Method of producing component board

• US 10,115,747 B2
• Filed: 12/25/2015
• Issued: 10/30/2018
• Est. Priority Date: 01/06/2015
• Status: Active Grant

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Fujiwara, Masaki
• Primary Examiner(s): Chan, Sing P
• Application Number:
  US15/541,826
• Publication Number:
  US 20170365628A1
• Time in Patent Office: 1,040 Days
• Field of Search: 156 64, 156247, 1562722, 1562728, 156701, 156712, 156719
• CPC Class Codes: B32B 2250/05 5 or more layers
• CPC Class Codes: B32B 2250/40 Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
• CPC Class Codes: B32B 2255/10 on synthetic resin layer or on natural or synthetic rubber layer
• CPC Class Codes: B32B 2307/20 having particular electrical or magnetic properties, e.g. piezoelectric
• CPC Class Codes: B32B 2307/40 having particular optical properties
• CPC Class Codes: B32B 2457/206 Organic displays, e.g. OLED
• CPC Class Codes: B32B 27/06 as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to a layer of a particular substance B32B9/045; next to a bituminous or tarry layer B32B11/046; next to a water setting substance layer B32B13/12; next to a metal layer B32B15/08; next to a glass layer B32B17/10; next to a layer formed of natural mineral fibres or particles B32B19/045; next to a wood layer B32B21/08; next to a cellulosic plastic layer B32B23/08; next to a natural or synthetic rubber layer B32B25/08
• CPC Class Codes: B32B 27/281 comprising polyimides
• CPC Class Codes: B32B 27/34 comprising polyamides
• CPC Class Codes: B32B 3/08 characterised by added members at particular parts layer formed of separate pieces of material which are juxtaposed side-by-side B32B3/14, B32B3/18
• CPC Class Codes: B32B 38/0008 Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation heat treatment B32B38/0036
• CPC Class Codes: B32B 38/10 Removing layers, or parts of layers, mechanically or chemically
• CPC Class Codes: B32B 7/06 permitting easy separation
• CPC Class Codes: B32B 7/08 by mechanical means
• CPC Class Codes: G02F 1/1303 Apparatus specially adapted to the manufacture of LCDs
• CPC Class Codes: G02F 1/133305 Flexible substrates, e.g. plastics, organic film
• CPC Class Codes: G02F 1/133354 Arrangements for aligning or assembling substrates
• CPC Class Codes: G02F 1/133514 Colour filters
• CPC Class Codes: G02F 1/133528 Polarisers
• CPC Class Codes: G02F 1/1337 Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
• CPC Class Codes: G02F 1/13439 : characterised by their electrical, optical, physical properties; materials therefor; method of making
• CPC Class Codes: G02F 1/13613 : the semiconductor element being formed on a first substrate and thereafter transferred to the final cell substrate
• CPC Class Codes: G02F 1/1368 : in which the switching element is a three-electrode device G02F1/136277 takes precedence
• CPC Class Codes: G02F 2201/123 : pixel
• CPC Class Codes: H01L 27/1225 : with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
• CPC Class Codes: H01L 27/124 : with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits wiring structures per se H01L23/52
• CPC Class Codes: H01L 27/1266 : the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
• CPC Class Codes: H01L 29/7869 : having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate

Abstract

A method of producing a CF board and an array board includes: a separation film forming process for forming separation films on supporting substrates; a component support forming process for forming resin substrates on the separation films; a thin film component forming process for forming TFTs and color filters that are thin film components on the resin substrates; a light applying process for applying light to the separation films for accelerating removals of the resin substrates; a determining process for determining whether levels of adhesion between the separation films and the resin substrates are high or low based on image data obtained through capturing of images of the separation films, and a removing process for removing the resin substrates from the supporting substrates if the levels of adhesion are determined low in the determining process.

Claims

1. A method of producing a component board comprising:

a separation film forming process for forming a separation film on a supporting substrate;

a component support forming process for forming a component support for forming a component support on the separation film;

a thin film component forming process for forming a thin film component on the component support;

a light applying process for applying light to the separation film for accelerating a removal of the component support;

a determining process for determining whether a degree of adhesion between the separation film and the component support is high or low based on image data obtained through capturing of an image of the separation film; and

a removing process for removing the component support from the supporting substrate if the degree of adhesion is determined low in the determining process.

2. The method according to claim 1, wherein the determining process comprises:

image thresholding the image data;

extracting a highly attached portion having a high degree of adhesion; and

determining whether or not the degree of adhesion is high or low based on whether an occupancy rate of an area of the highly attached portion over an entire area of the separation film is higher than a threshold or the area of the highly attached portion is larger than a threshold.

3. The method according to claim 2, wherein the determining process comprises:

obtaining the image data through capturing of images of multiple in-plane portions of the separation film;

extracting the highly attached portion from the image data including the images; and

determining whether or not the degree of adhesion is high or low based on whether the occupancy rate of the highly attached portion is higher than the threshold or the area of the highly attached portion is larger than the threshold.

4. The method according to claim 2, wherein the determining process comprises determining whether or not the degree of adhesion is too low based on whether the occupancy rate of the highly attached portion is higher than a second threshold or the area of the highly attached portion is larger than a second threshold, the second thresholds being lower and smaller than the respective thresholds.

5. The method according to claim 1, wherein

the supporting substrate used for forming the separation film in the separation film forming process has light transmissivity, and

the light applying process comprises applying light to the separation film from a supporting substrate side.

6. The method according to claim 5, wherein the separation film forming process comprises forming the separation film using a refractory metal.

7. The method according to claim 6, wherein the separation film forming process comprises forming the separation film using molybdenum for the refractory metal and with a thickness equal to or larger than 150 nm.

8. The method according to claim 1, wherein the light applying process comprises applying laser beams as the light.