GMR sensor within molded magnetic material employing non-magnetic spacer
First Claim
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1. An integrated circuit comprising:
- a leadframe;
a die having a top surface, a bottom surface, and a plurality of perimeter sides and including at least one magnetoresistive magnetic field sensor element disposed proximate to the top surface, wherein the bottom surface is bonded to the leadframe;
a molded magnetic material encapsulating the die and at least a portion of the leadframe, and providing a magnetic field having a vertical component perpendicular to the top surface of the die; and
a first non-magnetic material disposed between the die and the molded magnetic material only along the plurality of perimeter sides of the die, so that the first non-magnetic material spaces the molded magnetic material away from the plurality of perimeter sides of the die such that a magnitude of a lateral magnetic field component across the top surface of the die is less than a saturation point of the at least one magnetic field sensor.
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Abstract
An integrated circuit includes a leadframe, and a die having a top surface, a bottom surface, and a plurality of perimeter sides and including at least one magnetic field sensor element disposed proximate to the top surface, wherein the bottom surface is bonded to the leadframe. A molded magnetic material encapsulates the die and at least a portion of the leadframe, and provides a magnetic field substantially perpendicular to the top surface of the die. A non-magnetic material is disposed between the die and the molded magnetic material at least along perimeter sides of the die intersecting a lateral magnetic field component which is parallel to the top surface of the die.
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Citations
15 Claims
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1. An integrated circuit comprising:
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a leadframe; a die having a top surface, a bottom surface, and a plurality of perimeter sides and including at least one magnetoresistive magnetic field sensor element disposed proximate to the top surface, wherein the bottom surface is bonded to the leadframe; a molded magnetic material encapsulating the die and at least a portion of the leadframe, and providing a magnetic field having a vertical component perpendicular to the top surface of the die; and a first non-magnetic material disposed between the die and the molded magnetic material only along the plurality of perimeter sides of the die, so that the first non-magnetic material spaces the molded magnetic material away from the plurality of perimeter sides of the die such that a magnitude of a lateral magnetic field component across the top surface of the die is less than a saturation point of the at least one magnetic field sensor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method for fabricating a semiconductor circuit comprising:
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bonding at least a pair of pre-formed strips of non-magnetic material to a leadframe, the pre-formed strips being spaced apart and parallel to one another; bonding a die to the leadframe between the pre-formed strips, the die having at least a pair of magnetoresistive sensor elements disposed on a top surface and spaced apart from one another along an axis, the die positioned such that the axis intersect the pair of pre-formed strips; applying an isolation layer over the die, leadframe, and pre-formed strips; encapsulating the die, the pre-formed strips, and at least a portion of the leadframe in a molded magnetic material, the isolation layer electrically isolating the die, leadframe, and pre-formed strips from the molded magnetic material; and magnetizing the molded magnetic material to form a magnetic field substantially perpendicular to the top surface of the die and such that any magnetic field component parallel to the top surface is parallel to the axis. - View Dependent Claims (13)
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14. An integrated circuit comprising:
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a leadframe; a die having a top surface, a bottom surface, and a plurality of perimeter sides and including at least one magnetoresistive magnetic field sensor element disposed proximate to the top surface, wherein the bottom surface is bonded to the leadframe; a molded magnetic material encapsulating the die and at least a portion of the leadframe; and a first non-magnetic material disposed between the die and the molded magnetic material only along the plurality of perimeter sides of the die, so that the first non-magnetic material spaces the molded magnetic material away from the plurality of perimeter sides of the die, and where the first non-magnetic material only extends along the plurality of perimeter sides between the bottom surface and the top surface. - View Dependent Claims (15)
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Specification