Dielectric thick film ink

• US 10,113,073 B2
• Filed: 04/07/2015
• Issued: 10/30/2018
• Est. Priority Date: 04/07/2015
• Status: Active Grant

• Current Assignee: GM Global Technology Operations LLC (General Motors Company)
• Original Assignee: GM Global Technology Operations LLC (General Motors Company)
• Inventors: Albaugh, Lisa M., Smith, David A., Guse, Timothy J.
• Primary Examiner(s): Rummel, Ian A
• Application Number:
  US14/680,200
• Publication Number:
  US 20160297977A1
• Time in Patent Office: 1,302 Days
• CPC Class Codes: C09D 11/03 characterised by features other than the chemical nature of the binder
• CPC Class Codes: C09D 11/037 characterised by the pigment
• CPC Class Codes: C09D 11/14 based on carbohydrates
• CPC Class Codes: C09D 11/52 Electrically conductive inks
• CPC Class Codes: C09K 5/10 Liquid materials
• CPC Class Codes: H01B 3/08 quartz; glass; glass wool; slag wool; vitreous enamels
• CPC Class Codes: H01B 3/12 ceramics

Abstract

A thermally conductive thick film dielectric ink for an electronic device includes a mixture of an organic medium, a glass binder, and a technical ceramic powder having ceramic particles dispersed throughout the thick film dielectric ink mixture.

Claims

1. A thermally conductive thick film dielectric ink for an electronic device, the thermally conductive thick film dielectric ink comprising a mixture of:

an organic medium present in an amount from about 14.0 to about 32.0% by weight of the thick film dielectric ink, wherein the organic medium comprises 2,2,4-trimethyl-1,3-pentanediol present in an amount from about 81.0% to about 82.0% by weight of the organic medium, Diethylene Glycol Dibutyl Ether present in an amount from about 7.0% to about 11.0% by weight of the organic medium, Dodecyl Alcohol present in an amount about 2.0% by weight of the organic medium, Tridecyl Alcohol present in an amount from about 1.0% to about 4.0% by weight of the organic medium, and Ethyl Cellulose present in an amount from about 3.0 to about 6.5% by weight of the organic medium;

a glass binder; and

a technical ceramic powder having ceramic particles dispersed throughout the thermally conductive thick film dielectric ink mixture.

2. The thermally conductive thick film dielectric ink of claim 1, wherein the technical ceramic powder is present in an amount from about 4.0% to about 22.0% by weight of the thick film dielectric ink.

3. The thermally conductive thick film dielectric ink of claim 2, wherein the technical ceramic powder is aluminum nitride, silicon carbide, beryllium oxide, boron nitride, or silicon nitride.

4. The thermally conductive thick film dielectric ink of claim 1, wherein the glass binder is present in an amount from about 48.0% to about 82.0% by weight of the thick film dielectric ink.

5. The thermally conductive thick film dielectric ink of claim 4, wherein the glass binder comprises lead(II) oxide, silicon dioxide, boron trioxide, and aluminum oxide.

6. The thermally conductive thick film dielectric ink of claim 5, wherein the lead(II) oxide is present in an amount from about 65.0% to about 67.5% by weight of the glass binder, the silicon dioxide is present in an amount from about 21.5% to about 22.5% by weight of the glass binder, the boron trioxide is present in an amount from about 8.0% to about 9.0% by weight of the glass binder, and the aluminum oxide is present in an amount from about 2.0% to about 3.0% by weight of the glass binder.

7. A power inverter for hybrid vehicles comprising:

a metal layer forming a circuit on which electronic components are disposed;

a substrate forming a heat sink; and

a thick film thermally conductive dielectric ink layer according to claim 1, wherein the thick film thermally conductive dielectric ink layer is interposed between the metal layer and the substrate.