Electrostatic discharge protection structure and fabrication method thereof
First Claim
1. An electrostatic discharge (ESD) protection structure, comprising:
- a substrate having a first region and a second region, wherein the first region and the second region are separated by a preset distance;
a well area formed in the substrate, wherein the well area covers the first region, the second region, and a region between the first region and the second region;
a first fin portion formed in the substrate in the first region and a second fin portion formed in the substrate in the second region, wherein the first fin portion has first-type doping ions and the second fin portion has second-type doping ions;
a dielectric layer, wherein the dielectric layer covers the well area between the first region and the second region, the first fin portion, and the second fin portion;
a supporting gate structure formed in the dielectric layer, wherein the supporting gate structure includes a first supporting gate crossing the first fin portion and covering portions of top and side surfaces of the first fin portion, and a second supporting gate crossing the second fin portion and covering portions of top and side surfaces of the second fin portion;
a conductive structure formed in the dielectric layer, wherein the conductive structure includes a first conductive structure connecting to the first fin portion and being configured to connect to a first bias voltage, and a second conductive structure connecting to the second fin portion and being configured to connect to a second bias voltage, and the first bias voltage and the second bias voltage are not equal to one another;
a first conductive layer formed on the dielectric layer and a top surface of the first supporting gate; and
a second conductive layer formed on the dielectric layer and a top surface of the second supporting gate.
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Abstract
A method is provided for fabricating an electrostatic discharge (ESD) protection structure. The method includes forming a substrate having a first region and a second region, wherein the first region and the second region have a preset distance; forming a well area in the substrate; forming a first fin portion in the substrate in the first region and a second fin portion in the substrate in the second region; forming a supporting gate structure, wherein the supporting gate structure includes a first supporting gate crossing the first fin portion and a second supporting gate crossing the second fin portion; forming a dielectric layer on the well area; and forming a conductive structure in the dielectric layer, wherein the conductive structure includes a first conductive structure connecting to the first fin portion and a second conductive structure connecting to the second fin portion.
4 Citations
18 Claims
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1. An electrostatic discharge (ESD) protection structure, comprising:
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a substrate having a first region and a second region, wherein the first region and the second region are separated by a preset distance; a well area formed in the substrate, wherein the well area covers the first region, the second region, and a region between the first region and the second region; a first fin portion formed in the substrate in the first region and a second fin portion formed in the substrate in the second region, wherein the first fin portion has first-type doping ions and the second fin portion has second-type doping ions; a dielectric layer, wherein the dielectric layer covers the well area between the first region and the second region, the first fin portion, and the second fin portion; a supporting gate structure formed in the dielectric layer, wherein the supporting gate structure includes a first supporting gate crossing the first fin portion and covering portions of top and side surfaces of the first fin portion, and a second supporting gate crossing the second fin portion and covering portions of top and side surfaces of the second fin portion; a conductive structure formed in the dielectric layer, wherein the conductive structure includes a first conductive structure connecting to the first fin portion and being configured to connect to a first bias voltage, and a second conductive structure connecting to the second fin portion and being configured to connect to a second bias voltage, and the first bias voltage and the second bias voltage are not equal to one another; a first conductive layer formed on the dielectric layer and a top surface of the first supporting gate; and a second conductive layer formed on the dielectric layer and a top surface of the second supporting gate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification