Multistage sensing device

• US 10,113,925 B2
• Filed: 04/15/2016
• Issued: 10/30/2018
• Est. Priority Date: 10/19/2015
• Status: Active Grant

• Current Assignee: National Tsing Hua University
• Original Assignee: National Tsing Hua University
• Inventors: Lai, Wei-Cheng, Fang, Wei-Leun
• Primary Examiner(s): Dunlap, Jonathan
• Assistant Examiner(s): Hollington, Octavia
• Application Number:
  US15/130,214
• Publication Number:
  US 20170108389A1
• Time in Patent Office: 928 Days
• Field of Search: 73862041-862046
• CPC Class Codes: G01L 1/04 by measuring elastic deformation of gauges, e.g. of springs
• CPC Class Codes: G01L 1/14 by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
• CPC Class Codes: G01L 1/18 using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
• CPC Class Codes: G01L 1/26 Auxiliary measures taken, or devices used, in connection with the measurement of force, e.g. for preventing influence of transverse components of force, for preventing overload
• CPC Class Codes: G01L 5/162 of piezoresistors

Abstract

A multistage sensing device includes a substrate, a deformable unit, and a sensor unit. The deformable unit has a first body disposed on the substrate, and a second body disposed on the first body and opposite to the substrate. The sensor unit includes a first sensor element and a second sensor element that are disposed in the deformable unit. The first sensor element is disposed between the second sensor element and the substrate. The second sensor element is operable to measure deformation of the second body when an external force is applied to the deformable unit. The first sensor element is operable to measure deformation of the first body when the first body is deformed by the deformation of the second body.

Claims

1. A multistage sensing device comprising:

a substrate;

a deformable unit having a first body disposed on said substrate, and a second body disposed on said first body and opposite to said substrate; and

a sensor unit including a first sensor element and a second sensor element that are disposed in said deformable unit, said first sensor element being disposed between said second sensor element and said substrate,

wherein said second sensor element is operable to measure deformation of said second body when an external force is applied to said deformable unit, and said first sensor element is operable to measure deformation of said first body when said first body is deformed by the deformation of said second body, and

wherein said first body is formed with a first space, and said second body is formed with a second space.

2. The multistage sensing device as claimed in claim 1, wherein said sensor unit includes a first electrode, a second electrode, and a third electrode that are disposed in said deformable unit, said second electrode and an upper portion of said first electrode cooperatively define said second sensor element, and said third electrode and a lower portion of said first electrode cooperatively define said first sensor element.

3. The multistage sensing device as claimed in claim 2, wherein said first body and said second body of said deformable unit are each made of a dielectric material.

4. The multistage sensing device as claimed in claim 2, wherein said first, second and third electrodes are each made of metal.

5. The multistage sensing device as claimed in claim 1, wherein:

said first body has a first bottom portion formed on said substrate, a first side portion extending from a periphery of said first bottom portion away from said substrate, and a first top portion connected to said first bottom portion;

said first bottom portion, said first side portion and said first top portion cooperatively define said first space;

said second body has a second bottom portion formed on said first top portion, a second side portion extending from a periphery of said second bottom portion away from said substrate, and a second top portion connected to said second side portion and opposite to said second bottom portion; and

said second bottom portion, said second side portion and said second top portion cooperatively define said second space.

6. The multistage sensing device as claimed in claim 5, wherein a first electrode is disposed between said first top portion of said first body and said second bottom portion of said second body, a second electrode is disposed in said second top portion of said second body, and a third electrode is disposed in said first bottom portion of said first body.

7. The multistage sensing device as claimed in claim 6, wherein an entirety of said third electrode is disposed below an entirety of said first space, and is disposed above an entirety of said substrate.

8. The multistage sensing device as claimed in claim 1, further comprising a filling member received in at least one of said first space or said second space for changing stiffness of at least one of said first body or said second body, and said filling member is made of polydimethylsiloxane.

9. The multistage sensing device as claimed in claim 1, further comprising a filling member received in at least one of said first space or said second space, and having a stiffness tunable by an external electric field or an external magnetic field.

10. The multistage sensing device as claimed in claim 9, wherein said filling member includes an insulating fluid and a plurality of particles dispersed in said insulating fluid.

11. The multistage sensing device as claimed in claim 10, wherein said particles of said filling member are dielectric particles that are capable of aligning along the external electric field for increasing said stiffness of said filling member.

12. The multistage sensing device as claimed in claim 10, wherein said particles of said filling member are magnetic particles that are capable of aligning along the external magnetic field for increasing said stiffness of said filling member.

13. The multistage sensing device as claimed in claim 9, wherein said deformable unit further has at least one through hole penetrating though said second top portion of said second body and being in spatial communication with said second space, such that said filling member is capable of entering said second space through said at least one through hole.

14. The multistage sensing device as claimed in claim 13, wherein said deformable unit includes a covering layer disposed on said second top portion of said second body and covering said at least one through hole.

15. The multistage sensing device as claimed in claim 14, wherein said covering layer is made of a material selected from the group consisting of parylene C, Parylene D, Parylene N, silicon dioxide, silicon nitride, polyimide, metal, and combinations thereof.

16. The multistage sensing device as claimed in claim 13, wherein said second top portion of said second body is formed with a recess in which said second electrode is disposed.

17. The multistage sensing device as claimed in claim 16, wherein said deformable unit includes a covering layer that is disposed on said second top portion of said second body, that covers said at least one through hole, and that contacts and covers said second electrode.

18. The multistage sensing device as claimed in claim 17, wherein said covering layer is made of a material selected from the group consisting of parylene C, Parylene D, Parylene N, silicon dioxide, silicon nitride, polyimide, metal, and combinations thereof.

19. The multistage sensing device as claimed in claim 1, wherein said first and second sensor elements are each a piezoresistive member.

20. The multistage sensing device as claimed in claim 1, wherein an entirety of said first sensor element is disposed below an entirety of said second sensor element and is disposed above an entirety of said substrate.