Semiconductor device and manufacturing method thereof
First Claim
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1. A semiconductor device, comprising:
- a first fin structure, a second fin structure and a third fin structure respectively protruding from a top surface of a substrate, wherein the first fin structure, the second fin structure and the third fin structure respectively extend along a first direction, the third fin structure and the first fin structure are aligned along the first direction, and the second fin structure and the third fin structure are arranged along a second direction, and wherein the first fin structure has a first end;
a patterned metal gate layer disposed on the substrate, wherein the patterned metal gate layer covers the first end of the first fin structure; and
a first epitaxial layer disposed at a side of the second fin structure, the second fin structure and the first epitaxial layer being arranged along the first direction, and the first epitaxial layer and the first fin structure being arranged along the second direction, wherein the first epitaxial layer has a second end, and the first end and the second end facing the first direction.
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Abstract
A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a substrate, a patterned conductive layer and an epitaxial layer. The substrate includes a first fin structure and a second fin structure respectively protruding from a top surface of the substrate, and the second fin structure has a recess. The patterned conductive layer is disposed on the substrate and covers a first end of the first fin structure. The epitaxial layer is disposed in the recess. The first end of the first fin structure and a second end of the epitaxial layer face a first direction.
8 Citations
18 Claims
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1. A semiconductor device, comprising:
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a first fin structure, a second fin structure and a third fin structure respectively protruding from a top surface of a substrate, wherein the first fin structure, the second fin structure and the third fin structure respectively extend along a first direction, the third fin structure and the first fin structure are aligned along the first direction, and the second fin structure and the third fin structure are arranged along a second direction, and wherein the first fin structure has a first end; a patterned metal gate layer disposed on the substrate, wherein the patterned metal gate layer covers the first end of the first fin structure; and a first epitaxial layer disposed at a side of the second fin structure, the second fin structure and the first epitaxial layer being arranged along the first direction, and the first epitaxial layer and the first fin structure being arranged along the second direction, wherein the first epitaxial layer has a second end, and the first end and the second end facing the first direction. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A manufacturing method of a semiconductor device, comprising:
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providing a first fin line and a second fin line respectively protruding from a top surface of a substrate, wherein the first fin line and the second fin line respectively extend along a first direction, and the first fin line and the second fin line are arranged along a second direction; performing a fin line cutting process for cutting the first fin line and the second fin line, so as to form a first fin segment and a second fin segment, wherein the first fin segment has a first end, the second fin segment has a second end, and the first end and the second end face the first direction; and forming a patterned conductive layer on the substrate, wherein the patterned conductive layer covers the first end of the first fin segment, and the patterned conductive layer does not cover the second end of the second fin segment. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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Specification