×

Thermal module

  • US 10,107,558 B2
  • Filed: 09/02/2013
  • Issued: 10/23/2018
  • Est. Priority Date: 09/02/2013
  • Status: Active Grant
First Claim
Patent Images

1. A thermal module used to contact a heat source with a heat surface, the thermal module comprising a vapor chamber having multiple sub-vapor chambers, each vapor chamber comprising an independent compartment, adjoining each other, and a single partition board disposed between each two sub-vapor chambers to partition the sub-vapor chambers, each sub-vapor chamber communicating with an open end of at least one independent heat pipe extending laterally from a side of each sub-vapor chamber, the open end communicating with a heat pipe chamber in the heat pipe, whereby the sub-vapor chambers communicate with separate heat pipe chambers, respectively;

  • wherein the heat surface of the heat source has a plurality of sections having different temperatures, and a sub-vapor chamber is respectively in alignment and contact with each of the plurality of different temperature sections of the heat surface of the heat source.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×