Chip electronic component and board for mounting thereof

• US 10,109,409 B2
• Filed: 11/14/2014
• Issued: 10/23/2018
• Est. Priority Date: 05/21/2014
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Lee, Dong Hwan, Yoon, Chan, Cha, Hye Yeon, Han, Jin Woo
• Primary Examiner(s): Thompson, Timothy
• Assistant Examiner(s): Alonzo Miller, Rhadames J
• Application Number:
  US14/541,552
• Publication Number:
  US 20150340149A1
• Time in Patent Office: 1,439 Days
• Field of Search: 174260, 336200, 336208
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 2017/0066 with a magnetic layer
• CPC Class Codes: H01F 2017/0073 with a special conductive pattern, e.g. flat spiral
• CPC Class Codes: H01F 2027/2809 on stacked layers
• CPC Class Codes: H01F 27/24 Magnetic cores
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/0347 Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias reinforcing the conductive pattern H05K3/24
• CPC Class Codes: H05K 2201/086 for inductive purposes, e.g. printed inductor with ferrite core
• CPC Class Codes: H05K 2201/09727 Varying width along a single conductor; Conductors or pads having different widths
• CPC Class Codes: H05K 2201/09736 Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
• CPC Class Codes: H05K 2201/098 Special shape of the cross-section of conductors, e.g. very thick plated conductors
• CPC Class Codes: H05K 2201/1003 Non-printed inductor
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 2203/1476 Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
• CPC Class Codes: H05K 3/241 characterised by the electroplating method; means therefor, e.g. baths or apparatus
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A chip electronic component may include a magnetic material body including an insulating substrate and coil conductor patterns formed on at least one surface of the insulating substrate, and external electrodes disposed on both end portions of the magnetic material body so as to be connected to end portions of the coil conductor patterns, respectively. In a cross section of the magnetic material body in a length direction, a thickness of an innermost loop/section of the coil conductor patterns may be smaller than a thickness of the remaining loops/sections of the coil conductor pattern.

Claims

1. A chip electronic component comprising:

a magnetic material body including

an insulating substrate and

a coil conductor pattern disposed on at least one surface of the insulating substrate, the coil conductor comprising a plurality of loops/sections, the plurality of loops/sections including an innermost loop/section and remaining loops/sections;

external electrodes disposed on external portions of the magnetic material body to be connected to end portions of the coil conductor patterns,

wherein in a cross section of the magnetic material body in a length direction, and a thickness of the innermost loop/section is smaller than thicknesses of the at least two of the remaining loops/sections of the coil conductor patterns,

wherein the innermost loop/section comprises one or more pattern plating layers, and the remaining loops/sections comprise one or more pattern plating layers, at least one electroplating layer is formed on the one or more pattern plating layers, and the at least one electroplating layer is not present on the innermost loop/section, and

a number of the electroplating layers of the innermost loop/section of the coil conductor pattern is different from a number of the electroplating layers of the remaining loops/sections of the coil conductor pattern.

2. The chip electronic component of claim 1, wherein the remaining loops/sections comprises an outermost loop/section and at least one inner loop/section, the inner loop/section located between the outermost loop/section and the innermost loop/section,

wherein a width of the innermost loop/section of the coil conductor pattern is Wo1, a width of the outermost loop/section of the coil conductor pattern is Wo2, and a width of the at least one inner loop/section is Wi, and Wo1<

Wi<

Wo2.

3. The chip electronic component of claim 1, wherein the remaining loops/sections comprises at least one inner loop/section and an outermost loop/section,

wherein each of the at least one inner loop/section has a width and each of the widths of the inner loops/sections are the same as each other.

4. A board for mounting of a chip electronic component, comprising:

a printed circuit board having first and second electrode pads disposed on the printed circuit board; and

the chip electronic component of claim 1 installed on the printed circuit board.

5. The chip electronic component of claim 1, a width of the at least one electroplating layer on a side of the pattern plating layer of the outermost loop/section farthest from the innermost loop/section is greater than a width of the electroplating layer on a side opposite to the farthest side.

6. The chip electronic component of claim 1, wherein the thicknesses of at least two adjacent loops/sections of the remaining loops/sections are the same as each other,

and a number of the plating layers of the innermost loop/section of the coil conductor pattern is more than a number of the plating layers of the remaining loops/sections of the coil conductor pattern.

7. A chip electronic component comprising:

a magnetic material body including an insulating substrate and a coil conductor pattern disposed on at least one surface of the insulating substrate, the coil conductor pattern comprising an innermost loop/section and at least two adjacent inner loops/sections located adjacent to each other and adjacent to the innermost loop/section;

external electrodes disposed on both end portions of the magnetic material body to be connected to end portions of the coil conductor patterns,

wherein in the case that in a cross section of the magnetic material body in a length direction, and a width of the innermost loop/section is Wo1 and a width of each of the at least two inner loops/sections is Wi, and Wo1<

Wi,

wherein the innermost loop/section comprises one or more pattern plating layers, and the remaining loops/sections comprise one or more pattern plating layers, at least one electroplating layer is formed on the one or more pattern plating layers, and the at least one electroplating layer is not present on the innermost loop/section, and

a number of the electroplating layers of the innermost loop/section of the coil conductor pattern is different from a number of the electroplating layers of the remaining loops/sections of the coil conductor pattern.

8. The chip electronic component of claim 7, the coil conductor pattern further comprising an outermost loop/section, wherein a width of the outermost loop section is Wo2, and Wo2>

Wi.

9. The chip electronic component of claim 7, wherein the coil conductor pattern further comprising an outermost loop/section and the at least two inner loops/sections are located between the innermost loop/section and the outermost loop/section, the inner loops/sections each having a width, and all of the widths of the inner loops/sections located between the innermost loop/section and the outermost loop/section are the same as each other.

10. The chip electronic component of claim 7, the coil conductor pattern optionally comprising additional loops/sections located outbound of the at least two inner loops/sections, each of the additional loops/sections having a thickness, wherein a thickness of the innermost loop/section is smaller than a thickness of the inner loop/section and each thickness of the additional loops/sections.

11. The chip electronic component of claim 7, the coil conductor pattern optionally comprising additional loop/sections, wherein the innermost loop/section comprises one or more pattern plating layers and the inner and additional loops/sections comprise one or more pattern plating layers and one or more electroplating layers formed on the one or more pattern plating layers, wherein at least one of the one or more pattern plating layers is not present on the innermost loop/section.

12. A board for mounting of a chip electronic component, comprising:

a printed circuit board having first and second electrode pads disposed on the printed circuit board; and

the chip electronic component of claim 7 installed on the printed circuit board.

13. The chip electronic component of claim 7, wherein the widths of the at least two adjacent inner loops/sections are the same as each other,

and a number of the plating layers of the innermost loop/section of the coil conductor pattern is more than a number of the plating layers of the remaining loops/sections of the coil conductor pattern.

14. A chip electronic component comprising:

a magnetic material body including an insulating substrate and coil conductor patterns disposed on at least one surface of the insulating substrate, the coil conductor patterns comprising an innermost loop/section, a plurality of inner loops/sections located outboard to the innermost loop/section, and an outermost loop section positioned outboard to the innermost loop/section and outboard to the inner loops/sections;

first and second external electrodes disposed on first and second end portions of the magnetic material body configured for connection to end portions of the coil conductor patterns,

wherein in the case that in a cross section of the magnetic material body in a length direction, widths of at least two adjacent inner loops/sections of the plurality of inner loops/sections are different from a width of the innermost loop/section Wo1 which is related to a width of the outermost loop/section Wo2 by a relationship of Wo1<

Wo2,

wherein the innermost loop/section comprises one or more pattern plating layers, and the remaining loops/sections comprise one or more pattern plating layers, at least one electroplating layer is formed on the one or more pattern plating layers, and the at least one electroplating layer is not present on the innermost loop/section, and

a number of the electroplating layers of the innermost loop/section of the coil conductor pattern is different from a number of the electroplating layers of the remaining loops/sections of the coil conductor pattern.

15. The chip electronic component of claim 14, wherein a width of one or more inner loops/sections located between the innermost loop/section and the outermost loop/section is Wi, and Wo1<

Wi<

Wo2.

16. The chip electronic component of claim 14, wherein each of the inner loops/sections have a width and all of the widths of the inner loops/sections located between the outermost loop/section and the innermost loop/section are the same as each other.

17. The chip electronic component of claim 14, wherein a thickness of the innermost loop/section is smaller than a thickness of the outermost loop/section.

18. The chip electronic component of claim 14, wherein the innermost loop/section comprises one or more pattern plating layers, and the outermost loop/section comprises one or more pattern plating layers and one or more electroplating layers formed on the pattern plating layers,

wherein at least one of the one or more electroplating layers is not present on the innermost loop/section.

19. A board for mounting of a chip electronic component, comprising:

a printed circuit board having first and second electrode pads disposed on the printed circuit board; and

the chip electronic component of claim 14 installed on the printed circuit board.

20. The chip electronic component of claim 14, wherein the widths of at least two adjacent inner loops/sections of the plurality of inner loops/sections are the same as each other,

and a number of the plating layers of the innermost loop/section of the coil conductor pattern is more than a number of the plating layers of the remaining loops/sections of the coil conductor pattern.

21. A chip electronic component comprising:

a magnetic material body including an insulating substrate and at least one coil conductor patterns disposed on at least one surface of the insulating substrate, the magnetic material body further comprising two ends;

external electrodes disposed on both end portions of the magnetic material body to be connected to end portions of the coil conductor patterns,

wherein in a cross section of the magnetic material body in a length direction, an innermost loop/section of a plurality of loops/sections of each of the at least one coil conductor patterns is configured of one or more pattern plating layers, and remaining loops/sections of the plurality of loops/sections of each of the at least one coil conductor patterns include one or more pattern plating layers and one or more electroplating layers formed on the one or more pattern plating layers, and the innermost loop/section does not include at least one of the one or more electroplating layers,

wherein the innermost loop/section comprises one or more pattern plating layers, and the remaining loops/sections comprise one or more pattern plating layers, at least one electroplating layer is formed on the one or more pattern plating layers, and the at least one electroplating layer is not present on the innermost loop/section, and

a number of the electroplating layers of the innermost loop/section of the coil conductor pattern is different from a number of the electroplating layers of the remaining loops/sections of the coil conductor pattern.

22. The chip electronic component of claim 21, wherein the remaining loops/sections comprise an outermost loop/section and a plurality of inner loops/sections,

wherein the inner loops/sections are positioned between the innermost loop/section and the outermost loop/section, and a width of the innermost loop/section is Wo1, a width of the outermost loop/section is Wo2, and a width of one of the plurality of inner loops/sections is Wi, and Wo1<

Wi<

Wo2.

23. The chip electronic component of claim 21, wherein the remaining loops/sections comprise a plurality of inner loops/sections and an outermost loop/section,

wherein the inner loops/sections are positioned outward of the innermost loop/section and the outermost loop/section is positioned outward of the plurality of inner loops/sections,

wherein each of the plurality of inner loops/sections has a width, and all of the widths of the plurality of inner loops/sections are the same as each other.

24. The chip electronic component of claim 21, wherein for at least one of the coil conductor patterns, a thickness of the innermost loop/section is smaller than a thickness of the remaining loops/sections.

25. A board for mounting of a chip electronic component, comprising:

a printed circuit board having first and second electrode pads disposed on the printed circuit board; and

the chip electronic component of claim 21 installed on the printed circuit board.

26. The chip electronic component of claim 21, wherein thicknesses of at least two adjacent loops/sections of the remaining loops/sections are the same as each other,

and a number of the plating layers of the innermost loop/section of the coil conductor pattern is more than a number of the plating layers of the remaining loops/sections of the coil conductor pattern.