture comprising;
about 0.1 to about 20 wt-% of an epoxy curable by a first curing mechanism comprising thermal cationic curing;
about 60 to about 90 wt-% of multifunctional acrylate monomers curable with a second curing mechanism different from the first curing mechanism, the multifunctional acrylate monomers selected from the group consisting of ethylene glycol diacrylate, ethylene glycol dimethacrylate, hexanediol diacrylate, triethylene glycol diacrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, glycerol triacrylate, pentaerthyitol triacrylate, pentaerythritol trimethacrylate, pentaerythritol tetraacrylate, pentaerythritol tetramethacrylate, neopentylglycol diacrylate, cycloaliphatic multifunctional (meth)acrylates, and combinations thereof; and
about 5 to about 40 wt-% of a compatibilizer comprising molecules with acrylate functional groups and epoxy functional groups;
curing the mixture by thermal cationic curing,wherein at least some of the epoxy functional groups of the epoxy and at least some of the epoxy functional groups of the compatibilizer are cured by thermal cationic curing to form a network of cross-linked epoxy having dispersed therein the multifunctional acrylate monomers, thereby forming the thermal cationically cured layer; and
wherein the backfill layer forms a pressure sensitive adhesive at room temperature.
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Abstract
A transfer film includes a template layer having a first major surface and an opposing second major surface. The second major surface includes a structured non-planar release surface. A backfill layer is disposed upon and conforms to the non-planar structured surface. The backfill layer includes a first cross-linked polymer and a plurality of multifunctional monomers, which cure via different and independent curing mechanisms.
82 Citations
15 Claims
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1. A transfer film comprising:
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a template layer having a first major surface and an opposing second major surface, the second major surface comprising a structured non-planar release surface; and a backfill layer disposed upon and conforming to the non-planar structured surface, the backfill layer comprising a thermal cationically cured layer prepared as follows; preparing a mixture comprising; about 0.1 to about 20 wt-% of an epoxy curable by a first curing mechanism comprising thermal cationic curing; about 60 to about 90 wt-% of multifunctional acrylate monomers curable with a second curing mechanism different from the first curing mechanism, the multifunctional acrylate monomers selected from the group consisting of ethylene glycol diacrylate, ethylene glycol dimethacrylate, hexanediol diacrylate, triethylene glycol diacrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, glycerol triacrylate, pentaerthyitol triacrylate, pentaerythritol trimethacrylate, pentaerythritol tetraacrylate, pentaerythritol tetramethacrylate, neopentylglycol diacrylate, cycloaliphatic multifunctional (meth)acrylates, and combinations thereof; and about 5 to about 40 wt-% of a compatibilizer comprising molecules with acrylate functional groups and epoxy functional groups; curing the mixture by thermal cationic curing, wherein at least some of the epoxy functional groups of the epoxy and at least some of the epoxy functional groups of the compatibilizer are cured by thermal cationic curing to form a network of cross-linked epoxy having dispersed therein the multifunctional acrylate monomers, thereby forming the thermal cationically cured layer; and wherein the backfill layer forms a pressure sensitive adhesive at room temperature. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An article comprising:
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a receptor substrate having a receptor surface; a light transmission layer having a first major surface adhered to the receptor surface and an opposing second major surface having a structured non-planar surface, the light transmission layer comprising an interpenetrating network prepared as follows; preparing a mixture comprising; about 0.1 to about 20 wt-% of an epoxy curable by a first curing mechanism comprising thermal cationic curing; about 60 to about 90 wt-% of multifunctional acrylate monomers curable with a second curing mechanism different from the first curing mechanism, the multifunctional acrylate monomers selected from the group consisting of ethylene glycol diacrylate, ethylene glycol dimethacrylate, hexanediol diacrylate, triethylene glycol diacrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, glycerol triacrylate, pentaerthyitol triacrylate, pentaerythritol trimethacrylate, pentaerythritol tetraacrylate, pentaerythritol tetramethacrylate, neopentylglycol diacrylate, cycloaliphatic multifunctional (meth)acrylates, and combinations thereof; and about 5 to about 40 wt-% of a compatibilizer comprising molecules with acrylate functional groups and epoxy functional groups; curing the mixture by thermal cationic curing; wherein at least some of the epoxy functional groups of the epoxy and at least some of the epoxy functional groups of the compatibilizer are cured by thermal cationic curing to form a network of cross-linked epoxy having dispersed therein the multifunctional acrylate monomers, thereby forming a partially cured layer; and curing the partially cured layer by free radical curing; wherein at least some of the acrylate functional groups of the multifuctional acrylate monomers and at least some of the acrylate functional groups of the compatibilizer are cured by the free radical curing to form a cross-linked acrylate, and wherein the cross-linked epoxy produced by the thermal cationic curing and the cross-linked acrylate produced by the free radical curing form the interpenetrating network of the light transmission layer; and wherein the light transmission layer has a haze value of less than 2% and a visible light transmission greater than 85% and a decomposition temperature greater than 250 degrees centigrade. - View Dependent Claims (12, 13)
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14. A transfer film comprising:
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a template layer having a first major surface and an opposing second major surface, the second major surface comprising a structured non-planar release surface; and a backfill layer disposed upon and conforming to the non-planar structured surface, the backfill layer comprising a thermal cationically cured layer prepared as follows; preparing a mixture comprising; about 0.1 to about 15 wt-% of an epoxy curable by a first curing mechanism comprising thermal cationic curing; about 60 to about 90 wt-% of multifunctional acrylate monomers curable with a second curing mechanism different from the first curing mechanism; and about 5 to about 40 wt-% of a compatibilizer comprising molecules with acrylate functional groups and epoxy functional groups; curing the mixture by thermal cationic curing, wherein at least some of the epoxy functional groups of the epoxy and at least some of the epoxy functional groups of the compatibilizer are cured by thermal cationic curing to form a network of cross-linked epoxy having dispersed therein the multifunctional acrylate monomers, thereby forming the thermal cationically cured layer; and wherein the backfill layer forms a pressure sensitive adhesive at room temperature.
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15. A transfer film comprising:
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a template layer having a first major surface and an opposing second major surface, the second major surface comprising a structured non-planar release surface; and a backfill layer disposed upon and conforming to the non-planar structured surface, the backfill layer comprising a thermal cationically cured layer prepared as follows; preparing a mixture comprising; about 0.1 to about 20 wt-% of an epoxy curable by a first curing mechanism comprising thermal cationic curing; about 70 to about 90 wt-% of multifunctional acrylate monomers curable with a second curing mechanism different from the first curing mechanism; and about 5 to about 40 wt-% of a compatibilizer comprising molecules with acrylate functional groups and epoxy functional groups; curing the mixture by thermal cationic curing, wherein at least some of the epoxy functional groups of the epoxy and at least some of the epoxy functional groups of the compatibilizer are cured by thermal cationic curing to form a network of cross-linked epoxy having dispersed therein the multifunctional acrylate monomers, thereby forming the thermal canonically cured layer; and wherein the backfill layer forms a pressure sensitive adhesive at room temperature.
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Specification