Sensor device and electronic apparatus

• US 10,107,653 B2
• Filed: 01/14/2015
• Issued: 10/23/2018
• Est. Priority Date: 07/13/2011
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Sakuma, Masayasu, Kobayashi, Yoshihiro, Kitamura, Shojiro, Chino, Taketo
• Primary Examiner(s): Caputo, Lisa
• Assistant Examiner(s): Roberts, Herbert K
• Application Number:
  US14/596,853
• Publication Number:
  US 20150122020A1
• Time in Patent Office: 1,378 Days
• CPC Class Codes: G01C 19/5769 Manufacturing; Mounting; Housings
• CPC Class Codes: G01C 21/166 Mechanical, construction or arrangement details of inertial navigation systems
• CPC Class Codes: G01D 11/245 Housings for sensors
• CPC Class Codes: G01D 11/30 Supports specially adapted for an instrument; Supports specially adapted for a set of instruments
• CPC Class Codes: H01R 12/72 coupling with the edge of the rigid printed circuits or like structures
• CPC Class Codes: H05K 1/148 Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
• CPC Class Codes: H05K 2201/09163 Slotted edge

Abstract

A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.

Claims

1. A sensor device comprising:

a housing member having first through sixth walls and an inside space enclosed by the first through sixth walls;

a through-hole provided in the first wall of the housing member;

a first board provided on an inner surface of the first wall so as to cover an opening of the through-hole;

second, third, and fourth boards respectively provided on inner surfaces of the second, third, and fourth walls;

a connector provided at the first board so as to be exposed to an outside of the sensor device through the through-hole; and

first through third sensor components respectively provided on the second, third, and fourth boards, wherein

the first through third sensor components respectively have first through third detection axes intersecting with each other

the connector outputs a signal from the first sensor component, a signal from the second sensor component, and a signal from the third sensor component, and

wherein the second wall has a first recess that is open toward the second board, and

the first sensor component is housed in the first recess so that the first sensor component is located between the second wall and the second board, and

a depth of the first recess is larger than a thickness of the first sensor component.

2. The sensor device according to claim 1, wherein

the third wall has a second recess opened toward the third board, and

the second sensor component is housed in the second recess so that the second sensor component is located between the third wall and the third board.

3. The sensor device according to claim 2, wherein:

four of the first through sixth walls define side walls of the sensor device,

remaining two of the first through sixth walls define upper and bottom lids of the sensor device, and

the housing member is in a rectangular parallelepiped shape.

4. The sensor device according to claim 2, wherein:

five of the first through sixth walls define a main body of the sensor device,

a remaining one of the first through sixth walls defines a lid of the sensor device, and

the housing member is in a rectangular parallelepiped shape.

5. The sensor device according to claim 1, wherein

the first through third sensor components are angular velocity sensors.

6. The sensor device according to claim 1, wherein

the first through third sensor components are acceleration sensors.

7. An electronic apparatus comprising:

the sensor device according to claim 1.

8. The sensor device according to claim 1, wherein

a depth of the second recess is smaller than a thickness of the second sensor component.