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Method of producing component board

  • US 10,115,747 B2
  • Filed: 12/25/2015
  • Issued: 10/30/2018
  • Est. Priority Date: 01/06/2015
  • Status: Active Grant
First Claim
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1. A method of producing a component board comprising:

  • a separation film forming process for forming a separation film on a supporting substrate;

    a component support forming process for forming a component support for forming a component support on the separation film;

    a thin film component forming process for forming a thin film component on the component support;

    a light applying process for applying light to the separation film for accelerating a removal of the component support;

    a determining process for determining whether a degree of adhesion between the separation film and the component support is high or low based on image data obtained through capturing of an image of the separation film; and

    a removing process for removing the component support from the supporting substrate if the degree of adhesion is determined low in the determining process.

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