Three-dimensional memory device containing structurally reinforced pedestal channel portions and method of making thereof
First Claim
1. A three-dimensional memory device comprising:
- an alternating stack of insulating layers and electrically conductive layers located over a semiconductor surface;
a memory opening extending through the alternating stack;
a pedestal channel portion located at a bottom portion of the memory opening, comprising a semiconductor material, and contacting a top surface of the semiconductor surface; and
a memory stack structure located in the memory opening and contacting a top surface of the pedestal channel portion, wherein the memory stack structure comprises a memory film and a vertical semiconductor channel located inside the memory film,wherein;
a maximum lateral extent of the pedestal channel portion is greater than a maximum lateral dimension of an entire interface between the pedestal channel portion and the memory stack structure, the entire interface includes all surfaces at which the pedestal channel portion directly contacts the memory stack structure; and
the maximum lateral extent of the pedestal channel portion is provided above a horizontal plane including a top surface of the bottommost electrically conductive layer among the electrically conductive layers or below a horizontal plane including a bottom surface of a bottommost electrically conductive layer.
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Abstract
A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers located over a semiconductor surface, a memory opening extending through the alternating stack, a semiconductor pedestal channel portion located at a bottom portion of the memory opening and contacting a top surface of the semiconductor surface, and a memory stack structure located in the memory opening and contacting a top surface of the pedestal channel portion. The memory stack structure includes a memory film and a vertical semiconductor channel located inside the memory film. A maximum lateral extent of the pedestal channel portion is greater than a maximum lateral dimension of an entire interface between the pedestal channel portion and the memory stack structure.
61 Citations
18 Claims
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1. A three-dimensional memory device comprising:
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an alternating stack of insulating layers and electrically conductive layers located over a semiconductor surface; a memory opening extending through the alternating stack; a pedestal channel portion located at a bottom portion of the memory opening, comprising a semiconductor material, and contacting a top surface of the semiconductor surface; and a memory stack structure located in the memory opening and contacting a top surface of the pedestal channel portion, wherein the memory stack structure comprises a memory film and a vertical semiconductor channel located inside the memory film, wherein; a maximum lateral extent of the pedestal channel portion is greater than a maximum lateral dimension of an entire interface between the pedestal channel portion and the memory stack structure, the entire interface includes all surfaces at which the pedestal channel portion directly contacts the memory stack structure; and the maximum lateral extent of the pedestal channel portion is provided above a horizontal plane including a top surface of the bottommost electrically conductive layer among the electrically conductive layers or below a horizontal plane including a bottom surface of a bottommost electrically conductive layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification