Bidirectional shape memory device

• US 10,107,270 B2
• Filed: 02/25/2016
• Issued: 10/23/2018
• Est. Priority Date: 03/14/2013
• Status: Active Grant

• Current Assignee: Lawrence Livermore National Security LLC (Government of the United States of America)
• Original Assignee: Lawrence Livermore National Security LLC (Government of the United States of America)
• Inventors: Marion, III, John E., Bearinger, Jane P., Wilson, Thomas S., Small, IV, Ward, Maitland, Duncan J.
• Primary Examiner(s): Tanner, Jocelin
• Application Number:
  US15/053,293
• Publication Number:
  US 20160177929A1
• Time in Patent Office: 971 Days
• CPC Class Codes: A61B 17/3207 Atherectomy devices working by cutting or abrading; Similar devices specially adapted for non-vascular obstructions A61B17/32037 takes precedence; endoscopic cutting instruments A61B17/320016
• CPC Class Codes: A61B 17/320725 with radially expandable cutting or abrading elements A61B17/32075 takes precedence
• CPC Class Codes: A61B 2017/00867 shape memory effect for prostheses A61F2210/0014
• CPC Class Codes: A61B 2017/22084 stone- or thrombus-dissolving
• CPC Class Codes: A61B 2017/22094 for crossing total occlusions, i.e. piercing
• CPC Class Codes: F03G 7/065 using a shape memory element
• CPC Class Codes: F16K 31/025 actuated by thermo-electric means
• CPC Class Codes: F16K 99/0005 Lift valves
• CPC Class Codes: F16K 99/0038 using shape memory alloys
• CPC Class Codes: F16K 99/0044 using thermo-electric means
• CPC Class Codes: H01H 2205/002 fixed to operating part
• CPC Class Codes: H01H 37/323 making use of shape memory materials in thermal relays H01H61/0107; release mechanism H01H71/145; treatment of SMF alloys C22F1/006; for control of temperature G05D23/024
• CPC Class Codes: H01H 37/46 actuated due to expansion or contraction of a solid deflection of a bimetallic element H01H37/52
• CPC Class Codes: Y02E 10/46 Conversion of thermal power into mechanical power, e.g. Rankine, Stirling or solar thermal engines

Abstract

A resistively heated shape memory polymer device is operated using resistive heating to heat the shape memory polymer device. The resistively heated shape memory polymer device is made by providing a wire that includes a resistive medium. The wire is coated with a first shape memory polymer. The wire is exposed and electrical leads are attached to the wire. In one embodiment the shape memory polymer device is in the form of a clot destruction device. In another embodiment the shape memory polymer device is in the form of a microvalve. In another embodiment the shape memory polymer device is in the form of a micropump. In yet another embodiment the shape memory polymer device is in the form of a thermostat or relay switch.

Claims

1. A micropump device, comprising:

a micropump body,

a moveable cylinder in said micropump body,

a coil made from a wire embedded in shape memory polymer to provide said coil, wherein said coil includes

a first loop of said wire embedded in shape memory polymer wherein said first loop is in a first loop shape,

a second loop of said wire embedded in shape memory polymer wherein said second loop is in a second loop shape,

wherein said second loop is adjacent said first loop, and

a power source that provides a current to said coil and said current causes contracting of said coil, wherein said power source is turned on and off causing said current to said coil to be turned on and off resulting in said current alternatingly causing contracting of said coil moving said moveable cylinder in said micropump body for operating the micropump device.