Molded power-supply module with bridge inductor over other components

• US 10,111,333 B2
• Filed: 03/07/2011
• Issued: 10/23/2018
• Est. Priority Date: 03/16/2010
• Status: Active Grant

• Current Assignee: Intersil Americas LLC (Renesas Electronics Corporation)
• Original Assignee: Intersil Americas LLC (Renesas Electronics Corporation)
• Inventors: Yin, Jian, Harris, Matthew
• Primary Examiner(s): Ng, Sherman
• Application Number:
  US13/042,332
• Publication Number:
  US 20110228507A1
• Time in Patent Office: 2,787 Days
• Field of Search: 257787-796, 257676, 257678, 361760, 361763-766, 361773-774, 361782, 361811, 361729, 361761, 174260, 174250, 174251, 174255
• CPC Class Codes: H01F 2027/065 Mounting on printed circuit boards
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/495 Lead-frames or other flat leads H01L23/498 takes precedence; lead frame interconnections between components H01L23/52
• CPC Class Codes: H01L 23/49531 the additional leads being a wiring board
• CPC Class Codes: H01L 23/49575 Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/18 : Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 2201/1003 : Non-printed inductor
• CPC Class Codes: H05K 2201/10166 : Transistor
• CPC Class Codes: H05K 2201/10515 : Stacked components
• CPC Class Codes: H05K 2203/1327 : Moulding over PCB locally or completely applying non-metallic protective coatings for encapsulating mounted components H05K3/284
• CPC Class Codes: H05K 3/202 : using self-supporting metal foil pattern
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence

Abstract

An embodiment of a power-supply module includes a molded package, power-supply components disposed within the package, and an inductor disposed within the package and over the power-supply components. For example, for a given output-power rating, such a power-supply module may be smaller, more efficient, and more reliable than, and may run cooler than, a power-supply module having the inductor mounted outside of the package or side-by-side with other components. And for a given size, such a module may have a higher output-power rating than a module having the inductor mounted outside of the package or side-by-side with other components.

Claims

1. A power supply module, comprising:

a platform having a side;

a package disposed over the platform;

power supply components disposed within the package, disposed over the side of the platform, and attached to the platform; and

an inductor structure having an inductor body disposed within the package, disposed over the side of the platform, and disposed over the power supply components, the inductor structure also having an inductor disposed within the inductor body and having inductor leads attached to the inductor body and attached to the platform, wherein;

the platform includes a lead frame and a printed circuit board mounted to the lead frame;

one of the power supply components is mounted to the lead frame; and

another of the power supply components is mounted to the printed circuit board.

2. The power supply module of claim 1 wherein the package includes an epoxy resin.

3. The power supply module of claim 1 wherein one of the power supply components comprises a controller.

4. The power supply module of claim 1 wherein one of the power supply components comprises a transistor.

5. The power supply module of claim 1 wherein one of the power supply components comprises a resistor.

6. The power supply module of claim 1 wherein one of the power supply components comprises a capacitor.

7. The power supply module of claim 1 wherein the leads support the inductor body over the power supply components.

8. The power supply module of claim 1, further comprising another inductor body disposed over the power supply components.

9. The power supply module of claim 1 wherein:

the inductor body is mounted to the lead frame.

10. The power supply module of claim 1 wherein:

the inductor body is mounted to the printed circuit board.

11. A system, comprising:

a power supply module, comprising;

a package;

a platform having a side and disposed beneath the package;

power supply components disposed within the package, disposed over the side of the platform, and attached to the platform;

an inductor body disposed within the package, over the power supply components, and over the side of the platform;

inductor leads attached to the inductor body and attached to the platform; and

a supply output node, wherein;

the platform includes a lead frame and a printed circuit board mounted to the lead frame;

one of the power supply components is mounted to the lead frame; and

another of the power supply components is mounted to the printed circuit board; and

an apparatus coupled to the supply output node.

12. The system of claim 11 wherein the apparatus comprises an integrated circuit.

13. The system of claim 12 wherein the integrated circuit comprises a processor.

14. The system of claim 12 wherein the integrated circuit comprises a memory.

15. A method, comprising:

attaching power supply components to a platform over a side of the platform;

attaching an inductor body to the platform via inductor leads, the inductor body disposed over the power supply components and over the side of the platform; and

forming a package over the inductor body, the inductor leads, the power supply components, and the platform, wherein the platform includes a lead frame, the method further comprising;

mounting a printed circuit board to the lead frame;

mounting one of the power supply components to the lead frame; and

mounting another of the power supply components to the printed circuit board.

16. The method of claim 15 wherein:

attaching the inductor body includes mounting the inductor body to the platform over the components.

17. The method of claim 15 wherein forming the package comprises encapsulating the inductor body and the power supply components in a packaging material.

18. The method of claim 15 wherein:

attaching the inductor body includes attaching multiple inductor bodies to the platform over the power supply components; and

forming the package comprises forming the package over the inductor bodies and the components.

19. A power supply module, comprising:

a platform having a side;

a package disposed over the platform;

power supply components disposed within the package and over the side of the platform; and

an inductor structure having an inductor body and inductor leads, the inductor body disposed within the package, over the power supply components, and over the side of the platform such that none of the power supply components support the inductor body, wherein;

the platform includes a lead frame and a printed circuit board mounted to the lead frame;

one of the power supply components is mounted to the lead frame; and

another of the power supply components is mounted to the printed circuit board.